A heat sink module for cooling a heat providing surface can include an inlet chamber and an outlet chamber formed within the heat sink module. The outlet chamber can have an open portion that can be enclosed by the heat providing surface when the heat sink module is installed on the heat providing s
A heat sink module for cooling a heat providing surface can include an inlet chamber and an outlet chamber formed within the heat sink module. The outlet chamber can have an open portion that can be enclosed by the heat providing surface when the heat sink module is installed on the heat providing surface. The heat sink module can include a dividing member disposed between the inlet chamber and the outlet chamber. The dividing member can include a first plurality of orifices extending from a top surface of the dividing member to a bottom surface of the dividing member. The first plurality of orifices can be configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the inlet chamber.
대표청구항▼
1. A heat sink module for cooling a heat providing surface, the heat sink module comprising: an inlet chamber formed within the heat sink module;an outlet chamber formed within the heat sink module, the outlet chamber having an open portion, the open portion configured to be enclosed by the heat pro
1. A heat sink module for cooling a heat providing surface, the heat sink module comprising: an inlet chamber formed within the heat sink module;an outlet chamber formed within the heat sink module, the outlet chamber having an open portion, the open portion configured to be enclosed by the heat providing surface when the heat sink module is installed on the heat providing surface;a dividing member disposed between the inlet chamber and the outlet chamber, the dividing member comprising a first plurality of orifices formed in the dividing member, the first plurality of orifices extending from a top surface of the dividing member to a bottom surface of the dividing member, the first plurality of orifices configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the heat providing surface when the heat sink module is installed on the heat providing surface and when pressurized coolant is provided to the inlet chamber; anda second plurality of orifices extending from the inlet chamber to a rear wall of the outlet chamber, the second plurality of orifices configured to deliver a plurality of anti-pooling jet streams of coolant to a rear portion of the outlet chamber when pressurized coolant is provided to the inlet chamber. 2. The heat sink module of claim 1, wherein the first plurality of orifices have an average diameter of about 0.001-0.020, 0.001-0.2, 0.001-0.150, 0.001-0.120, 0.001-0.005, or 0.030-0.050 in. 3. The heat sink module of claim 1, wherein the dividing member has a thickness of about 0.005-0.25, 0.020-0.1, 0.025-0.08, 0.025-0.075, 0.040-0.070, 0.1-0.25, or 0.040-0.070 in. 4. The heat sink module of claim 1, wherein each orifice of the first plurality of orifices comprises a central axis, wherein the central axes of the first plurality of orifices are arranged at an angle of about 20-80, 30-60, 40-50, or 45 degrees with respect to the surface to be cooled. 5. The heat sink module of claim 1, wherein the first plurality of orifices are arranged in an array, the array being organized into staggered columns and staggered rows, such that a given orifice in a given column and a given row does not have a corresponding orifice in a neighboring row in the given column or a corresponding orifice in a neighboring column in the given row. 6. The heat sink module of claim 1, wherein each orifice of the second plurality of orifices comprises a central axis, wherein the central axes of the second plurality of orifices are arranged at an angle of about 40-80, 50-70, or 60 degrees with respect to the surface to be cooled. 7. The heat sink module of claim 6, wherein the second plurality of orifices are arranged in a column along the rear wall of the outlet chamber. 8. The heat sink module of claim 1, further comprising one or more boiling-inducing members extending from the bottom side of the dividing member toward the heat providing surface, wherein the one or more boiling-inducing members are slender members extending from the bottom surface of the dividing member. 9. The heat sink module of claim 8, wherein the one or more boiling-inducing members are configured to contact the heat providing surface. 10. The heat sink module of claim 8, wherein the one or more boiling-inducing members are configured to extend toward the heat providing surface, and wherein a clearance distance is provided between the one or more boiling-inducing members and heat providing surface, the clearance distance being about 0.001-0.0125, 0.001-0.05, 0.001-0.02, 0.001-0.01, or 0.005-0.010 in. 11. The heat sink module of claim 1, wherein the inlet chamber decreases in cross-sectional area in a direction from a front surface of the heat sink module toward a rear surface of the heat sink module. 12. The heat sink module of claim 1, wherein the outlet chamber increases in cross-sectional area in a direction from a front surface of the heat sink module toward a rear surface of the heat sink module. 13. The heat sink module of claim 1, further comprising: an inlet port;an inlet passage fluidly connecting the inlet port to the inlet chamber;an outlet port; andan outlet passage fluidly connecting the outlet chamber to the outlet port. 14. The heat sink module of claim 13, wherein the heat sink module comprises a bottom surface and a bottom plane associated with the bottom surface, wherein the inlet port comprises a central axis, and wherein the central axis of the inlet port defines an angle of about 10-80, 20-70, 30-60, or 40-50 degrees with respect to the bottom plane of the heat sink module. 15. The heat sink module of claim 13, wherein the heat sink module comprises a bottom surface and a bottom plane associated with the bottom surface, wherein the outlet port comprises a central axis, and wherein the central axis of the outlet port defines an angle of about 10-80, 20-70, 30-60, or 40-50 degrees with respect to the bottom plane of the heat sink module. 16. The heat sink module of claim 1, wherein the heat sink module is manufactured by an additive manufacturing process. 17. The heat sink module of claim 16, wherein the additive manufacturing process is a stereolithography process, the stereolithography process comprising forming layers of material curable in response to synergistic stimulation adjacent to previously formed layers of material and successively curing the layers of material by exposing the layers of material to a pattern of synergistic stimulation corresponding to successive cross-sections of the heat sink module, wherein the material curable in response to synergistic stimulation is a liquid photopolymer. 18. The heat sink module of claim 1, wherein the first plurality of orifices have an average diameter of D and an average length of L, and wherein L divided by D is greater than or equal to one or about 1-10, 1-8, 1-6, 1-4, or 1-3. 19. The heat sink module of claim 1, wherein a distance between the bottom surface of the dividing member and the heat providing surface defines a jet height of the plurality of orifices when the heat sink module is installed on the heat providing surface, wherein the jet height is about 0.01-0.75, 0.05-0.5, 0.05-0.25, 0.020-0.25, 0.03-0.125, or 0.04-0.08 in.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (65)
Ostby, Gary B, Apparatus for cooling electronic components in a phase change electronic cooling system.
Phillips Richard J. (Alachua FL) Larson Ralph I. (Bolton MA), Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in sec.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Control of system coolant to facilitate two-phase heat transfer in a multi-evaporator cooling system.
Lamb Charles Robert ; Li Kang-Wah ; Papanicolaou Elias,DEX ; Tai Charles Chaolee, Flexible cold plate having a one-piece coolant conduit and method employing same.
Cullimore Brent A. (Littleton CO) Egan Curtis W. (Littleton CO) Clark David L. (Highland Ranch CO), Flowrate controller for hybrid capillary/mechanical two-phase thermal loops.
Lau, David Man Chu; Shek, Ka Lim, Industrial fluid circuits and method of controlling the industrial fluid circuits using variable speed drives on the fluid pumps of the industrial fluid circuits.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Local condensation control for liquid impingement two-phase cooling.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.