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Heat sink module 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25B-039/02
  • F25D-017/02
  • F25D-023/12
  • F25D-025/00
  • H05K-007/20
  • F25B-023/00
  • F25B-041/00
  • F28F-003/12
  • F28F-009/26
  • F28F-013/02
  • F28D-015/00
출원번호 US-0604727 (2015-01-25)
등록번호 US-9848509 (2017-12-19)
발명자 / 주소
  • Shedd, Timothy A.
  • Lindeman, Brett A.
출원인 / 주소
  • EBULLIENT, INC.
대리인 / 주소
    Boyarski, Nicholas J.
인용정보 피인용 횟수 : 1  인용 특허 : 65

초록

A heat sink module for cooling a heat providing surface can include an inlet chamber and an outlet chamber formed within the heat sink module. The outlet chamber can have an open portion that can be enclosed by the heat providing surface when the heat sink module is installed on the heat providing s

대표청구항

1. A heat sink module for cooling a heat providing surface, the heat sink module comprising: an inlet chamber formed within the heat sink module;an outlet chamber formed within the heat sink module, the outlet chamber having an open portion, the open portion configured to be enclosed by the heat pro

이 특허에 인용된 특허 (65)

  1. Ostby, Gary B, Apparatus for cooling electronic components in a phase change electronic cooling system.
  2. Lewin John Edward (Santa Ana CA), Blood oxygenator with integral heat exchanger for regulating the temperature of blood in an extracorporeal circuit.
  3. Scott,Alexander Robin Walter, Computer cooling apparatus.
  4. Phillips Richard J. (Alachua FL) Larson Ralph I. (Bolton MA), Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in sec.
  5. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Control of system coolant to facilitate two-phase heat transfer in a multi-evaporator cooling system.
  6. O'Neal Sean P. ; Liao Reynold L. ; Gilchrist Phillip C., Cooling apparatus for an electronic package.
  7. Patel Chandrakant ; Aoki Edward M. ; Bash Cullen, Cooling apparatus for computer subsystem.
  8. Cheng, Kai-An; Liao, Chia-Chen; Wu, Chun-Hsien; Meng, Hsien-Chun; Meng, Hsien, Cooling module and system for lamp device.
  9. Eriksen, André Sloth, Cooling system for a computer system.
  10. Eriksen, André Sloth, Cooling system for a computer system.
  11. Lipp, Robert J.; Hughes, Phillip P., Cooling system for contact cooled electronic modules.
  12. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  13. Wang, Ching-Feng, Counter flow heat exchanger with integrated fins and tubes.
  14. Morrison Robert A. (Granada Hills CA) Frink Attila (Northridge CA), Electronic packaging module utilizing phase-change conductive cooling.
  15. Chang,Je Young; Pokharna,Himanshu, Enhanced flow channel for component cooling in computer systems.
  16. Dawson,Peter, Flat heat exchanger plate and bulk material heat exchanger using the same.
  17. Lamb Charles Robert ; Li Kang-Wah ; Papanicolaou Elias,DEX ; Tai Charles Chaolee, Flexible cold plate having a one-piece coolant conduit and method employing same.
  18. Newman, Michael D.; McCormick, Stephen A.; Boyles, D. Scott; Muscato, Robert, Flow enhanced tunnel freezer.
  19. Cullimore Brent A. (Littleton CO) Egan Curtis W. (Littleton CO) Clark David L. (Highland Ranch CO), Flowrate controller for hybrid capillary/mechanical two-phase thermal loops.
  20. Lyon, Geoff Sean, Fluid heat exchanger configured to provide a split flow.
  21. Shedd, Timothy A.; Pautsch, Adam G., Full coverage spray and drainage system and method for orientation-independent removal of high heat flux.
  22. Kite, Murray James; Innes, Rodney Mitchell, Heat exchanger with helical flow paths.
  23. Van Dine Pieter ; Thaxton Edgar S. ; Smith James S. ; Linkinhoker Jeffrey, Heat transfer cold plate arrangement.
  24. Castillo,Gil Del, Helical heat exchange apparatus.
  25. Malone,Christopher G.; Simon,Glenn C.; Barsun,Stephan K., High serviceability liquid cooling loop using flexible bellows.
  26. Zuo,Jon; Sarraf,David, Hybrid capillary cooling apparatus.
