A unitary graphene-based integrated heat sink comprising a heat collection member (base) and at least one heat dissipation member (e.g. fins) integral to the baser, wherein the base is configured to be in thermal contact with a heat source, collects heat therefrom, and dissipates heat through the fi
A unitary graphene-based integrated heat sink comprising a heat collection member (base) and at least one heat dissipation member (e.g. fins) integral to the baser, wherein the base is configured to be in thermal contact with a heat source, collects heat therefrom, and dissipates heat through the fins. The unitary graphene material is obtained from heat-treating a graphene oxide gel at a temperature higher than 100° C., 500° C., 1,250° C., or 2,000° C., and contains chemically bonded graphene molecules having inter-graphene distance of 0.3354-0.4 nm (preferably 0.337 nm). The unitary graphene material is a graphene single crystal, a poly-crystal with incomplete grain boundaries, or a poly-crystal having large grain sizes (e.g. mm or cm), exhibiting a degree of graphitization preferably from 1% to 100% and a Mosaic spread value less than 0.7 (preferably no greater than 0.4). The finned heat sink may also be made from a filler-reinforced graphene matrix composite.
대표청구항▼
1. An integrated heat sink comprising a unitary graphene material article consisting essentially of a heat collection member and at least one heat dissipation member integral to said heat collection member, wherein the heat collection member is configured to be in thermal contact with a heat source,
1. An integrated heat sink comprising a unitary graphene material article consisting essentially of a heat collection member and at least one heat dissipation member integral to said heat collection member, wherein the heat collection member is configured to be in thermal contact with a heat source, collects heat from said heat source, and dissipates heat through the at least one heat dissipation member, and further wherein the unitary graphene material is obtained from heat-treating a graphene oxide gel at a heat treatment temperature of at least 100° C. to obtain said unitary graphene material that is a single crystal or polycrystal having a physical density of at least 1.7 g/cm3 and containing chemically bonded graphene molecules or chemically merged graphene planes having an inter-graphene spacing d002 from 0.3354 nm to 0.40 nm, an oxygen content from 0.001% to 10%, a degree of graphitization from 1% to 100%, a Mosaic spread value less than 0.7, a thermal conductivity of at least 600 W/mK, wherein said graphene planes in a crystal grain are essentially parallel to one another with an average mis-orientation angle less than 10 degrees. 2. The integrated heat sink of claim 1, wherein the unitary graphene material further contains a discrete filler or reinforcement phase dispersed in said unitary graphene material to form a unitary graphene matrix composite structure and said filler or reinforcement phase contains a particle, filament, nanotube, nanowire, or nanorod of a metal, ceramic, glass, polymer, carbon, graphite, or a combination thereof. 3. The integrated heat sink of claim 1, wherein the unitary graphene material further contains a discrete solid carbon, graphite, or graphene filler phase dispersed in said unitary graphene material to form a unitary graphene matrix composite structure and said filler phase is selected from a carbon or graphite fiber, carbon or graphite nanofiber, carbon nanotube, carbon nanorod, meso-phase carbon particle, meso-carbon micro-bead, expanded graphite flake with a thickness greater than 100 nm, single-layer graphene sheet, multi-layer graphene platelet with a thickness less than 100 nm, exfoliated graphite or graphite worm, coke particle, needle coke, carbon black or acetylene black particle, activated carbon particle, or a combination thereof; wherein said carbon, graphite, or graphene filler phase occupies a weight fraction of 0.01% to 99% based on the total composite structure weight. 4. The integrated heat sink of claim 1, wherein said heat treatment temperature contains a temperature in a thermal reduction regime of 100° C.-500° C. and the unitary graphene material has an oxygen content less than 5%. 5. The integrated heat sink of claim 1, wherein said heat treatment temperature contains a temperature in the range of 500° C.-1,250° C. and the unitary graphene material has an oxygen content less than 1%, an inter-graphene spacing less than 0.345 nm, a thermal conductivity of at least 1,300 W/mK, or an electrical conductivity no less than 3,000 S/cm. 6. The integrated heat sink of claim 1, wherein said heat treatment temperature contains a temperature in the range of 1,250° C.-2,000° C. and the unitary graphene material has an oxygen content less than 0.01%, an inter-graphene spacing less than 0.337 nm, a thermal conductivity of at least 1,500 W/mK, or an electrical conductivity no less than 5,000 S/cm. 7. The integrated heat sink of claim 1, wherein said heat treatment temperature contains a temperature greater than 2,000° C. and the unitary graphene material has an inter-graphene spacing less than 0.336 nm, a thermal conductivity of at least 1,700 W/mK, or an electrical conductivity no less than 10,000 S/cm. 8. The integrated heat sink of claim 1, wherein said heat treatment temperature contains a temperature no less than 2,500° C. and the unitary graphene material has an inter-graphene spacing less than 0.336 nm, a mosaic spread value no greater than 0.4, a thermal conductivity greater than 1,700 W/mK, or an electrical conductivity greater than 10,000 S/cm. 9. The integrated heat sink of claim 1, wherein the unitary graphene material exhibits an inter-graphene spacing less than 0.337 nm. 10. The integrated heat sink of claim 1, wherein the unitary graphene material exhibits a degree of graphitization no less than 40%. 11. The integrated heat sink of claim 1, wherein the unitary graphene material exhibits a degree of graphitization no less than 80% and/or a mosaic spread value no greater than 0.4. 12. The integrated heat sink of claim 1, wherein said chemically bonded graphene molecules or chemically merged graphene planes are parallel to one another. 