$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Peeling apparatus and stack manufacturing apparatus 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-043/00
  • B32B-038/10
  • B32B-037/12
  • H01L-051/56
  • H01L-027/32
  • H01L-051/52
  • B32B-037/00
  • B32B-037/26
  • H01L-051/00
출원번호 US-0248579 (2016-08-26)
등록번호 US-9770894 (2017-09-26)
우선권정보 JP-2013-249751 (2013-12-03); JP-2014-159799 (2014-08-05)
발명자 / 주소
  • Ohno, Masakatsu
  • Adachi, Hiroki
  • Idojiri, Satoru
  • Takeshima, Koichi
출원인 / 주소
  • SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
대리인 / 주소
    Nixon Peabody LLP
인용정보 피인용 횟수 : 0  인용 특허 : 23

초록

The yield of a peeling process is improved. A peeling apparatus includes a structure body with a convex surface and a stage with a supporting surface which faces the convex surface. The structure body can hold a first member of a process member between the convex surface and the supporting surface.

대표청구항

1. A stack manufacturing apparatus comprising: a first supply unit configured to supply a process member comprising a first member and a second member;a separation unit configured to separate the first member from the second member; anda bonding unit configured to bond the first member and a support

이 특허에 인용된 특허 (23)

  1. Ahn, Kyung-Hyun; Park, Jin-Han; Kim, Dong-Sul; Lee, Byung-Chul, Delamination apparatus and inline thermal imaging system.
  2. Shimoda, Tatsuya; Inoue, Satoshi; Miyazawa, Wakao, Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device and liquid crystal display device produced by the same.
  3. Shimoda, Tatsuya; Inoue, Satoshi; Miyazawa, Wakao, Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same.
  4. Shimoda,Tatsuya; Inoue,Satoshi; Miyazawa,Wakao, Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same.
  5. Shimoda,Tatsuya; Inoue,Satoshi; Miyazawa,Wakao, Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same.
  6. Shimoda,Tatsuya; Inoue,Satoshi; Miyazawa,Wakao, Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same.
  7. Watanabe, Ryosuke; Takahashi, Hidekazu; Tsurume, Takuya, Laminating system.
  8. Watanabe, Ryosuke; Takahashi, Hidekazu; Tsurume, Takuya, Laminating system.
  9. Watanabe, Ryosuke; Takahashi, Hidekazu; Tsurume, Takuya; Arai, Yasuyuki; Watanabe, Yasuko; Higuchi, Miyuki, Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip.
  10. Inoue Satoshi,JPX ; Shimoda Tatsuya,JPX, Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device.
  11. Inoue, Satoshi; Shimoda, Tatsuya, Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device.
  12. Inoue,Satoshi; Shimoda,Tatsuya, Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device.
  13. Yamazaki,Shunpei; Takayama,Toru; Kanno,Yohei, Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device.
  14. Eguchi, Shingo; Monma, Yohei; Tani, Atsuhiro; Hirosue, Misako; Hashimoto, Kenichi; Hosaka, Yasuharu, Method for manufacturing semiconductor device.
  15. Eguchi, Shingo; Monma, Yohei; Tani, Atsuhiro; Hirosue, Misako; Hashimoto, Kenichi; Hosaka, Yasuharu, Method for manufacturing semiconductor device.
  16. Eguchi, Shingo; Monma, Yohei; Tani, Atsuhiro; Hirosue, Misako; Hashimoto, Kenichi; Hosaka, Yasuharu, Method for manufacturing semiconductor device.
  17. Mizutani Masaki,JPX ; Tanikawa Isao,JPX ; Nakagawa Katsumi,JPX ; Shoji Tatsumi,JPX ; Ukiyo Noritaka,JPX ; Iwasaki Yukiko,JPX, Method of producing semiconductor thin film and method of producing solar cell using same.
  18. Eguchi, Shingo; Monma, Yohei; Tani, Atsuhiro; Hirosue, Misako; Hashimoto, Kenichi; Hosaka, Yasuharu, Peeling apparatus and manufacturing apparatus of semiconductor device.
  19. Koyama, Jun; Dairiki, Koji; Okazaki, Susumu; Moriya, Yoshitaka; Yamazaki, Shunpei, Semiconductor device and method for manufacturing the same.
  20. Takayama, Toru; Maruyama, Junya; Mizukami, Mayumi; Yamazaki, Shunpei, Semiconductor device and peeling off method and method of manufacturing semiconductor device.
  21. Takayama, Toru; Maruyama, Junya; Mizukami, Mayumi; Yamazaki, Shunpei, Semiconductor device and peeling off method and method of manufacturing semiconductor device.
  22. Tatsuya Shimoda JP; Satoshi Inoue JP; Wakao Miyazawa JP, Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method.
  23. Stadtmueller Gary F., System and method for peeling a polarized film.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로