초록 ▼

An image sensor includes a semiconductor substrate having first and second faces. The sensor includes a plurality of pixel groups each including pixels, each pixel having a photoelectric converter and a wiring pattern, the converter including a region whose major carriers are the same with charges t

An image sensor includes a semiconductor substrate having first and second faces. The sensor includes a plurality of pixel groups each including pixels, each pixel having a photoelectric converter and a wiring pattern, the converter including a region whose major carriers are the same with charges to be accumulated in the photoelectric converter. The sensor also includes a microlenses which are located so that one microlens is arranged for each pixel group. The wiring patterns are located at a side of the first face, and the plurality of microlenses are located at a side of the second face. Light-incidence faces of the regions of the photoelectric converters of each pixel group are arranged along the second face such that the light-incidence faces are apart from each other in a direction along the second face.

대표청구항 ▼

1. A solid-state image sensor including a semiconductor substrate having a first face and a second face opposite to the first face, the solid-state image sensor comprising: a plurality of pixel groups each including first and second photoelectric converters located in the semiconductor substrate, a

1. A solid-state image sensor including a semiconductor substrate having a first face and a second face opposite to the first face, the solid-state image sensor comprising: a plurality of pixel groups each including first and second photoelectric converters located in the semiconductor substrate, a floating diffusion, a first transistor through which the first photoelectric converter is connected to the floating diffusion, a second transistor through which the second photoelectric converter is connected to the floating diffusion, and an amplifier transistor configured to output a signal according to a potential of the floating diffusion;a wiring layer located at a side of the first face of the semiconductor substrate;a plurality of microlenses located at a side of the second face of the semiconductor substrate, wherein each of the plurality of microlens is provided for the first and second photoelectric converters of a corresponding one of the plurality of pixel groups; anda plurality of color filters located between the plurality of microlenses and the semiconductor substrate, the plurality of color filters including plural color types having colors different from each other,wherein the plurality of color filters are arranged such that only one color type is provided for the first and second photoelectric converters of each of the plurality of pixel groups. 2. The solid-state image sensor according to claim 1, wherein each of the first and second photoelectric converters of each of the plurality of pixel groups includes a semiconductor region of a first conductivity type, which is configured to accumulate charges, and wherein a maximum value of an impurity concentration of a second conductivity type in a region between the semiconductor regions in each of the plurality of pixel groups is smaller than a maximum value of an impurity concentration of the second conductivity type in a region between two nearest semiconductor regions, of the semiconductor regions of the plurality of pixel groups, that belong to different pixel groups. 3. The solid-state image sensor according to claim 1, wherein each of the first and second photoelectric converters of each of the plurality of pixel groups includes a semiconductor region configured to accumulate charges, and wherein a minimum distance between the semiconductor regions in each of the plurality of pixel groups is smaller than a minimum distance between two nearest semiconductor regions, of the semiconductor regions of the plurality of pixel groups, that belong to different pixel groups. 4. The solid-state image sensor according to claim 1, wherein the plurality of color filters are arranged such that each of the plurality of color filters is provided in common for the first and second photoelectric converters of a corresponding one of the plurality of pixel groups. 5. The solid-state image sensor according to claim 1, wherein a dimension of each of the first and second photoelectric converters, in a plane parallel to the first face, at a side of the second face is larger than a dimension of each of the first and second photoelectric converters, in a plane parallel to the first face, at a side of the first face. 6. The solid-state image sensor according to claim 5, wherein the first photoelectric converter includes a portion arranged, in a direction perpendicular to the first face, between a gate of the first transistor and the second face, and the second photoelectric converter includes a portion arranged, in a direction perpendicular to the first face, between a gate of the second transistor and the second face. 7. The solid-state image sensor according to claim 5, wherein each of the first and second photoelectric converters includes first and second semiconductor regions of a first conductivity type, a maximum value of an impurity concentration of the first semiconductor region is higher than a maximum value of an impurity concentration of the second semiconductor region, and the second semiconductor region is arranged between the first semiconductor region and the second face, the second semiconductor region of the first photoelectric converter includes a portion arranged, in a direction perpendicular to the first face, between a gate of the first transistor and the second face,the second semiconductor region of the second photoelectric converter includes a portion arranged, in a direction perpendicular to the first face, between a gate of the second transistor and the second face. 8. A solid-state image sensor including a semiconductor substrate having a first face and a second face opposite to the first face, the solid-state image sensor comprising: a plurality of pixel groups each including first and second photoelectric converters located in the semiconductor substrate, and a floating diffusion provided for the first and second photoelectric converters in common, the floating diffusion being located between the first photoelectric converter and the second photoelectric converter;a wiring layer located at a side of the first face of the semiconductor substrate;a plurality of microlenses located at a side of the second face of the semiconductor substrate, wherein each of the plurality of microlenses is provided for the first and second photoelectric converters of a corresponding one of the plurality of pixel groups; anda plurality of color filters located between the plurality of microlenses and the semiconductor substrate, the plurality of color filters including plural color types having colors different from each other,wherein the plurality of color filters are arranged such that each of the plurality of color filters is provided in common for the first and second photoelectric converters of a corresponding one of the plurality of pixel groups. 