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A chip slapper is presented, having a substrate, a conductive layer disposed above the substrate face, and an intermediate layer disposed between the substrate face and the conductive layer. The conductive layer and intermediate layer form a first land and a second land atop the substrate face, with

A chip slapper is presented, having a substrate, a conductive layer disposed above the substrate face, and an intermediate layer disposed between the substrate face and the conductive layer. The conductive layer and intermediate layer form a first land and a second land atop the substrate face, with a bridge formed of the intermediate layer spanning between the first land and the second land. A first adhesion portion is attached to the first land, and a second adhesion portion is attached to the second land, wherein at least a portion of the bridge is not overlaid by the first adhesion portion or the second adhesion portion.

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1. A chip slapper, comprising: a substrate comprising a back and a face substantially opposite the back;a conductive layer disposed above the substrate face;an intermediate layer disposed between the substrate face and the conductive layer;a first land comprising the intermediate layer, and the cond

1. A chip slapper, comprising: a substrate comprising a back and a face substantially opposite the back;a conductive layer disposed above the substrate face;an intermediate layer disposed between the substrate face and the conductive layer;a first land comprising the intermediate layer, and the conductive layer, a first edge adjacent to a first region of the substrate that is covered by neither the intermediate layer nor the conductive layer, and a second edge adjacent to a second region of the substrate that is covered by neither the intermediate layer nor the conductive layer;a second land comprising the intermediate layer and the conductive layer, a first edge adjacent to the first region of substrate, and a second edge adjacent to the second region of substrate;a bridge disposed between the first land and the second land comprising the intermediate layer and omitting the conductive layer, a first edge adjacent to the first region of substrate, and a second edge adjacent to the second region of substrate;a first adhesion portion disposed over the first land and spanning between the first region of substrate and the second region of substrate; anda second adhesion portion disposed over the second land spanning between the first region of substrate and the second region of substrate,wherein at least a portion of the bridge spanning the first edge and the second edge is not overlaid by the first adhesion portion or the second adhesion portion. 2. The chip slapper of claim 1, further comprising a flyer layer adhered to the first adhesion portion and the second adhesion portion, disposed above the bridge relative to the substrate face, wherein the flyer layer spans the first land and the second land. 3. The chip slapper of claim 1, wherein the first adhesion portion and/or the second adhesion portion overlays a portion of the bridge. 4. The chip slapper of claim 1, wherein the intermediate layer comprises copper. 5. The chip slapper of claim 1, wherein the conductive layer comprises gold. 6. The chip slapper of claim 1, wherein the substrate comprises a ceramic material. 7. The chip slapper of claim 1, wherein the flyer layer comprises a polyimide material. 8. The chip slapper of claim 1, wherein the first and/or second adhesion portion comprises a metal oxide. 9. The chip slapper of claim 1, wherein the first and/or second adhesion portion comprises an electrical conductor. 10. The chip slapper of claim 1, wherein the first edges of the first land, the bridge, and the second land are substantially contiguous, and the second edges of the first land, the bridge, and the second land are substantially contiguous. 11. The chip slapper of claim 1, wherein the first adhesion portion and/or the second adhesion portion overlay a portion of the first substrate region and/or the second substrate region. 12. The chip dapper of claim 11, wherein the first adhesion portion and the second adhesion portion are substantially contiguous. 13. The chip slapper of claim 12, wherein the first adhesion portion and/or the second adhesion portion are formed of a non-conductive material. 14. The chip slapper of claim 1, further comprising a buffer layer disposed between the intermediate layer and the conductive layer. 15. A chip slapper, comprising: a substrate comprising a back and a face substantially opposite the back;a conductive layer disposed above the substrate face;an intermediate layer disposed between the substrate face and the conductive layer;a first land comprising the intermediate layer, and the conductive layer, a first edge adjacent to a first region of the substrate that is covered by neither the intermediate layer nor the conductive layer, and a second edge adjacent to a second region of the substrate that is covered by neither the intermediate layer nor the conductive layer;a second land comprising the intermediate layer and the conductive layer, a first edge adjacent to the first region of substrate, and a second edge adjacent to the second region of substrate;a bridge disposed between the first land and the second land comprising the intermediate layer and omitting the conductive layer, a first edge adjacent to the first region of substrate, and a second edge adjacent to the second region of substrate;a first adhesion portion disposed over a first portion of a material forming an upper surface of the bridge adjacent to the first land and spanning between the first region of substrate and the second region of substrate;a second adhesion portion disposed over a second portion of a material forming an upper surface of the bridge adjacent to the second land and spanning between the first region of substrate and the second region of substrate; anda flyer layer adhered to the first adhesion portion and the second adhesion portion, disposed above the bridge relative to the substrate face, wherein the flyer layer spans the first land and the second land. 16. The chip slapper of claim 15, wherein at least a portion of the bridge spanning the first edge and the second edge is not overlaid by the first adhesion portion or the second adhesion portion. 17. A chip slapper, comprising: a substrate comprising a back and a face substantially opposite the back;a conductive layer disposed above the substrate face;an intermediate layer disposed between the substrate face and the conductive layer;a first land comprising the intermediate layer, and the conductive layer, a first edge adjacent to a first region of the substrate that is covered by neither the intermediate layer nor the conductive layer, and a second edge adjacent to a second region of the substrate that is covered by neither the intermediate layer nor the conductive layer;a second land comprising the intermediate layer and the conductive layer, a first edge adjacent to the first region of substrate, and a second edge adjacent to the second region of substrate;a bridge disposed between the first land and the second land comprising the intermediate layer and omitting the conductive layer, a first edge adjacent to the first region of substrate, and a second edge adjacent to the second region of substrate;a first adhesion portion disposed over the first land and spanning between the first region of substrate and the second region of substrate;a second adhesion portion disposed over the second land spanning between the first region of substrate and the second region of substrate; anda flyer layer adhered to the first adhesion portion and the second adhesion portion, disposed above the bridge relative to the substrate face, wherein the flyer layer spans the first land and the second land. 18. The chip slapper of claim 17, wherein the first adhesion portion and/or the second adhesion portion overlays a portion of the bridge. 19. The chip slapper of claim 17, wherein the intermediate layer comprises copper. 20. The chip slapper of claim 17, wherein the conductive layer comprises gold. 21. The chip slapper of claim 17, wherein the substrate comprises a ceramic material. 22. The chip slapper of claim 17, wherein the flyer layer comprises a polyimide material. 23. The chip slapper of claim 17, wherein the first and/or second adhesion portion comprises a metal oxide. 24. The chip slapper of claim 17, wherein the first and/or second adhesion portion comprises an electrical conductor. 25. The chip slapper of claim 17, wherein the first edges of the first land, the bridge, and the second land are substantially contiguous, and the second edges of the first land, the bridge, and the second land are substantially contiguous. 26. The chip slapper of claim 17, wherein the first adhesion portion and/or the second adhesion portion overlay a portion of the first substrate region and/or the second substrate region. 27. The chip slapper of claim 26, wherein the first adhesion portion and the second adhesion portion are substantially contiguous. 28. The chip slapper of claim 27, wherein the first adhesion portion and/or the second adhesion portion are formed of a non-conductive material. 29. The chip slapper of claim 17, further comprising a buffer layer disposed between the intermediate layer and the conductive layer.