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Modular IT rack cooling assemblies and methods for assembling same

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/20
  • H05K-007/20
  • H05K-007/18
출원번호 US-0362487 (2016-11-28)
등록번호 US-9839163 (2017-12-05)
발명자 / 주소
  • Keisling, Earl
  • Costakis, John
  • McDonnell, Gerald
출원인 / 주소
  • Inertech IP LLC
대리인 / 주소
    Carter, DeLuca, Farrell & Schmidt, LLC
인용정보 피인용 횟수 : 0  인용 특허 : 41

초록

A modular server rack cooling structure for cooling at least one server in at least one server rack of a data center assembly includes at least a first supporting member and at least a first heat exchanger. The first heat exchanger is coupled to the first supporting member, which is configured to po

대표청구항

1. A modular server rack cooling structure for cooling at least one server in at least one rack of a data center, the modular server rack cooling structure comprising: a first supporting member including a first plurality of beam members, wherein the first plurality of beam members are directly coup

이 특허에 인용된 특허 (41)

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