초록 ▼

An electronic module includes a substrate, a metallic shielding cover, an electronic component and a piezoelectric element. The metallic shielding cover is disposed on the substrate and forms an accommodating chamber together with the substrate, wherein the metallic shielding cover has an opening, a

An electronic module includes a substrate, a metallic shielding cover, an electronic component and a piezoelectric element. The metallic shielding cover is disposed on the substrate and forms an accommodating chamber together with the substrate, wherein the metallic shielding cover has an opening, and the accommodating chamber is communicated with outside via the opening. The electronic component is disposed on the substrate and accommodated in the accommodating chamber. The piezoelectric element is adhered to the metallic shielding cover, wherein the piezoelectric element after being enabled is configured to bring a local portion of the metallic shielding cover for vibrating to change the volume of the accommodating chamber. In addition, a heat dissipation module is also disclosed.

대표청구항 ▼

1. An electronic module, comprising: a substrate;a metallic shielding cover, disposed on the substrate and forming an accommodating chamber together with the substrate, wherein the metallic shielding cover has an opening, and the accommodating chamber is communicated with outside via the opening;an

1. An electronic module, comprising: a substrate;a metallic shielding cover, disposed on the substrate and forming an accommodating chamber together with the substrate, wherein the metallic shielding cover has an opening, and the accommodating chamber is communicated with outside via the opening;an electronic component, disposed on the substrate and accommodated in the accommodating chamber; anda piezoelectric element, directly adhered to an inner-side of the metallic shielding cover without covering the opening, wherein the piezoelectric element after being enabled is configured to bring a local portion of the metallic shielding cover for vibrating to change volume of the accommodating chamber, and wherein the opening and the piezoelectric element are disposed at a same side of the accommodating chamber. 2. The electronic module as claimed in claim 1, wherein the metallic shielding cover comprises a side-wall and an upper cover, the side-wall stands on the substrate and surrounds the electronic component, and the upper cover is disposed on the side-wall. 3. The electronic module as claimed in claim 2, wherein the opening is on the side-wall. 4. The electronic module as claimed in claim 2, wherein the opening is on the upper cover. 5. The electronic module as claimed in claim 4, wherein the piezoelectric element and the upper cover form a buzzer. 6. The electronic module as claimed in claim 1, further comprising: two check valves, wherein the opening comprises a first opening and a second opening, the two check valves are respectively disposed at the first opening and the second opening, so that the first opening and the second opening respectively serve as an inlet and an outlet. 7. The electronic module as claimed in claim 6, wherein the two check valves respectively comprise a barrier, one of the two barriers is disposed at the first opening and located at inner-side of the upper cover, the other one of the two barriers is disposed at the second opening and located at outer-side of the upper cover, an airflow flows into the accommodating chamber from out of the accommodating chamber via the first opening and then flows out of the accommodating chamber from inside of the accommodating chamber via the second opening. 8. The electronic module as claimed in claim 1, wherein the substrate comprises a circuit board, and the electronic component comprises central processing unit (CPU), radio frequency integrated circuit (RF IC), charger integrated circuit (charger IC) or power amplifier (PA). 9. A heat dissipation module, comprising: a casing, having an accommodating chamber for accommodating a heat source, wherein the casing has an opening, and the accommodating chamber is communicated with outside via the opening; anda piezoelectric element, directly adhered to an inner-side of the casing without covering the opening, wherein the piezoelectric element after being enabled is configured to bring a local portion of the casing for vibrating to change volume of the accommodating chamber and make air flow into or out of the accommodating chamber via the opening, and wherein the opening and the piezoelectric element are disposed at a same side of the accommodating chamber. 10. The heat dissipation module as claimed in claim 9, further comprising: two check valves, wherein the opening comprises a first opening and a second opening, the two check valves are respectively disposed at the first opening and the second opening, so that the first opening and the second opening respectively serve as an inlet and an outlet, air flows into the accommodating chamber from out of the accommodating chamber via the first opening and then flows out of the accommodating chamber from inside of the accommodating chamber via the second opening. 11. An electronic module, comprising: a substrate;a metallic shielding cover, disposed on the substrate and forming an accommodating chamber together with the substrate, wherein the metallic shielding cover has a first opening and a second opening, and the accommodating chamber is communicated with outside via the first opening and the second opening;an electronic component, disposed on the substrate and accommodated in the accommodating chamber; anda piezoelectric element, adhered to the metallic shielding cover and between the first opening and the second opening without covering the first opening and the second opening, wherein the piezoelectric element after being enabled is configured to bring a local portion of the metallic shielding cover for vibrating to change volume of the accommodating chamber.