Multifunction coolant manifold structures
원문보기
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
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출원번호 |
US-0828754
(2015-08-18)
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등록번호 |
US-9854713
(2017-12-26)
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발명자
/ 주소 |
- Krug, Jr., Francis R.
- Zoodsma, Randy J.
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출원인 / 주소 |
- INTERNATIONAL BUSINESS MACHINES CORPORATION
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
1 인용 특허 :
8 |
초록
▼
A cooling system is provided which includes, for instance, a coolant supply manifold, a multifunction coolant manifold structure, and multiple cooling structures. The multifunction coolant manifold structure includes a coolant-commoning manifold and an auxiliary coolant reservoir above and in fluid
A cooling system is provided which includes, for instance, a coolant supply manifold, a multifunction coolant manifold structure, and multiple cooling structures. The multifunction coolant manifold structure includes a coolant-commoning manifold and an auxiliary coolant reservoir above and in fluid communication with the coolant-commoning manifold. The multiple cooling structures are coupled in parallel fluid communication between the coolant supply and coolant-commoning manifolds to receive coolant from the supply, and exhaust coolant to the coolant-commoning manifold. The coolant-commoning manifold is sized to slow therein a flow rate of coolant exhausting from the multiple cooling structures to allow gas within the exhausting coolant to escape the coolant within the coolant-commoning manifold. The escaping gas rises to the auxiliary coolant reservoir and is replaced within the coolant-commoning manifold by coolant from the auxiliary coolant reservoir.
대표청구항
▼
1. A method comprising: providing a cooling system, the providing of the cooling system including: providing a coolant loop comprising a coolant;providing a heat exchange assembly coupled to the coolant loop to cool coolant within the coolant loop;providing a coolant supply manifold coupled to the c
1. A method comprising: providing a cooling system, the providing of the cooling system including: providing a coolant loop comprising a coolant;providing a heat exchange assembly coupled to the coolant loop to cool coolant within the coolant loop;providing a coolant supply manifold coupled to the coolant loop;providing a multifunction coolant manifold structure to deaerate the coolant, the multifunction coolant supply manifold structure being coupled to the coolant loop and being separate from the heat exchange assembly, the multifunction coolant supply manifold structure including: a coolant-commoning manifold;an auxiliary coolant reservoir disposed above and in fluid communication with the coolant-commoning manifold; andproviding multiple cooling structures coupled to the coolant loop in parallel fluid communication between the coolant supply manifold and the coolant-commoning manifold to receive coolant from the coolant supply manifold, and exhaust coolant to the coolant-commoning manifold;providing a coolant pumping assembly coupled to circulate coolant through the coolant loop, without the coolant passing through the auxiliary coolant reservoir, the multifunction coolant manifold structure comprising a coolant distribution manifold portion with multiple coolant distribution connections therein for coupling the coolant pumping assembly in fluid communication therewith, wherein the multifunction coolant manifold structure comprises both the coolant-commoning manifold and the coolant distribution manifold portion integrated together in a single structure, and wherein the coolant-commoning manifold is sized larger than the coolant supply manifold; andwherein the multifunction coolant manifold structure deaerates the coolant by the coolant-commoning manifold being sized larger than the coolant supply manifold to slow therein a flow rate of coolant exhausting from the multiple cooling structures as the coolant enters the coolant-commoning manifold to allow gas within the exhausting coolant to escape the coolant within the coolant-commoning manifold, the escaping gas within the coolant-commoning manifold rising to the auxiliary coolant reservoir, and being replaced within the coolant-commoning manifold by coolant from the auxiliary coolant reservoir. 2. The method of claim 1, wherein the multifunction coolant manifold structure is a single, integrated and rigid structure, and wherein the coolant-commoning manifold has a larger dimension in a first direction compared with that of the auxiliary coolant reservoir, and the auxiliary coolant reservoir has a larger dimension in a second direction compared with that of the coolant-commoning manifold. 3. The method of claim 2, wherein the first direction is a vertical direction, and the second direction is a horizontal direction. 4. The method of claim 1, wherein the auxiliary coolant reservoir is coupled in fluid communication with the coolant-commoning manifold via a detachable coolant conduit. 5. The method of claim 4, wherein the multifunction coolant manifold structure comprises a field-replaceable unit, the field-replaceable unit comprising the auxiliary coolant reservoir, and including one or more components for at least one of monitoring or controlling one or more characteristics of the coolant within the multifunction coolant manifold structure. 6. The method of claim 5, wherein the multifunction coolant manifold structure is configured for the field-replaceable unit to be replaceable while the cooling system is operational, with coolant exhausting from the multiple cooling structures to the coolant-commoning manifold of the multifunction coolant manifold structure. 7. The method of claim 1, wherein the coolant pumping assembly comprises at least two modular pumping units coupled in parallel fluid communication to the multifunction coolant manifold structure for pumping coolant in parallel from the multifunction coolant manifold structure. 8. The method of claim 1, further comprising providing a coolant fill port within the auxiliary coolant reservoir, below a top of the auxiliary coolant reservoir to assist in defining a gas pocket in an upper portion thereof as a coolant expansion region. 9. The method of claim 1, wherein the auxiliary coolant reservoir further comprises a vacuum breaker to prevent cavitation within the cooling system, and a pressure-relief valve to prevent the cooling system from over-pressurizing. 10. The method of claim 1, further comprising providing one or more coolant level sensors associated with the auxiliary coolant reservoir to sense level of coolant within the multifunction coolant manifold structure.
이 특허에 인용된 특허 (8)
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Calvin Donald R. ; Calvin Thomas B., Atmospheric liquid heater.
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Tilton,Charles L.; Tilton,Donald E.; Palmer,Randal T.; Hyde,Tony E., Globally cooled computer system.
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Tustaniwskyj Jerry I. (Mission Viejo CA) Halkola Kyle G. (San Diego CA), Leak tolerant liquid cooling system.
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Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Liquid-based cooling apparatus for an electronics rack.
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Corrado,Joseph P.; Eberth,John F.; Mazzuca,Steven J.; Schmidt,Roger R.; Tsukamoto,Takeshi, Method and apparatus for cooling electronic components.
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Ghiraldi Alberto (Via Palatino 8 Milan ; 20148 ITX), Method and container device for the protection and thermal conditioning of apparatus, in particular electronic apparatus.
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Waters Michael A. (Elk Grove Village IL), Passive mold cooling and heating system.
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Hosono Isamu (Amagasaki JA) Shikano Yoshiro (Amagasaki JA), Vapor cooling device for semiconductor device.
이 특허를 인용한 특허 (1)
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Chen, Chien-An; Fan, Mu-Shu; Chen, Chien-Yu, Cooling liquid distribution device.
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