A capacitive fingerprint sensor that may be formed of an array of sensing elements. Each capacitive sensing element of the array may register a voltage that varies with the capacitance of a capacitive coupling. A finger may capacitively couple to the individual capacitive sensing elements of the sen
A capacitive fingerprint sensor that may be formed of an array of sensing elements. Each capacitive sensing element of the array may register a voltage that varies with the capacitance of a capacitive coupling. A finger may capacitively couple to the individual capacitive sensing elements of the sensor, such that the sensor may sense a capacitance between each capacitive sensing element and the flesh of the fingerprint. The capacitance signal may be detected by sensing the change in voltage on the capacitive sensing element as the relative voltage between the finger and the sensing chip is changed. Alternately, the capacitance signal may be detected by sensing the change in charge received by the capacitive sensing elements as the relative voltage between the finger and the sensing chip is changed.
대표청구항▼
1. An electronic device, comprising: a fingerprint sensor comprising: a sensor pad;a dielectric positioned above the sensor pad; andan electrically conductive ring surrounding the sensor pad and the dielectric, the electrically conductive ring at least partially elevated with respect to the sensor p
1. An electronic device, comprising: a fingerprint sensor comprising: a sensor pad;a dielectric positioned above the sensor pad; andan electrically conductive ring surrounding the sensor pad and the dielectric, the electrically conductive ring at least partially elevated with respect to the sensor pad and the dielectric;a modulating circuit electrically connected to the fingerprint sensor and configured to maintain the electrically conductive ring at a constant voltage having an absolute value less than four volts relative to a system ground, the modulating circuit configured to: provide a first modulated voltage to the sensor pad; andprovide a second modulated voltage to the sensor pad, the second modulated voltage lower than the first modulated voltage and greater than the system ground; wherein:a relative voltage difference between the first modulated voltage and the second modulated voltage is received by the sensor pad as a sensor pad supply voltage. 2. The electronic device as in claim 1, wherein one signal level of the first modulated voltage comprises a low voltage signal level. 3. The electronic device as in claim 1, wherein one signal level of the first modulated voltage comprises a high voltage signal level. 4. The electronic device as in claim 3, further comprising a boost circuit operably connected to the sensor pad and the modulating circuit and adapted to raise a power supply voltage level to the high voltage signal level. 5. The electronic device as in claim 3, wherein the high signal level is greater than a power supply voltage level. 6. The electronic device as in claim 1, further comprising a housing surrounding the electrically conductive ring, wherein the sensor pad is coupled to a button operably connected to the housing. 7. The electronic device as in claim 1, further comprising a housing surrounding a display surface, the sensor pad and the electrically conductive ring, wherein the sensor pad is disposed below the display surface. 8. The electronic device as in claim 1, wherein the modulating circuit is included in the fingerprint sensor. 9. The electronic device as in claim 8, wherein the sensor pad comprises a capacitive sensing element array. 10. A fingerprint sensing system, comprising: a sensor pad;a dielectric positioned over the sensor pad;an electrically conductive ring surrounding the sensor pad and the dielectric, wherein at least a portion of the electrically conductive ring is elevated with respect to the dielectric and the sensor pad such that the elevated portion of the electrically conductive ring is configured for contact by a finger; anda modulating circuit operably connected to the sensor pad and the electrically conductive ring, the modulating circuit adapted to maintain the electrically conductive ring at a substantially constant system ground voltage level and to provide to the sensor pad: a first modulated voltage greater than the system ground voltage level; anda second modulated voltage less than the first modulated voltage and greater than the system ground voltage level; whereina direct current voltage difference between the first modulated voltage and the second modulated voltage is received by the sensor pad as a sensor pad supply voltage; andthe second modulated voltage is received by the sensor pad as a sensor pad ground voltage level. 11. The fingerprint sensing system as in claim 10, wherein the sensor pad supply voltage comprises a low voltage signal level having an absolute value less than four volts relative to the second modulated voltage. 