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Cooling assemblies having porous three dimensional surfaces

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-013/18
  • F28F-021/08
  • F28F-001/12
  • H01L-023/373
  • H01L-023/473
  • H01L-021/48
  • F28F-013/00
출원번호 US-0935800 (2013-07-05)
등록번호 US-9803938 (2017-10-31)
발명자 / 주소
  • Joshi, Shailesh N.
출원인 / 주소
  • Toyota Motor Engineering & Manufacturing North America, Inc.
대리인 / 주소
    Dinsmore & Shohl LLP
인용정보 피인용 횟수 : 0  인용 특허 : 40

초록

Cooling assemblies including a porous three dimensional surface such as a heat sink are disclosed. In one embodiment, a cooling assembly includes a heat transfer substrate having a surface, a thermally conductive fin extending from the surface, a metal mesh bonded to a surface of the thermally condu

대표청구항

1. A cooling assembly comprising: a heat transfer substrate having a surface;a thermally conductive fin comprising one or more surfaces, the thermally conductive fin extending from the surface of the heat transfer substrate;a metal mesh that is diffusion bonded to each of the one or more surfaces of

이 특허에 인용된 특허 (40)

  1. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method with forced coolant vapor movement for facilitating two-phase cooling of an electronic device.
  2. Bayerer, Reinhold; Licht, Thomas, Arrangement for cooling a power semiconductor module.
  3. Robinson, Stanley, Carbon-based apparatus for cooling of electronic devices.
  4. Upadhya,Girish; Herms,Richard; Zhou,Peng; Goodson,Kenneth, Channeled flat plate fin heat exchange system, device and method.
  5. Azar Kaveh (Westwood MA), Circuit pack with inboard jet cooling.
  6. Tilton, Charles L.; Tilton, Donald E.; Weir, Thomas D.; Schwarzkopf, John D., Combination spray and cold plate thermal management system.
  7. Dessiatoun, Serguei V., Compact heat exchanging device based on microfabricated heat transfer surfaces.
  8. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser block structures with cavities facilitating vapor condensation cooling of coolant.
  9. Tsai,Ming Kun, Cooler.
  10. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways.
  11. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold.
  12. Hiroshi Tanaka JP; Tadayoshi Terao JP; Eitaro Tanaka JP; Takahide Ohara JP; Kiyoshi Kawaguchi JP, Cooling device boiling and condensing refrigerant.
  13. Wadell, Robert, Creating a jet impingement pattern for a thermal control system.
  14. Toy,Ben K., Diamond foam spray cooling system.
  15. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Direct jet impingement-assisted thermosyphon cooling apparatus and method.
  16. Tilton, Charles L.; Tilton, Donald E., Etched open microchannel spray cooling.
  17. Tilton Charles L ; Weiler Jeffery K ; Tilton Donald E, Fluid control apparatus and method for spray cooling.
  18. Harvey, Thomas E., Heat exchanger and method for use in precision cooling systems.
  19. Dede, Ercan Mehmet; Liu, Yan, Heat exchanger fluid distribution manifolds and power electronics modules incorporating the same.
  20. Grossman Arthur (Framingham MA), Heat exchanger system.
  21. Su, Cherng-Yuh; Lee, Kuo-Ying; Liin, Chien-Hung, Heat spreader with composite micro-structure.
  22. Ozmat Burhan (Dallas TX), Heat transfer module for ultra high density and silicon on silicon packaging applications.
  23. Rivas, Rio; White, Lawrence H.; Friesen, Ed; Rausch, John B., High resolution inkjet printer.
  24. Yassour, Yuval; Richman, Hilel; Levin, Daniel, High-Performance non-contact support platforms.
  25. Ghosh, Debashis; Bhatti, Mohinder Singh, Impingement cooled heat sink with low pressure drop.
  26. Tilton,Charles L.; Tilton,Donald E.; Weiler,Jeffrey K., Integrated circuit heat dissipation system.
  27. Upadhya,Girish; Kenny,Thomas W.; Zhou,Peng; Munch,Mark; Shook,James Gill; Goodson,Kenneth; Corbin,David, Interwoven manifolds for pressure drop reduction in microchannel heat exchangers.
  28. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus.
  29. Rini, Daniel P.; Anderson, H. Randolph; Kapat, Jayanta Sankar; Chow, Louis; Carman, Bradley G.; Saarloos, Benjamin A., Method and apparatus for high heat flux heat transfer.
  30. Gregory S. Cole ; Robert P. Scaringe, Method and two-phase spray cooling apparatus.
  31. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
  32. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled.
  33. Bang,Christopher A., Methods of and apparatus for molding structures using sacrificial metal patterns.
  34. Bezama, Raschid J.; Natarajan, Govindarajan; Sikka, Kamal K.; Toy, Hilton T., Microjet module assembly.
  35. Huang, Bin; Teeple, John C.; Drake, Reginald A.; Janes, Peter, Motor drive with heat pipe air cooling.
  36. Thayer,John G.; Wert,Kevin L.; North,Mark T.; Schaeffer,C. Scott, Porous media cold plate.
  37. Dede, Ercan Mehmet, Power electronics modules and power electronics module assemblies.
  38. Kumar, Mukesh; Fleming, James B., Reinforced medical implants.
  39. Glezer Ari ; Allen Mark G., Synthetic jet actuators for cooling heated bodies and environments.
  40. Cho, Hye-jung; Luo, Xiao-bing, Valveless micro air delivery device.
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