9. The solid-state image sensor according to claim 8, wherein each of the first and second photoelectric converters of each of the plurality of pixel groups includes a semiconductor region configured to accumulate charges, and wherein a minimum distance between the semiconductor regions in each of the plurality of pixel groups is smaller than a minimum distance between two nearest semiconductor regions, of the semiconductor regions of the plurality of pixel groups, that belong to different pixel groups. 10. The solid-state image sensor according to claim 8, wherein the first photoelectric converter receives a light passing through a first region of a pupil of an image sensing lens, and the second photoelectric converter receives a light passing through a second region of the pupil of the image sensing lens. 11. The solid-state image sensor according to claim 8, wherein the plurality of color filters are arranged such that only one color type is provided for the first and second photoelectric converters of each of the plurality of pixel groups. 12. A solid-state image sensor including a semiconductor substrate having a first face and a second face opposite to the first face, the solid-state image sensor comprising: a pixel group including first and second photoelectric converters located in the semiconductor substrate;a wiring layer located at a side of the first face of the semiconductor substrate; anda microlens located at a side of the second face of the semiconductor substrate, wherein the microlens is provided for the first and second photoelectric converters of the pixel group,wherein the pixel group further includes a first floating diffusion, a second floating diffusion, a first transistor configured to transfer charges from the first photoelectric converter to the first floating diffusion, and a second transistor configured to transfer charges from the second photoelectric converter to the second floating diffusion, andwherein the first floating diffusion is located between the first photoelectric converter and the second photoelectric converter, the second photoelectric converter is located between the first floating diffusion and the second floating diffusion. 13. The solid-state image sensor according to claim 12, wherein the pixel group includes a plurality of sets each including the first and second photoelectric converters, the first and second floating diffusions, and the first and second transistors. 14. The solid-state image sensor according to claim 12, wherein the solid-state image sensor comprises a plurality of pixel groups one of which includes the pixel group, and a plurality of microlenses one of which includes the plurality of microlens, the plurality of microlenses being located so that each of the plurality of microlenses is provided for a corresponding one of the plurality of pixel groups, wherein the solid-state image sensor further comprises a plurality of color filters located between the plurality of microlenses and the semiconductor substrate, the plurality of color filters including a plurality of color types having colors different from each other. 15. A solid-state image sensor including a semiconductor substrate having a first face and a second face opposite to the first face, the solid-state image sensor comprising: a pixel group including first and second photoelectric converters located in the semiconductor substrate;a wiring layer located at a side of the first face of the semiconductor substrate; anda microlens located at a side of the second face of the semiconductor substrate, wherein the microlens is provided for the first and second photoelectric converters of the pixel group,wherein the pixel group further includes a first floating diffusion, a second floating diffusion, a first transistor configured to transfer charges from the first photoelectric converter to the first floating diffusion, and a second transistor configured to transfer charges from the second photoelectric converter to the second floating diffusion, andwherein both of the first and second photoelectric converters are located between the first floating diffusion and the second floating diffusion. 16. The solid-state image sensor according to claim 15, wherein the solid-state image sensor comprises a plurality of pixel groups one of which includes the pixel group, and a plurality of microlenses one of which includes the microlens, the plurality of microlenses being located so that each of the plurality of microlenses is provided for a corresponding one of the plurality of pixel groups, wherein the solid-state image sensor further comprises a plurality of color filters located between the microlenses and the semiconductor substrate, the plurality of color filters including a plurality of color types having colors different from each other. 