13. The integrated heat sink of claim 1, wherein said unitary graphene material contains no complete grain boundary therein, is a graphene single crystal, or a poly-crystal graphene structure with oriented graphene molecules. 14. The integrated heat sink of claim 3, wherein said carbon, graphite, or graphene filler phase is chemically bonded by said unitary graphene matrix. 15. The integrated heat sink of claim 1, wherein the chemically bonded graphene molecules contain a combination of sp2 and sp3 electronic configurations. 16. The integrated heat sink of claim 1, wherein said unitary graphene matrix composite has a physical density of at least 1.8 g/cm3 or a porosity level lower than 5%. 17. The integrated heat sink of claim 3, wherein said carbon, graphite, or graphene filler phase occupies a weight fraction from 0.1% to 70% based on the total composite structure weight and said unitary graphene material forms a continuous phase. in a reaction vessel at a reaction temperature for a length of time sufficient to obtain a homogeneous solution composed of graphene oxide molecules dispersed and dissolved in the liquid medium to form an optically transparent, translucent, or brown colored and said graphene oxide molecules have an oxygen content no less than 20% by weight and a molecular weight less than 43,000 g/mole while in a gel state. 18. The integrated heat sink of claim 1, wherein said unitary graphene material has an electrical conductivity greater than 3,000 S/cm, a thermal conductivity greater than 600 W/mK, a physical density greater than 1.8 g/cm 3, or a tensile strength greater than 40 MPa. 19. The integrated heat sink of claim 1, wherein said unitary graphene material has an electrical conductivity greater than 5,000 S/cm, a thermal conductivity greater than 1,000 W/mK, a physical density greater than 1.9 g/cm 3, or a tensile strength greater than 60 MPa. 20. The integrated heat sink of claim 1, wherein said unitary graphene material has an electrical conductivity greater than 15,000 S/cm, a thermal conductivity greater than 1,500 W/mK, a physical density greater than 2.0 g/cm3, or a tensile strength greater than 100 MPa. 21. The integrated heat sink of claim 1, wherein the at least one heat dissipation member comprises fins formed at a surface of the heat collection member. 22. An integrated heat sink comprising a unitary graphene material article shaped so as to provide a heat collection surface and at least one heat dissipation surface connected or integral to said heat collection surface, wherein the heat collection surface is configured to be in thermal contact with a heat source, collects heat from said heat source, and dissipates heat through the at least one heat dissipation surface, and further wherein the unitary graphene material has a physical density of at least 1.7 g/cm3 and is obtained from heat-treating a graphene oxide gel at a heat treatment temperature higher than 500° C. and contains chemically bonded graphene molecules or chemically merged graphene planes having an inter-graphene spacing d002 from 0.3354 nm to 0.40 nm, an oxygen content from 0.001% to 10%, a degree of graphitization from 1% to 100%, a Mosaic spread value less than 0.7, a thermal conductivity of at least 600 W/mK, wherein said graphene planes in a crystal grain are essentially parallel to one another with an average mis-orientation angle less than 10 degrees. 23. The integrated heat sink of claim 1, comprising a radial finned heat sink assembly that comprises: (a) a base comprising said heat collection member; and (b) a plurality of spaced parallel planar fin members supported by or integral with the base, wherein said planar fin members comprise said at least one heat dissipation member. 24. The integrated heat sink of claim 23, wherein said plurality of parallel planar fin members are equally spaced. 25. The integrated heat sink of claim 1, comprising a radial finned heat sink assembly that comprises: (a) a base comprising said heat collection member; and (b) a plurality of spaced fin members supported by or integral with the base, wherein said fin members comprise said at least one heat dissipation member. 26. The integrated heat sink of claim 1, wherein said at least one heat dissipation member comprises a surface coated with a high-emissivity material having an emissivity greater than an emissivity of said unitary graphene material. 27. The integrated heat sink of claim 26, wherein said high-emissivity material is selected from aluminum oxide, zinc oxide, aluminum nitride, titanium oxide, boron nitride, silicon carbide, silicon nitride, gallium nitride, or a combination thereof. 28. The integrated heat sink of claim 26, wherein said high-emissivity material is selected from metal or ceramic nano particles. 29. The integrated heat sink of claim 1, wherein said heat source comprises an electronic component. 30. An electronic device containing an integrated heat sink of claim 1. 31. An electronic device comprising a unitary graphene material-based integrated heat sink of claim 1, wherein the unitary graphene material contains chemically bonded graphene molecules or chemically merged graphene planes having an inter-graphene spacing no greater than 0.345 nm. 32. The electronic device of claim 31, wherein said unitary graphene material comprises: (a) A unitary graphene matrix containing graphene planes having an oxygen content less than 1% by weight;(b) A carbon or graphite filler phase selected from a carbon or graphite fiber, carbon or graphite nanofiber, carbon notube, carbon nanorod, meso-phase carbon particle, meso-carbon micro-bead, exfoliated graphite flake with a thickness greater than 100 nm, exfoliated graphite or graphite worm, coke particle, needle coke, carbon black or acetylene black particle, activated carbon particle, a combination thereof, or a combination with a nano graphene platelet;wherein said carbon or graphite filler phase occupies a weight fraction from 1% to 90% based on the total composite weight and said carbon or graphite filler phase is in a particulate, filamentary, or rod-like form dispersed in said unitary graphene matrix which forms a continuous phase. 33. The electronic device of claim 32, wherein the graphene planes have an inter-graphene plane spacing less than 0.337 nm.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.