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Feedthrough assemblies

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/498
  • H01L-021/48
  • A61N-001/375
출원번호 US-0966101 (2015-12-11)
등록번호 US-9865533 (2018-01-09)
발명자 / 주소
  • Ruben, David A
  • Sandlin, Michael S
출원인 / 주소
  • Medtronic, Inc.
인용정보 피인용 횟수 : 0  인용 특허 : 34

초록

Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-co

대표청구항

1. A feedthrough assembly comprising a non-conductive substrate and a feedthrough, the feedthrough comprising: a via from an outer surface to an inner surface of the non-conductive substrate;a conductive material disposed in the via; andan external contact disposed over the via on the outer surface

이 특허에 인용된 특허 (34)

  1. Dahlberg Kenneth,SEX ; Lindegren Ulf,SEX, Active medical implant having a hermetically sealed capsule and method for making same.
  2. Ruben, David A., Apparatus and method for laser welding of ribbons.
  3. Ruben,David A.; Sleeper,Scott B.; Tortorici,Peter C., Assembly including a circuit and an encapsulation frame, and method of making the same.
  4. Engmark, David B.; Grose, Gary M.; Schaefer, Todd H.; Ceballos, Thomas I.; Ries, Andrew J., Assembly method for implantable medical device.
  5. Geusic,Joseph E.; Reinberg,Alan R., Conductive material patterning methods.
  6. Deininger, Steve T.; Clayton, Jeffrey J., Connector header for implantable medical device.
  7. Barror, Michael William; Verhoef, William D.; Yamamoto, Joyce K.; Wentink, Robert S.; Haubrich, Gregory J., External RF telemetry module for implantable medical devices.
  8. Iyer, Rajesh V.; Goldman, Simon E.; Miltich, Thomas P., Feedthrough assembly including electrical ground through feedthrough substrate.
  9. Fang, Zhi; Chen, Xingfu, Glass feedthrough assemblies for implantable medical devices.
  10. Fillion Raymond A. (Niskayuna NY) Kornrumpf William P. (Albany NY) Bernard Edward S. (Manlius NY), Hermetically packaged HDI electronic system.
  11. Fenner, Andreas Armin; Batchelder, Geoffrey; Gerrish, Paul F.; Larson, Lary R.; Malin, Anna J.; Marrott, Trevor D.; Mueller, Tyler; Ruben, David A., Hermeticity testing.
  12. Ruben, David A.; Ries, Andrew J.; Milla, Juan G.; Roles, Randy S.; Bruneau, Terry W.; Warren, Steve Craig; Parkin, David W.; Anderson, II, John V.; Day, John K.; Hemann, Jr., Robert V., Implantable medical device including a surface-mount terminal array.
  13. Ruben, David A.; Kinsey, Christopher T.; Galvin, Jeffrey L.; Sleeper, Scott B., Laser bonding tool with improved bonding accuracy.
  14. Pastel, Michelle Nicole Haase; Strines, Brian Paul, Mask and method for sealing a glass envelope.
  15. Hofmann, Alexander; Hierl, Stefan; Brunnecker, Frank, Method and apparatus for irradiation welding of two thermoplastic components.
  16. Kadowaki Akira (Mobara JPX) Itoh Shigeo (Mobara JPX) Kogure Youich (Mobara JPX) Tonegawa Takeshi (Mobara JPX), Method for sealedly forming envelope.
  17. Haisma Jan (Eindhoven NLX) Spierings Gijsbertus (Eindhoven NLX) Van Lierop Joseph G. (Eindhoven NLX) Van Den Berg Hendrik F. (Eindhoven NLX), Method of bonding together two bodies with silicon oxide and practically pure boron.
  18. Haisma Jan (Eindhoven NLX) Adema Cornelis L. (Eindhoven NLX) Alting Cornelis L. (Eindhoven NLX) Brehm Rudolf (Eindhoven NLX), Method of bonding two parts together.
  19. Freyman Bruce J. (N. Lauderdale FL) Dorinski Dale (Coral Springs FL) Shurboff John (Coral Springs FL), Method of making an ultra high density pad array chip carrier.
  20. Taguchi Yutaka (Osaka JPX) Eda Kazuo (Nara JPX) Kanaboshi Akihiro (Osaka JPX) Ogura Tetsuyoshi (Osaka JPX) Tomita Yoshihiro (Osaka JPX), Method of processing a piezoelectric device.
  21. Ding, Hanyi; Joseph, Alvin J.; Woods, Jr., Wayne H., Method, structure, and design structure for a through-silicon-via Wilkinson power divider.
  22. Srinivas Tadigadapa ; Chialun Tsai ; Yafan Zhang ; Nader Najafi, Micromachined fluidic apparatus.
  23. Park, Jin Woo, Organic light emitting display having a second frit portion configured to melt more easily than a frit portion.
  24. Lutz, Markus, SI wafer-cap wafer bonding method using local laser energy, device produced by the method, and system used in the method.
  25. Pichler,Karl; Frischknecht,Kyle D., Sealing of electronic device using absorbing layer for glue line.
  26. Fischer David J. (Arden Hills MN), Subcutaneous housing assembly.
  27. Haluzak,Charles C; Piehl,Arthur; Chen,Chien Hua; Shih,Jennifer, System and method for direct-bonding of substrates.
  28. Ruben, David A.; Sandlin, Michael S., Techniques for bonding substrates using an intermediate layer.
  29. Ruben, David A; Sandlin, Michael S, Techniques for bonding substrates using an intermediate layer.
  30. Heraly Neil H. (New Brighton MN), Temporary package for an electrical component.
  31. Krupetsky, Dmitriy; Schmid, Anthony P.; Ludwig, Paul N., Tuned sealing material for sealing of a flat panel display.
  32. Enquist, Paul M.; Tong, Qin-Yi; Fountain, Jr., Gaius Gillman; Markunas, Robert, Wafer bonding hermetic encapsulation.
  33. O'Brien, Richard J.; Day, John K.; Gerrish, Paul F.; Mattes, Michael F.; Ruben, David A.; Grief, Malcolm K., Wafer-scale package including power source.
  34. Tracy C. Edwin (Golden CO) Benson David K. (Golden CO), Welding/sealing glass-enclosed space in a vacuum.
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