Electronic device package structure and manufacturing method thereof
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-023/26
H01L-051/52
H01L-051/00
출원번호
US-0091341
(2013-11-27)
등록번호
US-9847512
(2017-12-19)
우선권정보
TW-102123263 A (2013-06-28)
발명자
/ 주소
Yeh, Shu-Tang
Ho, Jia-Chong
출원인 / 주소
Industrial Technology Research Institute
대리인 / 주소
JCIPRNET
인용정보
피인용 횟수 :
0인용 특허 :
6
초록
A package structure of an electronic device is provided. The substrate of such package structure has at least one embedded gas barrier structure, which protects the electronic device mounted thereon and offers good gas barrier capability so as to extend the life of the electronic device.
대표청구항▼
1. A package structure of an electronic device, comprising: a first substrate, having a first surface and a second surface opposite to the first surface;an electronic device, disposed on the first surface of the first substrate;an adhesive material, disposed on the first substrate and covering the e
1. A package structure of an electronic device, comprising: a first substrate, having a first surface and a second surface opposite to the first surface;an electronic device, disposed on the first surface of the first substrate;an adhesive material, disposed on the first substrate and covering the electronic device and the first surface of the first substrate; anda second substrate, disposed above the first substrate and the adhesive material, wherein the second substrate has a third surface and a fourth surface opposite to the third surface,wherein at least one of the first substrate and the second substrate has a gas barrier structure embedded therein, and the first substrate and the second substrate are adhered to each other through the adhesive material, such that the electronic device is located between the first substrate and the second substrate, and the electronic device is disposed on the gas barrier structure that is embedded within the at least one of the first substrate and the second substrate without protruding out of the first and second surfaces of the first substrate and without protruding out of the third and fourth surfaces of the second substrate. 2. The package structure according to claim 1, further comprising: at least one functional substrate, located on the second surface of the first substrate and under the electronic device and under the first substrate,wherein the functional substrate is a substrate having a touch function, a substrate having a color-filtering function, a substrate having a color conversion function or a substrate having a polarization function. 3. The package structure according to claim 1, further comprising: at least one functional substrate, located on the first surface of the first substrate and under the electronic device and above the first substrate,wherein the functional substrate is a substrate having a touch function, a substrate having a color-filtering function, a substrate having a color conversion function or a substrate having a polarization function. 4. The package structure according to claim 1, further comprising: at least one functional substrate, located on the fourth surface of the second substrate, above the electronic device, between the adhesive material and the second substrate and under the second substrate,wherein the functional substrate is a substrate having a touch function, a substrate having a color-filtering function, a substrate having a color conversion function or a substrate having a polarization function. 5. The package structure according to claim 1, further comprising: at least one functional substrate, located on the third surface of the second substrate, above the electronic device and the adhesive material and above the second substrate,wherein the functional substrate is a substrate having a touch function, a substrate having a color-filtering function, a substrate having a color conversion function or a substrate having a polarization function. 6. The package structure according to claim 1, wherein the electronic device includes an active matrix organic light emitting diode (OLED) element or a passive matrix OLED element. 7. The package structure according to claim 1, wherein the first substrate or the second substrate is a flexible substrate, and a material of the first substrate or the second substrate comprises polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polymethyl methacrylate, polycarbonate, polyimide or a metal foil. 8. The package structure according to claim 1, wherein a material of the adhesive material comprises acrylic resin, epoxy resin or silicone. 9. The package structure according to claim 1, wherein the gas barrier structure at least comprises a three-dimensional (3D) structure formed with a soft core and at least one flexible passivation layer and at least one soft layer alternately stacked on and covering the soft core, and the gas barrier structure is embedded in the first substrate and/or the second substrate. 10. The package structure according to claim 9, wherein the gas barrier structure further comprises at least one getter layer alternately stacked on the soft core with the at least one flexible passivation layer and the at least one soft layer. 11. The package structure according to claim 9, wherein a material of the soft core or the at least one soft layer comprises small molecule materials, organic oligomers, organic-inorganic co-evaporation materials or inorganic metal oxide materials. 12. The package structure according to claim 11, wherein the small molecule materials comprise tris(8-hydroxyquinoline)-aluminum (Alq3), N,N′-bis(naphthalene-1-yl)-N,N′-diphenyl-benzidine (NPB) or phthalocyanine copper complex (CuPc). 