  27. Anderson, William G.; Eastman, G. Yale; Sarraf, David B.; Zuo, Jon, Hybrid loop cooling of high powered devices.
  28. Lau, David Man Chu; Shek, Ka Lim, Industrial fluid circuits and method of controlling the industrial fluid circuits using variable speed drives on the fluid pumps of the industrial fluid circuits.
  29. Morris, Terrel L.; Belady, Christian L, Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump.
  30. Zrodnikov, Volodymyr; Spokoyny, Mikhail, Interlocked jets cooling method and apparatus.
  31. Mejean, Veronique; Barth, Mathias; Lorenz, Lutz, Latch arrangement.
  32. Yamada, Kazuji; Tamba, Akihiro; Nakamura, Takayoshi; Saito, Ryuichi; Ogawa, Toshio; Okamura, Hisanori, Liquid cooled circuit device.
  33. Branton, Steven B., Liquid cooling system for a server.
  34. Branton, Steven B., Liquid cooling system for a server.
  35. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Liquid-based cooling apparatus for an electronics rack.
  36. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
  37. Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Local condensation control for liquid impingement two-phase cooling.
  38. Cader, Tahir; Ressa, Robert J., Low momentum loss fluid manifold system.
  39. Cader,Tahir; Ressa,Robert J., Low momentum loss fluid manifold system.
  40. Eastman George Y. (Lancaster PA), Mechanically assisted evaporator surface.
  41. Pautsch, Gregory W., Method and apparatus for cooling electronic components.
  42. Gregory S. Cole ; Robert P. Scaringe, Method and two-phase spray cooling apparatus.
  43. Zrodnikov, Volodymyr; Kerner, James M.; Spokoiny, Michael, Method for conditioning a cooling loop of a heat exchange system.
  44. Pfahnl,Andreas C., Modular rackmount chiller.
  45. Olson Robert N. ; Bull William H., Modular, redundant, hot swappable, blind mate power supply system.
  46. Lopatinsky,Edward; Shostak,Naum; Fedoseyev,Lev, Multi-heatsink integrated cooler.
  47. Pautsch, Adam G.; Shedd, Timothy A., Multi-mode fluid cooling system and method.
  48. Edwards Michael Ray ; Morris Garron Koch ; Estes Kurt Arthur ; Pais Martin, Multi-mode, two-phase cooling module.
  49. Marsala, Joseph, Pumped liquid cooling system using a phase change refrigerant.
  50. Marsala, Joseph, Pumped liquid cooling system using a phase change refrigerant.
  51. Scherer, John; Tator, Ralph, Refrigeration system controlled by refrigerant quality within evaporator.
  52. Pokharna, Himanshu, Reversible two-phase and refrigeration loop.
  53. Chandrakant D. Patel ; Cullen E. Bash, Spray cooling system.
  54. Pautsch, Gregory W., Spray evaporative cooling system and method.
  55. Hertel James E. (Green Bay WI) Buxton Gerald W. (Shawano WI) Oliver Lawrence J. (Green Bay WI), Surface winder with recycled mandrels and method.
  56. Alyaser, Monem H.; Rice, Jeremy A., Thermal interposer liquid cooling system.
  57. Larson Ralph I. ; Phillips Richard L., Two phase component cooler.
  58. Puckett John Christopher, Two-phase constant-pressure closed-loop water cooling system for a heat producing device.
  59. Agostini, Bruno; Yesin, Berk, Two-phase cooling circuit.
  60. Shuja, Ahmed, Two-phase cooling for light-emitting devices.
  61. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for a laptop computer lid.
  62. Larson Ralph I. (Bolton MA) Phillips Richard L. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for laptop computers.
  63. Molivadas, Stephen, Two-phase heat-transfer systems.
  64. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madusudan K.; Simons, Robert E.; Singh, Prabjit, Two-phase, water-based immersion-cooling apparatus with passive deionization.
  65. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Michael J.; Iyengar, Madhusudan K.; Simons, Robert E.; Singh, Prabjit, Two-phase, water-based immersion-cooling apparatus with passive deionization.

이 특허를 인용한 특허 (1)

  1. Chen, Richard T.; Tan, Will J., Thermal management systems, methods for making, and methods for using.
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