Method of manufacturing semiconductor device package
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-021/48
H01L-021/301
H01L-021/304
H01L-021/78
H01L-023/495
H01L-041/338
H01L-033/00
H01L-023/00
출원번호
US-0752632
(2015-06-26)
등록번호
US-9831380
(2017-11-28)
우선권정보
KR-10-2014-0115965 (2014-09-02)
발명자
/ 주소
Park, Jung Kyu
Kim, Wan Jong
Jun, Young Geun
출원인 / 주소
SAMSUNG ELECTRONICS CO., LTD.
대리인 / 주소
Muir Patent Law, PLLC
인용정보
피인용 횟수 :
0인용 특허 :
42
초록▼
A method of manufacturing a semiconductor device package includes: forming a based frame provided with an outer frame, a plurality of unit frames spaced apart from the outer frame by separating grooves interposed therebetween, and a first connector and a second connector forming connections between
A method of manufacturing a semiconductor device package includes: forming a based frame provided with an outer frame, a plurality of unit frames spaced apart from the outer frame by separating grooves interposed therebetween, and a first connector and a second connector forming connections between each of the plurality of unit frames and the outer frame; forming a package body in each of the plurality of unit frames to allow a mounting area of each unit frame to be open; removing one of the first connector and second the connector connected to each unit frame; mounting a semiconductor device in the mounting area of the unit frame; and cutting the other of the first connector and second the connector connected to each unit frame and separating, from the base frame, the unit frame in which the package body is formed.
대표청구항▼
1. A method of manufacturing a semiconductor device package, the method comprising: forming a base frame provided with an outer frame, a plurality of unit frames spaced apart from the outer frame, and a first connector and a second connector forming connections between each of the plurality of unit
1. A method of manufacturing a semiconductor device package, the method comprising: forming a base frame provided with an outer frame, a plurality of unit frames spaced apart from the outer frame, and a first connector and a second connector forming connections between each of the plurality of unit frames and the outer frame;forming a package body in each of the plurality of unit frames to provide a mounting area in each unit frame;removing one of the first connector and the second connector connected to each unit frame; andmounting a semiconductor device in the mounting area of each unit frame after the removing one of the first connector and the second connector connected to each unit frame. 2. The method of claim 1, wherein the plurality of unit frames are disposed at intervals, and the first connector and the second connector are disposed on both sides of each unit frame facing one another. 3. The method of claim 2, wherein the first connector and the second connector extend in a first direction, and one of the first connector and the second connector disposed between the plurality of unit frames further extends in a second direction perpendicular to the first direction so as to be connected to the outer frame. 4. The method of claim 1, wherein each unit frame includes a first lead frame and a second lead frame, and the first connector and the second connector are each connected to both sides of the first lead frame and the second lead frame. 5. The method of claim 1, wherein the mounting of a semiconductor device in the mounting area of each unit frame comprises: mounting in a flip chip bonding manner using a solder interposed between the mounting area and the semiconductor device. 6. The method of claim 1, wherein the removing of one of the first connector and the second connector connected to each unit frame comprises: cutting and removing one of the first connector and the second connector in a state in which the outer frame and the package body are supported on a die. 7. The method of claim 1, further comprising: separating of each unit frame from the base frame, including: cutting and separating the other of the first connector and the second connector connected to each unit frame in the state in which the outer frame is supported on a die. 8. The method of claim 1, further comprising: forming an encapsulating portion to encapsulate the semiconductor device mounted in the mounting area. 9. The method of claim 8, wherein the package body is provided with a recess opening the mounting area and accommodating the semiconductor device, and the encapsulating portion is formed to fill the recess. 10. The method of claim 1, wherein the removing of one of the first connector and the second connector connected to each unit frame comprises: cutting and removing one of the first connector and the second connector disposed between the plurality of unit frames. 11. The method of claim 1, wherein the removing of one of the first connector and the second connector connected to each unit frame is a trimming process that comprises: cutting and removing one of the first connector and the second connector in a state in which the outer frame and the package body are supported on a die,wherein each unit frame and the outer frame maintain a connection via the other of the first connector and the second connector that is not cut. 12. The method of claim 1, wherein the forming a package body in each of the plurality of unit frames to provide a mounting area in each unit frame is performed after the removing one of the first connector and the second connector connected to each unit frame. 13. The method of claim 1, wherein the forming a package body in each of the plurality of unit frames to provide a mounting area in each unit frame, the mounting a semiconductor device in the mounting area of the unit frame, and the removing one of the first connector and the second connector connected to each unit frame are sequentially performed. 14. The method of claim 1, wherein the mounting a semiconductor device in the mounting area of each unit frame is performed before the removing one of the first connector and the second connector connected to each unit frame. 15. The method of claim 1, further comprising: cutting the other of the first connector and the second connector connected to each unit frame after mounting the semiconductor device in the mounting area of each unit frame. 16. The method of claim 1, wherein removing the one of the first connector and the second connector connected to each unit frame is performed before mounting the semiconductor device in the mounting area of each unit frame. 17. The method of claim 1, wherein the forming a package body in each of the plurality of unit frames is performed before the removing one of the first connector and the second connector connected to each unit frame. 18. The method of claim 15, wherein the forming a package body in each of the plurality of unit frames is performed before the removing one of the first connector and the second connector connected to each unit frame. 19. The method of claim 1, wherein: the plurality of unit frames are spaced apart from the outer frame by separating grooves interposed therebetween;forming the package body in each of the plurality of unit frames includes forming the package body in each of the plurality of unit frames to allow a mounting area in each unit frame to be open;and further comprising:after the mounting the semiconductor device in the mounting area, cutting the other of the first connector and the second connector connected to each unit frame, and separating, from the base frame, the unit frame in which the package body is formed.
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