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A dense array of semiconductor single crystalline semiconductor nanocrystals is provided in the present application by forming an amorphous semiconductor material layer surrounding a plurality of patterned nanostructures comprised of a single crystalline semiconductor material portion. A thermal ann

A dense array of semiconductor single crystalline semiconductor nanocrystals is provided in the present application by forming an amorphous semiconductor material layer surrounding a plurality of patterned nanostructures comprised of a single crystalline semiconductor material portion. A thermal anneal, i.e., (solid phase epitaxy), is then performed to crystallize a portion of the amorphous semiconductor material layer that is in contact with each single crystalline semiconductor material portion and to provide a plurality of spaced apart single crystalline nanocrystals on a surface of an insulator. A remaining portion of the amorphous semiconductor material layer that was not crystallized is thereafter removed.

대표청구항 ▼

1. A method of forming a semiconductor structure, said method comprising: forming a plurality of spaced apart pillars on an insulator layer, wherein each spaced apart pillar of the plurality of spaced apart pillars comprises a single crystalline semiconductor material portion;forming an amorphous se

1. A method of forming a semiconductor structure, said method comprising: forming a plurality of spaced apart pillars on an insulator layer, wherein each spaced apart pillar of the plurality of spaced apart pillars comprises a single crystalline semiconductor material portion;forming an amorphous semiconductor material layer in direct physical contact with at least a topmost surface and each sidewall surface of each single crystalline semiconductor material portion of said plurality of spaced apart pillars;performing a thermal anneal to crystallize a portion of said amorphous semiconductor material layer that is in contact with each single crystalline semiconductor material portion and to convert said crystallized portion of said amorphous semiconductor material and each single crystalline semiconductor portion into a plurality of single crystalline semiconductor nanocrystals; andremoving a remaining non-crystallized portion of said amorphous semiconductor material layer. 2. The method of claim 1, wherein prior to said forming said amorphous semiconductor material layer, said insulator layer is etched to provide an insulator layer portion having an undulating surface and containing a mesa structure located directly beneath said single crystalline single material portion, wherein said mesa structure has vertical sidewalls that do not extend beyond vertical sidewalls of said single crystalline single material portion. 3. The method of claim 2, wherein after performing said thermal anneal, a portion of said mesa structure of said insulator layer portion protrudes into a lower portion of each of said single crystalline semiconductor nanocrystals. 4. The method of claim 1, wherein after said removing said remaining portions of said amorphous semiconductor layer, said insulator layer is etched to provide an insulator layer portion having an undulating surface and containing a mesa structure located directly beneath each of said single crystalline semiconductor nanocrystals, wherein said mesa structure has vertical sidewalls that do not extend beyond vertical sidewalls of said single crystalline semiconductor nanocrystals. 5. The method of claim 1, wherein each of said single crystalline semiconductor nanocrystals has a diameter of less than 20 nm and is spaced apart for its nearest neighboring single crystalline semiconductor nanocrystal by a distance of 20 nm or less. 6. The method of claim 5, wherein each of said single crystalline semiconductor nanocrystals is a nanoball or a nanorod. 7. The method of claim 1, wherein said forming said plurality of spaced apart pillars comprises: providing a semiconductor-on-insulator substrate of, from bottom to top, a handle substrate, said insulator layer, and a single crystalline semiconductor material layer;forming a hard mask layer on a surface of said single crystalline semiconductor material layer;patterning said hard mask layer and said single crystalline semiconductor material layer to provide a patterned stack of, from bottom to top, said single crystalline semiconductor material portion and a remaining portion of said hard mask layer; andremoving said remaining portion of said hard mask layer. 8. The method of claim 7, wherein after removing said remaining portion of said hard mask layer and prior to forming said amorphous semiconductor layer, said single crystalline semiconductor material portion is reshaped by annealing. 9. The method of claim 1, wherein said amorphous semiconductor material layer and said single crystalline semiconductor material portion each comprises a first semiconductor material, and wherein an entirety of each of said single crystalline semiconductor nanocrystals comprises said first semiconductor material. 10. The method of claim 1, wherein said single crystalline semiconductor material portion comprises a first semiconductor material and said amorphous semiconductor material layer comprises a second semiconductor material that is different from the first semiconductor material, and wherein each of said single crystalline semiconductor nanocrystals comprises a core of said first semiconductor material and a shell of said second semiconductor material and wherein a strain is present between said core and said shell.