Temperature sensor and thermal, flow measuring device
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G01K-007/16
G01F-001/684
G01F-001/69
G01K-007/18
G01F-001/692
G01F-015/14
G01K-001/08
G01F-001/696
G01D-011/24
출원번호
US-0436933
(2013-09-23)
등록번호
US-9810586
(2017-11-07)
우선권정보
DE-20 2012 104 039 U (2012-10-19); DE-20 2013 103 404 U (2013-07-29)
국제출원번호
PCT/EP2013/069680
(2013-09-23)
국제공개번호
WO2014/060186
(2014-04-24)
발명자
/ 주소
Grun, Alexander
Schultheis, Hanno
Baur, Tobias
출원인 / 주소
Endres + Hauser Flowtec AG
대리인 / 주소
Bacon & Thomas, PLLC
인용정보
피인용 횟수 :
0인용 특허 :
10
초록▼
A temperature sensor comprising a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are especially embodied as thin-film resistance thermometers, one of the temperature sensor elements is heatable, and from ea
A temperature sensor comprising a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are especially embodied as thin-film resistance thermometers, one of the temperature sensor elements is heatable, and from each temperature sensor element at least one connection wire leads away, which is connected with a circuit board. The circuit board is arranged in the housing chamber. The circuit board is positioned in the housing chamber by a snap-in connection. A connection wire of a first temperature sensor element is led with strain relief in a first direction through the circuit board and connected with such. The housing chamber contains at least a first elastic body. The circuit board has a first number of cavities, for connection of connection wires and/or cables and a second number of cavities, for reducing thermal expansion of the circuit board. Also presented is a thermal, flow measuring device.
대표청구항▼
1. A temperature sensor, comprising: a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are especially embodied as thin-film resistance thermometers; anda circuit board, wherein:one of said temperature sensor
1. A temperature sensor, comprising: a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are especially embodied as thin-film resistance thermometers; anda circuit board, wherein:one of said temperature sensor elements is heatable;from each temperature sensor element at least one connection wire leads away, which is connected with said circuit board;said circuit board is arranged in said housing chamber;said circuit board is positioned in said housing chamber by a snap-in connection; anda terminally located part of said housing is embodied as a deep draw cap with a wall thickness of less than 2 mm, preferably less than 1.5 mm, especially less than 0.8 mm. 2. The temperature sensor as claimed in claim 1, wherein: said housing chamber has a reinforcing layer, which reinforcing layer has or forms a recess or protrusion for snap-in of said circuit board. 3. A temperature sensor, of a thermal, flow measuring device, comprising: a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are embodied as thin-film resistance thermometers; anda circuit board, wherein:one of said temperature sensor elements is heatable;from each temperature sensor element at least one connection wire leads away, which is connected with said circuit board; anda connection wire of a first temperature sensor element is led with strain relief in a first direction through said circuit board and connected with such. 4. The temperature sensor as claimed in claim 3, wherein: a connection wire of a second temperature sensor element is led with strain relief in a second direction opposite the first direction through said circuit board and connected with such. 5. The temperature sensor as claimed in claim 3, wherein: said connection wire of said first temperature sensor element is surrounded in the region of said circuit board with a potting compound. 6. A temperature sensor, of a thermal, flow measuring device, comprising: a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are embodied as thin-film resistance thermometers; anda circuit board, wherein:one of said temperature sensor elements is heatable;from each temperature sensor element at least one connection wire leads away, which is connected with said circuit board; andsaid housing chamber contains at least a first elastic body for guiding said connection wire. 7. The temperature sensor as claimed in claim 6, wherein: there is arranged in said housing chamber a second elastic body, which is supported on said first elastic body and/or on a wall of said housing and exerts a return force on said snapped-in circuit board. 8. The temperature sensor as a claimed in claim 6, wherein: said first elastic body is provided for lessening thermal and mechanical stresses on said connection wire in the case of tension loading. 9. The temperature sensor as claimed in claim 1, wherein: said housing chamber contains a potting compound; andsaid temperature sensor elements are arranged free of potting compound in said housing chamber. 10. The temperature sensor as claimed in claim 6, wherein: said first and said second elastic bodies are silicone bodies. 11. A temperature sensor, of a thermal, flow measuring device, comprising: a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are embodied as thin-film resistance thermometers; anda circuit board, wherein:one of said temperature sensor elements is heatable;from each temperature sensor element at least one connection wire leads away, which is connected with said circuit board;said circuit board is arranged in said housing chamber;said circuit board has a first number of cavities, for connection of connection wires and/or cables and a second number of cavities, for reducing thermal expansion of said circuit board. 12. The temperature sensor as claimed in claim 11, wherein: said cavities, as holes, are arranged in conductive traces arranged on said circuit board. 13. The temperature sensor as a claimed in claim 11, wherein: the temperature sensor is embodied as a four conductor measuring device. 14. The thermal, flow measuring device, comprising a temperature sensor as claimed in claim 11 and an evaluation unit. 15. A temperature sensor, comprising: a housing having a housing body and a housing chamber, in which housing chamber are arranged terminally two temperature sensor elements, which are especially embodied as thin-film resistance thermometers; anda circuit board, wherein:one of said temperature sensor elements is heatable;from each temperature sensor element at least one connection wire leads away, which is connected with said circuit board;said circuit board is arranged in said housing chamber;said circuit board is positioned in said housing chamber by a snap-in connection;said housing chamber has a reinforcing layer, which reinforcing layer has or forms a recess or protrusion for snap-in of said circuit board; andsaid reinforcing layer is mounted by material bonding to said housing body.
Bey, Jr., Paul P.; Becke, Craig S.; Speldrich, Jamie W.; Blumhoff, Christopher M., Packaging multiple measurands into a combinational sensor system using elastomeric seals.
Stanke Dennis A. (La Crescent MN) Rentmeester Paul C. (La Crosse WI) Ulland Paul D. (La Crescent MN), Temperature compensating fluid velocity sensing apparatus.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.