12. The fingerprint sensing system as in claim 10, wherein the first modulated voltage has a peak-to-peak voltage that is greater than a system power supply signal level. 13. The fingerprint sensing system as in claim 12, further comprising a boost circuit electrically connected to the sensor pad and the modulating circuit and adapted to generate the first modulated voltage. 14. The fingerprint sensing system as in claim 10, wherein the sensor pad is coupled to a depressible button. 15. The fingerprint sensing system as in claim 10, further comprising a housing surrounding a display surface, wherein the sensor pad is disposed below the display surface. 16. A method for operating a fingerprint sensor comprising a sensor pad, a dielectric positioned above the sensor pad, and an elevated electrically conductive ring adjacent to and surrounding the dielectric, the method comprising: when a finger is in contact with the dielectric and the electrically conductive ring: applying, by the sensor pad, a first modulated signal to at least one capacitive sensing element of the sensor pad when a voltage supply received by the sensor pad is in a low state and the electrically conductive ring is held at a system ground;obtaining, by the sensor pad, a first sense signal from the at least one capacitive sensing when the voltage supply received by the sensor pad is in the low voltage state and the electrically conductive ring is held at a system ground;applying, by the sensor pad, a second modulated signal to the at least one capacitive sensing element of the sensor pad when the voltage supply received by the sensor pad is in a high state and the electrically conductive ring is held at a system ground;obtaining, by the sensor pad, a second sense signal from the at least one capacitive sensing element when the voltage supply received by the sensor pad is in the high voltage state and the electrically conductive ring is held at the system ground; andconstructing an image of a portion of the finger based, at least in part, on the first sense signal and second sense signal. 17. The method of claim 16, wherein, when in the low voltage state, a ground reference of the sensor pad is at the system ground. 18. The method of claim 16, wherein, when in the high voltage state, a ground reference of the sensor pad is at a boosted ground level that is higher than the system ground. 19. The method of claim 18, wherein the boosted ground level is provided by a boost circuit.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (101)
Perezselsky, Armando Leon; Nelson, Richard Brian, Apparatus and method for electrostatic discharge protection.
Nelson, Richard Brian; Erhart, Richard Alexander; Perezselsky, Armando Leon, Apparatus and method for protecting fingerprint sensing circuitry from electrostatic discharge.
Koichiro Katabami JP, Apparatus for detecting an approaching conductor, or an approach point of a conductor and an electrostatic capacity type touch panel apparatus.
Pope, Benjamin J.; Arnold, Shawn; Corlett, Barry J.; Gilton, Terry L.; Husaini, Syed; Webster, Steven; Myers, Scott A.; Hill, Matthew D.; Lyon, Benjamin B., Capacitive sensor packaging.
Pope, Benjamin J.; Arnold, Shawn; Corlett, Barry J.; Gilton, Terry L.; Husaini, Syed; Webster, Steven; Myers, Scott A.; Hill, Matthew D.; Lyon, Benjamin B., Capacitive sensor packaging.
Ganapathi, Srinivasan Kodaganallur; Buchan, Nicholas Ian; Burns, David William; Smith, Thad William; Opris, Ion Elinor, Controller architecture for combination touch, handwriting and fingerprint sensor.
Schneider, John K.; Kitchens, Jack C.; Gojevic, Stephen M.; Dickinson, Timothy A.; Gupta, Samir K.; Djordjev, Kostadin D.; Burns, David William; Fennell, Leonard E.; Ganti, Suryaprakash, Display with backside ultrasonic sensor array.
Bussat, Jean-Marie; Franza, Gordon S.; Gozzini, Giovanni, Finger biometric sensor including stacked die each having a non-rectangular shape and related methods.
Guerrero, Alexander; Franza, Gordon S.; Sherlock, Peter E., Finger sensing apparatus with selectively operable transmitting/receiving pixels and associated methods.
Morita, Takeo; Nagayama, Keiichi; Ishii, Hirotaka; Yomo, Yasuhide; Kasai, Eiji, Fingerprint identification device-equip with a touch sensor for detecting a human finger.
Setlak Dale R. ; Van Vonno Nicolass W. ; Newton Mike ; Salatino Matthew M., Fingerprint sensor including an anisotropic dielectric coating and associated methods.
Setlak, Dale R.; Williams, Daryl; Salatino, Matthew M., Fingerprint sensor package having enhanced electrostatic discharge protection and associated methods.
Purushothaman, Sampath; Rothwell, Mary E.; Shahidi, Ghavam Ghavami; Yu, Roy Rongqing, Lock and key through-via method for wafer level 3D integration and structures produced.
Joblot, Sylvain; Farcy, Alexy; Carpentier, Jean-Francois; Bar, Pierre, Semiconductor device comprising a capacitor and an electrical connection via, and fabrication method.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.