System architecture for combined static and pass-by processing
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C23C-014/34
C23C-014/50
C23C-014/56
출원번호
US-0728145
(2012-12-27)
등록번호
US-9914994
(2018-03-13)
발명자
/ 주소
Leahey, Patrick
Lawson, Eric
Liu, Charles
Bluck, Terry
Fairbairn, Kevin P.
Ruck, Robert L.
Harkness, IV, Samuel D.
출원인 / 주소
INTEVAC, INC.
대리인 / 주소
Womble Bond Dickinson (US) LLP
인용정보
피인용 횟수 :
0인용 특허 :
9
초록▼
Disclosed is a substrate processing system which enables combined static and pass-by processing. Also, a system architecture is provided, which reduces footprint size. The system is constructed such that the substrates are processed therein vertically, and each chamber has a processing source attach
Disclosed is a substrate processing system which enables combined static and pass-by processing. Also, a system architecture is provided, which reduces footprint size. The system is constructed such that the substrates are processed therein vertically, and each chamber has a processing source attached to one sidewall thereof, wherein the other sidewall backs to a complementary processing chamber. The chamber system can be milled from a single block of metal, e.g., aluminum, wherein the block is milled from both sides, such that a wall remains and separates each two complementary processing chambers.
대표청구항▼
1. A system for processing substrates, comprising: a loading chamber for introducing substrates from atmospheric environment into vacuum environment;a loading arrangement for loading substrates onto substrate carriers inside the vacuum environment;a heating chamber forming a static processing chambe
1. A system for processing substrates, comprising: a loading chamber for introducing substrates from atmospheric environment into vacuum environment;a loading arrangement for loading substrates onto substrate carriers inside the vacuum environment;a heating chamber forming a static processing chamber for heating the substrate while the carrier is stationary;a pass-by processing chamber attached to the heating chamber and having a transport section and a processing section, wherein the transport section is wider than width of the substrate, such that an entering carrier from the heating chamber can be accommodated within the pass-by processing chamber before a sputtering process is completed in the processing section on an entire surface of the prior substrate;a transport mechanism configured to transport the carrier in the transport section at a transport speed until the carrier catches-up with another carrier that is already being processed in the processing section of the pass-by processing chamber, and to transport the carrier in the processing section at a pass-by speed, wherein the transport speed is faster than the pass-by speed;a loading lifter arrangement configured to load substrates into the loading chamber;an unloading lifter arrangement configured to remove substrates from the loading chamber;wherein each of the loading lifter and unloading lifter arrangements comprises:a retractable blade housing having a vacuum sealing plate at an upper end thereof;a lifting blade movable inside the retractable blade housing; and,a vertical motion mechanism coupled to the retractable blade housing and the lifting blade and vertically moving the retractable blade housing and the lifting blade. 2. The system of claim 1, wherein the transport mechanism comprises a plurality of wheels that are provided at the base of the static processing chamber and the pass-by processing chamber, and wherein selected wheels are energized independently. 3. The system of claim 1, wherein the transport section and the processing section are defined within a single un-partitioned enclosure. 4. The system of claim 1, further comprising a first translator configured for loading substrates onto substrate carriers and a second translator configured for removing substrates from the substrate carriers. 5. The system of claim 4, wherein the loading chamber comprises: a first loadlock arrangement configured for introducing substrates to the first translator, and a second loadlock arrangement configured for accepting substrates from the second translator. 6. The system of claim 5, wherein the loading lifter arrangement is configured for loading substrates onto the first loadlock arrangement, and the unload lifter arrangement is configured for removing substrates from the second loadlock arrangement. 7. The system of claim 6, wherein the first loadlock arrangement comprises two loadlock chambers and the second loadlock arrangement comprises two loadlock chambers. 8. The system of claim 7, wherein the loading lifter arrangement comprises two lifters and the unloading lifter arrangement comprises two lifters. 9. The system of claim 8, further comprising a first robot arm configured for loading substrates from cassettes and onto the loading lifter arrangement and a second robot arm configured for unloading substrates from the unloading lifter arrangement and onto cassettes. 10. The system of claim 9, wherein each of the first and second robot arms is retractable and rotatable. 11. A linear system for processing substrates in vacuum, comprising: a first linear arrangement of chambers, the first linear arrangement maintaining vacuum environment and having passages enabling substrate carriers to move from one chamber directly to the next in a first traveling direction;a second linear arrangement of chambers, the second linear arrangement maintaining vacuum environment and having passages enabling substrate carriers to move from one chamber directly to the next in a second traveling direction opposite the first traveling direction;a loading chamber positioned at entry side of the first linear arrangement and configured to introduce substrates from atmospheric environment into the vacuum environment maintained by the first linear chamber arrangement;an unloading chamber positioned at exit side of the second linear arrangement and configured to remove substrates from the vacuum environment maintained by the second linear chamber arrangement out to atmospheric environment;a turning chamber connected to exit side of the first linear arrangement and to entry side of the second linear arrangement and configured to accept substrate carriers from the first linear arrangement and deliver the substrate carriers to the second linear arrangement;a loading lifter configured to load substrates into the loading chamber;an unloading lifter configured to remove substrates from the unloading chamber;wherein each of the loading lifter and unloading lifter comprises:a retractable blade housing having a vacuum sealing plate at an upper end thereof;a lifting blade movable inside the retractable blade housing; and,a vertical motion mechanism coupled to the retractable blade housing and the lifting blade and vertically moving the retractable blade housing and the lifting blade. 12. The system of claim 11, wherein each of the first linear arrangement and the second linear arrangement comprises at least one static processing chamber and at least one pass-by processing chamber, the pass-by processing chamber having a processing zone defined therein; and, a substrate carrier transport mechanism configured to:maintain the substrate carriers stationary during processing inside the static processing chamber;move the substrate carriers at transport speed while the substrate carrier is moved inside the pass-by processing chamber, but outside the processing zone, until one carrier catches-up with another carrier that is already being processed in the processing section of the pass-by processing chamber; and,move the substrate carriers at pass-by speed while the substrate carrier is moved inside the pass-by processing chamber inside the processing zone, wherein the transport speed is faster than the pass-by speed. 13. The system of claim 11, wherein each of the loading lifter and unloading lifter comprises: a first motor coupled to the retractable blade housing; and,a second motor coupled to the lifting blade. 14. The system of claim 13, further comprises: loading robot arm configured to remove substrates from cassettes and deliver the substrates to the loading lifter; and,an unloading robot arm configured to remove substrates from the unloading lifter and deliver the substrates to the cassettes. 15. The system of claim 14, wherein each of the loading robot arm and unloading robot arm is rotatable about an axis and is configured to rotate substrates between horizontal orientation and vertical orientation.
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이 특허에 인용된 특허 (9)
Hollars Dennis R. (Los Gatos CA) Waltrip Delbert F. (San Jose CA) Zubeck Robert B. (Los Altos CA) Bonigut Josef (Alamo CA) Smith Robert M. (Antioch CA) Payne Gary L. (Sunnyvale CA) Lee Kenneth (Sarat, Apparatus and method for high throughput sputtering.
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