Method for carrying out a heat transfer between alternately working adsorbers and device
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F25B-017/00
F25B-015/00
F25B-017/08
출원번호
US-0737148
(2009-06-16)
등록번호
US-9797629
(2017-10-24)
우선권정보
DE-10 2008 029 126 (2008-06-19)
국제출원번호
PCT/EP2009/057405
(2009-06-16)
§371/§102 date
20110301
(20110301)
국제공개번호
WO2009/153245
(2009-12-23)
발명자
/ 주소
Mittelbach, Walter
출원인 / 주소
Fahrenheit AG
대리인 / 주소
Bodner & O'Rourke, LLP
인용정보
피인용 횟수 :
0인용 특허 :
5
초록▼
The invention relates to a method for carrying out a heat transfer between alternately working adsorbers (Ad1, Ad2) in an adsorption refrigeration installation comprising an external cooling circuit (Kw) and an external heating circuit (Hw). The method is characterized by a closed heat transfer circ
The invention relates to a method for carrying out a heat transfer between alternately working adsorbers (Ad1, Ad2) in an adsorption refrigeration installation comprising an external cooling circuit (Kw) and an external heating circuit (Hw). The method is characterized by a closed heat transfer circuit, connected between the first and the second adsorber, comprising a heat transfer medium (Wm) circulating therein, a heat transfer with the external cooling circuit (Kw) being carried out in the heat transfer circuit via a first heat contact and a heat transfer with the external heating circuit (Hw) being carried out via a second heat contact.
대표청구항▼
1. Method for carrying out a heat transfer between alternately working adsorbers in an adsorption refrigeration system, comprising an external cooling circuit (Kw) and an external heating circuit (Hw), characterized bya closed heat transfer circuit connected between a first and second adsorber, comp
1. Method for carrying out a heat transfer between alternately working adsorbers in an adsorption refrigeration system, comprising an external cooling circuit (Kw) and an external heating circuit (Hw), characterized bya closed heat transfer circuit connected between a first and second adsorber, comprising a heat transfer medium (Wm) circulating therein, the heat transfer medium (Wm) not being used as a working medium in the working adsorbers, wherein the closed heat transfer circuit is configurable to directly and exclusively connect the first adsorber and the second adsorber, wherein a heat transfer between the heat transfer medium (Wm) and the external cooling circuit (Kw) is carried out in the heat transfer circuit via a first heat contact situated outside of the alternately working adsorbers and a heat transfer between the heat transfer medium (Wm) and the external heating circuit (Hw) is carried out via a second heat contact situated outside of the alternately working adsorbers, wherein the external cooling circuit (Kw) and the external heating circuit (Hw) are situated outside of the alternately working adsorb ers, wherein the external heating circuit (Hw) indirectly heats at least one of the first adsorber and the second adsorber by thermally contacting and heating the heat transfer medium (Wm) in the second heat contact and the external cooling circuit (Kw) indirectly cools at least one of the first adsorber and the second adsorber thermally contacting and cooling the heat transfer medium (Wm) in the first heat contact such that the external heating circuit (Hw) is not directly fluidly coupled to the heat transfer circuit, and such that the external cooling circuit (Kw) is not directly fluidly coupled to the heat transfer circuit, wherein the heat transfer medium (Wm) enters at least one of the first adsorber and the second adsorber and exits at least one of the first adsorber and the second adsorber, wherein the circulation of the heat transfer medium (Wm) causes the working medium in the adsorbers to be at least one of adsorbed and desorbed, wherein the heat transfer circuit carries out the following sub-steps in a cyclic process: first sub-step: heating the heat transfer medium (Wm) in the second heat contact and entry of the heat transfer medium into the first adsorber (Ad1), simultaneously exit of the heat transfer medium (Wm) from the second adsorber (Ad2) and cooling the heat transfer medium in the first heat contact,second sub-step: transfer of the heat transfer medium (Wm) between the first adsorber (Ad1) and the second adsorber (Ad2), while simultaneously transferring the heat transfer medium (Wm) from the first heat contact into the second heat contact, third sub-step: heating the heat transfer medium (Wm) in the second heat contact and entry of the heat transfer medium into the second adsorber (Ad2), simultaneously exit of the heat transfer medium (Wm) from the first adsorber (Ad1) and cooling the heat transfer medium in the first heat contact,fourth sub-step: transfer of the heat transfer medium (Wm) between the second adsorber (Ad2) and the first adsorber (Ad1), simultaneously transfer of the heat transfer medium (Wm) from the first heat contact into the second heat contact;wherein the closed heat transfer circuit is formed by a heat pipe arrangement;wherein the second heat contact is an evaporator (Vd) and the first heat contact is a condenser (Kd), wherein an evaporation of the heat transfer medium (Wm) takes place in the evaporator (Vd) and a condensation of the heat transfer medium (Wm) takes place in the condenser; andwherein the heat transfer between the heat transfer medium and the cooling circuit in the condenser (Kd), the heating circuit in the evaporator (Vd) and in the adsorbers Ad1 and Ad2 is associated with a phase transition. 2. Method according to claim 1, characterized in thatduring the first and third sub-step, when the heat transfer medium enters the second adsorber (Ad2) and the first adsorber (Ad1), respectively, the heat transfer medium condenses, and that during the second and fourth sub-step, when the heat transfer medium is transferred between the first adsorber (Ad1) and the second adsorber (Ad2), the heat transfer medium partially evaporates in one of the two adsorbers, while it condenses in the other adsorber. 3. Method according to claim 1, characterized in thatthe heat transfer medium (Wm) condensed in the condenser (Kd) is collected in a condensate container (Kb) interposed between the condenser and the evaporator. 4. Method according to claim 1, characterized in thatthe liquid heat transfer medium (Wm) is collected in the condensate container (Kb) under the influence of gravity. 5. Method according to claim 1, characterized in thatin one embodiment the first adsorber (Ad1) is replaced by a first heat exchanger (WT1) and the second adsorber (Ad2) is replaced by a second heat exchanger (WT2), wherein an alternate evaporation of a refrigerant of the adsorption refrigeration system takes place in the first and second heat exchanger, with the heating circuit (Hw) being replaced by the cooling circuit (Kw). 6. Method according to claim 1, characterized in thatduring the first and third sub-step, when the heat transfer medium enters the second adsorber (Ad2) and the first adsorber (Ad1), respectively, the heat transfer medium condenses, and that during the second and fourth sub-step, when the heat transfer medium is transferred between the first adsorber (Ad1) and the second adsorber (Ad2), the heat transfer medium partially evaporates in one of the two adsorbers, while it condenses in the other adsorber. 7. Method according to claim 6, characterized in thatthe heat transfer medium (Wm) condensed in the condenser (Kd) is collected in a condensate container (Kb) interposed between the condenser and the evaporator.
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이 특허에 인용된 특허 (5)
Kakiuchi,Hiroyuki; Takewaki,Takahiko; Fujii,Masaru; Yamazaki,Masanori; Takumi,Hideaki; Watanabe,Hiromu; Inagaki,Kouji; Kosaka,Atsushi; Inoue,Seiji; Inoue,Satoshi, Adsorption heat pump and use of adsorbent as adsorbent for adsorption heat pump.
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