17. A camera comprising a solid-state image sensor, and a processing unit that processes a signal output from the solid-state image sensor, wherein the solid-state image sensor includes a semiconductor substrate having a first face and a second face opposite to the first face, and comprises: a plurality of pixel groups each including first and second photoelectric converters located in the semiconductor substrate, a floating diffusion, a first transistor through which the first photoelectric converter is connected to the floating diffusion, a second transistor through which the second photoelectric converter is connected to the floating diffusion, and an amplifier transistor configured to output a signal according to a potential of the floating diffusion;a wiring layer located at a side of the first face of the semiconductor substrate;a plurality of microlenses located at a side of the second face of the semiconductor substrate, wherein each of the plurality of microlens is provided for the first and second photoelectric converters of a corresponding one of the plurality of pixel groups; anda plurality of color filters located between the plurality of microlenses and the semiconductor substrate, the plurality of color filters including plural color types having colors different from each other,wherein the plurality of color filters are arranged such that only one color type is provided for the first and second photoelectric converters of each of the plurality of pixel groups. 18. A camera comprising a solid-state image sensor, and a processing unit that processes a signal output from the solid-state image sensor, wherein the solid-state image sensor includes a semiconductor substrate having a first face and a second face opposite to the first face, and comprises: a plurality of pixel groups each including first and second photoelectric converters located in the semiconductor substrate, and a floating diffusion provided for the first and second photoelectric converters in common, the floating diffusion being located between the first photoelectric converter and the second photoelectric converter;a wiring layer located at a side of the first face of the semiconductor substrate;a plurality of microlenses located at a side of the second face of the semiconductor substrate, wherein each of the plurality of microlenses is provided for the first and second photoelectric converters of a corresponding one of the plurality of pixel groups; anda plurality of color filters located between the plurality of microlenses and the semiconductor substrate, the plurality of color filters including plural color types having colors different from each other,wherein the plurality of color filters are arranged such that each of the plurality of color filters is provided in common for the first and second photoelectric converters of a corresponding one of the plurality of pixel groups. 19. A camera comprising a solid-state image sensor, and a processing unit that processes a signal output from the solid-state image sensor, wherein the solid-state image sensor includes a semiconductor substrate having a first face and a second face opposite to the first face, and comprises: a pixel group including first and second photoelectric converters located in the semiconductor substrate;a wiring layer located at a side of the first face of the semiconductor substrate; anda microlens located at a side of the second face of the semiconductor substrate, wherein the microlens is provided for the first and second photoelectric converters of the pixel group,wherein the pixel group further includes a first floating diffusion, a second floating diffusion, a first transistor configured to transfer charges from the first photoelectric converter to the first floating diffusion, and a second transistor configured to transfer charges from the second photoelectric converter to the second floating diffusion, andwherein the first floating diffusion is located between the first photoelectric converter and the second photoelectric converter, the second photoelectric converter is located between the first floating diffusion and the second floating diffusion. 20. A camera comprising a solid-state image sensor, and a processing unit that processes a signal output from the solid-state image sensor, wherein the solid-state image sensor includes a semiconductor substrate having a first face and a second face opposite to the first face, and comprises: a pixel group including first and second photoelectric converters located in the semiconductor substrate;a wiring layer located at a side of the first face of the semiconductor substrate; anda microlens located at a side of the second face of the semiconductor substrate, wherein the microlens is provided for the first and second photoelectric converters of the pixel group,wherein the pixel group further includes a first floating diffusion, a second floating diffusion, a first transistor configured to transfer charges from the first photoelectric converter to the first floating diffusion, and a second transistor configured to transfer charges from the second photoelectric converter to the second floating diffusion, andwherein both of the first and second photoelectric converters are located between the first floating diffusion and the second floating diffusion. 21. A solid-state image sensor including a semiconductor substrate having a first face and a second face opposite to the first face, the solid-state image sensor comprising: a plurality of pixel groups each including first and second photoelectric converters located in the semiconductor substrate, a floating diffusion, a first transistor through which the first photoelectric converter is connected to the floating diffusion, a second transistor through which the second photoelectric converter is connected to the floating diffusion, and an amplifier transistor configured to output a signal according to a potential of the floating diffusion;a wiring layer located at a side of the first face of the semiconductor substrate;a plurality of microlenses located at a side of the second face of the semiconductor substrate, wherein each of the plurality of microlens is provided for the first and second photoelectric converters of a corresponding one of the plurality of pixel groups; anda plurality of color filters located between the plurality of microlenses and the semiconductor substrate,wherein the plurality of color filters are arranged such that a color of a color filter, of the plurality of color filters, arranged between the first photoelectric converter of one of the plurality of pixel groups and one of the plurality of microlenses, and a color of a color filter, of the plurality of color filters, arranged between the corresponding second photoelectric converter and the one microlens, are the same color.