[특허]Method for manufacturing semiconductor device

Method for manufacturing semiconductor device 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-021/683 H01L-027/12 H01L-027/15 H01L-033/62 G02F-001/1333 G02F-001/1335 H01L-033/00 H01L-051/00
출원번호	US-0254623 (2016-09-01)
등록번호	US-9793150 (2017-10-17)
우선권정보	JP-2006-058513 (2006-03-03)
발명자 / 주소	Jinbo, Yasuhiro Morisue, Masafumi Kimura, Hajime Yamazaki, Shunpei
출원인 / 주소	Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소	Robinson Intellectual Property Law Office
인용정보	피인용 횟수 : 0 인용 특허 : 37

초록 ▼

The present invention provides a manufacturing technique of a semiconductor device and a display device using a peeling process, in which a transfer process can be conducted with a good state in which a shape and property of an element before peeling are kept. Further, the present invention provides a manufacturing technique of more highly reliable semiconductor devices and display devices with high yield without complicating the apparatus and the process for manufacturing. According to the present invention, an organic compound layer including a photocatalyst substance is formed over a first substrate having a light-transmitting property, an element layer is formed over the organic compound layer including a photocatalyst substance, the organic compound layer including a photocatalyst substance is irradiated with light which has passed through the first substrate, and the element layer is peeled from the first substrate.

대표청구항 ▼

1. A flexible electronic device comprising: a flexible substrate;an electrode layer formed on the flexible substrate;a first light-emitting diode and a second light-emitting diode each affixed to the flexible substrate and electrically connected to the electrode layer; anda first resin layer and a second resin layer covering top and side portions of the first light-emitting diode and of the second light-emitting diode, respectively,wherein an interval between the first light-emitting diode and the second light-emitting diode is larger than a sum of a maximum thickness of the first resin layer and a maximum thickness of the second resin layer. 2. The flexible electronic device according to claim 1, wherein the flexible electronic device can be bent so that a top surface of the first light-emitting diode faces a top surface of the second light-emitting diode. 3. The flexible electronic device according to claim 1, wherein the first light-emitting diode and the second light-emitting diode are connected in parallel between the electrode layer and another conductor. 4. A lighting device comprising the flexible electronic device according to claim 1. 5. A flexible electronic device comprising: a flexible substrate;an electrode layer formed on the flexible substrate;a first light-emitting diode and a second light-emitting diode each affixed to the flexible substrate and electrically connected to the electrode layer and each having a rectangular shape when viewed in a top view; anda first resin layer and a second resin layer covering top and side portions of the first light-emitting diode and of the second light-emitting diode, respectively,wherein an interval between the first light-emitting diode and the second light-emitting diode is larger than a sum of a maximum thickness of the first resin layer and a maximum thickness of the second resin layer, andwherein the flexible electronic device can be bent so that, when a side of the flexible substrate is bent, a short side of the first light-emitting diode and a short side of the second light-emitting diode are parallel to the side of the flexible substrate. 6. The flexible electronic device according to claim 5, wherein the short sides of the first light-emitting diode and of the second light-emitting diode are parallel to a side of the flexible substrate whose frequency of being bent is high. 7. The flexible electronic device according to claim 5, wherein the first light-emitting diode and the second light-emitting diode are two consecutive light-emitting diodes in a line comprising a plurality of diodes, andwherein the interval between the first light-emitting diode and the second light-emitting diode is larger than a sum of a thickness of the first light-emitting diode and a thickness of the second light-emitting diode. 8. The flexible electronic device according to claim 5, wherein the flexible electronic device can be bent so that a top surface of the first light-emitting diode faces a top surface of the second light-emitting diode. 9. The flexible electronic device according to claim 5, wherein the first light-emitting diode and the second light-emitting diode are connected in parallel between the electrode layer and another conductor. 10. A lighting device comprising the flexible electronic device according to claim 5. 11. A flexible electronic device comprising: a flexible substrate;an electrode layer formed on the flexible substrate;a first light-emitting diode and a second light-emitting diode each affixed to the flexible substrate and electrically connected to the electrode layer; anda first resin layer and a second resin layer covering top and side portions of the first light-emitting diode and of the second light-emitting diode, respectively,wherein the first light-emitting diode and the second light-emitting diode are two consecutive diodes in a line comprising a plurality of light-emitting diodes,wherein an interval between the first light-emitting diode and the second light-emitting diode is larger than a sum of a thickness of the first light-emitting diode and a thickness of the second light-emitting diode, andwherein the interval between the first light-emitting diode and the second light-emitting diode is larger than a sum of a maximum thickness of the first resin layer and a maximum thickness of the second resin layer. 12. The flexible electronic device according to claim 11, wherein the flexible electronic device can be bent so that a top surface of the first light-emitting diode faces a top surface of the second light-emitting diode. 13. The flexible electronic device according to claim 11, wherein the first light-emitting diode and the second light-emitting diode are connected in parallel between the electrode layer and another conductor. 14. A lighting device comprising the flexible electronic device according to claim 11.

이 특허에 인용된 특허 (37)

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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Method for manufacturing semiconductor device 원문보기

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