13. The package structure according to claim 11, wherein the organic oligomers comprise phenylene vinylene oligomers or fluorene oligomers. 14. The package structure according to claim 11, wherein a molecular weight of the organic-inorganic co-evaporation materials ranges from 3 g/mol to 500 g/mol. 15. The package structure according to claim 11, wherein the inorganic metal oxide materials comprise Al2O3, AlN, BaTiO3, CeO2, Cr2O3, CuO, Dy2O3, Er2O3, Eu2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, indium tin oxide (ITO), PbTiO3, MgO, MnO2, Nd2O3, NiO, Nb2O5, Pr2O3, Sm2O3, SiO2, SiO, Ta2O5, ThO2, SnO2, TiO2, Y2O3, ZnO, ZrO2, CdTe, ZnTe, CdSe, CdS, ZnS, MoS2, BaF2, MgF2, CaF2Li, MgP, LiF, Li2O, CaO or MgO. 16. The package structure according to claim 9, wherein a material of the flexible passivation layer comprises Al, Ag, Mg, Mg—Ag alloys, Mg—Al alloys, indium tin oxide (ITO), Al-doped ZnO (AZO), indium-zinc-tin oxide (IZO), WO3, MoO3, SiOx, SiNx, SiOxNy or Al2O3. 17. The package structure according to claim 9, wherein the gas barrier structure comprises a continuous pattern disposed surrounding a region where the electronic device is disposed. 18. The package structure according to claim 17, wherein the continuous pattern of the gas barrier structure is a frame pattern, a grid pattern, a curve pattern or a combination thereof. 19. The package structure according to claim 9, wherein the gas barrier structure is in a form of discontinuous blocks arranged around a region where the electronic device is disposed or distributed throughout the first or the second substrate. 20. A method for manufacturing a package structure of an electronic device, comprising: providing a substrate mounted on a carrier;patterning the substrate and forming a plurality of trenches in the substrate;forming a gas barrier structure to fill the plurality of trenches; anddisposing the electronic device on the gas barrier structure. 21. The method according to claim 20, wherein a depth of the plurality of trenches ranges from 200 μm to 300 μm, and an interval between the plurality of trenches ranges from 200 μm to 300 μm. 22. The method according to claim 20, wherein the substrate is a flexible substrate, and a material of the substrate comprises polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polymethyl methacrylate, polycarbonate, polyimide or a metal foil. 23. The method according to claim 20, wherein the step of forming the gas barrier structure to fill the plurality of trenches comprises: depositing at least one flexible passivation layer, depositing at least one soft layer and depositing a soft core to form the gas barrier structure, such that the gas barrier structure comprises a 3D structure formed with the soft core and the at least one flexible passivation layer and the at least one soft layer alternately stacked on and covering the soft core, and the gas barrier structure is embedded in the trenches of the substrate. 24. The method according to claim 23, wherein the step of forming the gas barrier structure to fill the plurality of trenches further comprises: depositing at least one getter layer, alternately stacked with the flexible passivation layer and the soft layer to cover the soft core. 25. A method for manufacturing a package structure of an electronic device, comprising: providing a first substrate mounted on a carrier;forming a first gas barrier layer on the first substrate;patterning the first gas barrier layer and forming a plurality of trenches in the first gas barrier layer and defining a first gas barrier structure on the first substrate;forming a second substrate to cover the first substrate and the first gas barrier structure, wherein the second substrate fills the trenches in the first gas barrier layer; anddisposing the electronic device on the first gas barrier structure. 26. The method according to claim 25, wherein the step of forming the plurality of trenches in the first gas barrier layer comprises etching through the first gas barrier layer and removing a part of the first substrate to form the plurality of the trenches in the first gas barrier layer and in the first substrate, and wherein the method further comprises: filling a first adhesive material in the plurality of trenches;disposing the electronic device on the first substrate;providing a cover having a second gas barrier structure that protrudes out from a surface of the cover;disposing a second adhesive material on the cover; andadhering the first substrate to the cover so that the electronic device, the first gas barrier structure and the second gas barrier structure are located between the cover and the first substrate. 27. The method according to claim 26, wherein the electronic device comprises an active matrix organic light emitting diode (OLED) element or a passive matrix OLED element. 28. The method according to claim 26, wherein a material of the first or the second adhesive material comprises acrylic resin, epoxy resin or silicone. 29. The method according to claim 26, further comprising a third gas barrier layer on the first substrate at a side opposite to the first gas barrier layer. 30. The method according to claim 25, wherein the first substrate or the second substrate is a flexible substrate and a material of the first substrate of the second substrate comprises polyethylene terephthalate, polyethylene naphthalate, polyethersulfone, polymethyl methacrylate, polycarbonate, polyimide or a metal foil.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (6)
Silvernail, Jeffrey Alan, Barrier region for optoelectronic devices.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.