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In embodiments, the present invention may attach at least two isolated electronic components to an elastomeric substrate, and arrange an electrical interconnection between the components in a boustrophedonic pattern interconnecting the two isolated electronic components with the electrical interconn

In embodiments, the present invention may attach at least two isolated electronic components to an elastomeric substrate, and arrange an electrical interconnection between the components in a boustrophedonic pattern interconnecting the two isolated electronic components with the electrical interconnection. The elastomeric substrate may then be stretched such that the components separate relative to one another, where the electrical interconnection maintains substantially identical electrical performance characteristics during stretching, and where the stretching may extend the separation distance between the electrical components to many times that of the unstretched distance.

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1. A stretchable integrated circuit (IC) system comprising: a flexible substrate;a first device island mounted to the flexible substrate and comprising a first integrated circuit (IC) device fabricated from a rigid semiconductor material;a second device island mounted to the flexible substrate and c

1. A stretchable integrated circuit (IC) system comprising: a flexible substrate;a first device island mounted to the flexible substrate and comprising a first integrated circuit (IC) device fabricated from a rigid semiconductor material;a second device island mounted to the flexible substrate and comprising a second integrated circuit (IC) device fabricated from a rigid semiconductor material; anda flexible electrical interconnect electrically connecting the first IC device to the second IC device, such that a distance between the first IC device and the second IC device can be changed while maintaining an electrical connection between the first IC device and the second IC device. 2. The stretchable IC system of claim 1, wherein at least one of the first IC device and the second IC device comprises a physical sensor, a biological sensor, a chemical sensor, a light emitting diode (LED), or any combination thereof. 3. The stretchable IC system of claim 2, wherein the at least one of the first IC device and the second IC device comprises the physical sensor, the physical sensor includes at least one of a temperature sensor, a pH sensor, a light sensor, a radiation sensor, a pressure sensor, and a contact sensor. 4. The stretchable IC system of claim 2, wherein the at least one of the first IC device and the second IC device comprises the biological sensor, the biological sensor includes at least one of an electrophysiological sensor, a skin temperature sensor, and a skin pH sensor. 5. The stretchable IC system of claim 1, wherein at least one of the first IC device and the second IC device comprises an amplifier, a buffer, an A/D converter, a D/A converter, an optical collector, an electro-mechanical transducer, a piezeo-electric actuator, or any combination thereof. 6. The stretchable IC system of claim 1, wherein the first IC device comprises a high performance microprocessor and the second IC device comprises a physical sensor, a biological sensor, a chemical sensor, an LED, or any combination thereof. 7. The stretchable IC system of claim 1, wherein the first device island and the second device island are coated in a flexible polymeric material. 8. The stretchable IC system of claim 1, wherein the first device island, the second device island, and the flexible electrical interconnect are encapsulated by a flexible encapsulation layer. 9. The stretchable IC system of claim 1, wherein the flexible substrate, the first device island, the second device island, and the flexible electrical interconnect are encapsulated by a fluid layer, and the fluid layer is encapsulated by a flexible encapsulation layer. 10. The stretchable IC system of claim 1, wherein the first device island and the second device island are adhered to the flexible substrate, and wherein the flexible electrical interconnect lacks adhesion to the substrate. 11. The stretchable IC system of claim 1, wherein the first device island and the second device island are adhered to a first horizontal surface of the flexible substrate and the flexible electrical interconnect is spaced from a second horizontal surface of the flexible substrate. 12. The stretchable IC system of claim 11, wherein the second horizontal surface of the flexible substrate includes a wavy form which permits the flexible substrate to expand during stretching. 13. The stretchable IC system of claim 11, wherein the first device island and the second device island are adhered to a first horizontal surface of a flexible encapsulation layer and the flexible electrical interconnect is spaced from a second horizontal surface of the flexible encapsulation layer, wherein the flexible encapsulation layer encases the first device island, the second device island, and the flexible electrical interconnect between the flexible substrate and the flexible encapsulation layer. 14. The stretchable IC system of claim 1, wherein the flexible electrical interconnect is a single-piece electrically conductive body. 15. The stretchable IC system of claim 1, wherein the distance between the first IC device and the second IC device is increased by 1000%. 16. The stretchable IC system of claim 1, wherein the flexible electrical interconnect is configured to maintain the electrical connection between the first IC device and the second IC device when the first IC device and the second IC device are twisted up to approximately 180 degrees relative to one another. 17. The stretchable IC system of claim 1, wherein the flexible electrical interconnect is configured to maintain the electrical connection between the first IC device and the second IC device when the flexible electrical interconnect is stretched by 1000%. 18. The stretchable IC system of claim 1, wherein the flexible electrical interconnect is configured to maintain the electrical connection between the first IC device and the second IC device when the flexible substrate is subjected to a translational stretching or a rotational stretching. 19. The stretchable IC system of claim 13, wherein responsive to the translational stretching of the flexible substrate, the distance between the first IC device and the second IC device is increased by 1000%. 20. The stretchable IC system of claim 13, wherein responsive to the rotational stretching of the flexible substrate, the first IC device and the second IC device are rotated up to approximately 180 degrees relative to one another. 21. The stretchable IC system of claim 1, wherein the flexible electrical interconnect is made from a semiconductor material. 22. The stretchable IC system of claim 18, wherein the semiconductor material of the flexible electrical interconnect is the same or substantially the same as the rigid semiconductor material. 23. The stretchable IC system of claim 1, wherein the first IC device and the second IC device each comprises a thin membrane semiconductor having a width or diameter of about 10-100 micrometers (μm).