Implantable medical device for minimally-invasive insertion
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-005/00
A61M-005/172
A61B-005/07
A61B-005/00
출원번호
US-0135782
(2013-12-20)
등록번호
US-9919103
(2018-03-20)
발명자
/ 주소
Farra, Robert
출원인 / 주소
MICROCHIPS BIOTECH, INC.
대리인 / 주소
Eversheds Sutherland (US) LLP
인용정보
피인용 횟수 :
0인용 특허 :
28
초록▼
Containment devices and methods of manufacture and assembly are provided. In an embodiment, the containment device includes an elongated microchip element comprising one or more containment reservoirs that are configured to be electrically activated to open. The containment device also include an el
Containment devices and methods of manufacture and assembly are provided. In an embodiment, the containment device includes an elongated microchip element comprising one or more containment reservoirs that are configured to be electrically activated to open. The containment device also include an elongated electronic printed circuit board (PCB) comprising a substrate. The elongated PCB comprises a first side on which one or more electronic components are fixed and an opposed second side on which the elongated microchip element is fixed in electrical connection to the one or more electronic components. Further, the containment device includes an elongated housing fixed to the elongated PCB. The elongated housing is configured to hermetically seal the one or more electronic components of the elongated PCB within the elongated housing.
대표청구항▼
1. A containment device, comprising: an elongated microchip element comprising one or more containment reservoirs that are configured to be electrically activated to open;an elongated electronic printed circuit board (PCB) which comprises a biocompatible and hermetic substrate material, wherein the
1. A containment device, comprising: an elongated microchip element comprising one or more containment reservoirs that are configured to be electrically activated to open;an elongated electronic printed circuit board (PCB) which comprises a biocompatible and hermetic substrate material, wherein the elongated PCB comprises a first side on which one or more electronic components are fixed and an opposed second side on which the elongated microchip element is fixed in electrical connection to the one or more electronic components without using a feedthrough to operably connect the microchip element to the PCB; andan elongated housing fixed to the elongated PCB, wherein the elongated housing and the elongated PCB together form a hermetic enclosure around the one or more electronic components. 2. The containment device of claim 1, wherein at least a portion of the elongated housing comprises a generally cylindrical body. 3. The containment device of claim 1, wherein the elongated housing comprises a battery chamber configured to house one or more batteries therein. 4. The containment device of claim 3, wherein the battery chamber comprises a cover configured to hermetically seal the one or more batteries within the battery chamber. 5. The containment device of claim 1, wherein the elongated housing is formed of a biocompatible metal or alloy. 6. The containment device of claim 1, wherein the biocompatible and hermetic substrate material comprises glass, alumina, or another ceramic. 7. The containment device of claim 1, wherein the elongated PCB comprises at least one via configured to electrically connect at least one of the one or more electronic components to the elongated microchip element. 8. The containment device of claim 7, wherein the at least one via is electrically connected to a metallized conductive surface on the second side of the elongated PCB, and wherein the metallized conductive surface is wirebonded to the elongated microchip element. 9. The containment device of claim 8, wherein a biocompatible coating substance is positioned over the wire bond to secure and protect the connection and create an atraumatic surface about the containment device. 10. The containment device of claim 9, wherein the biocompatible coating substance, the elongated microchip element, and the elongated housing collectively form a generally circular cross-section and rounded distal end of the containment device. 11. The containment device of claim 1, wherein the one or more containment reservoirs comprise microreservoirs containing a drug formulation or a sensor element. 12. The containment device of claim 1, wherein the elongated microchip element comprises: a silicon substrate having a first side, an opposed second side, and at least one aperture extending therethrough, wherein the first side of the silicon substrate comprises an electrically conductive reservoir cap which closes off the at least one aperture;a primary substrate which is formed of silicon or other metalloid, a polymer, or a glass or other ceramic material, wherein the primary substrate has at least one of the one or more containment reservoirs which is defined by a closed end wall, an open end, and at least one sidewall extending between the closed end wall and the open end; andreservoir contents positioned within the at least one of the one or more containment reservoirs,wherein the second side of the silicon substrate is hermetically bonded to the primary substrate such that the open end of the reservoir is in fluid communication with the at least one aperture for controlled release or exposure of reservoir contents. 13. The containment device of claim 12, wherein the silicon substrate has a thickness that is between 5% and 50% of the thickness of the primary substrate at the bonded interfaces of the substrates. 14. The containment device of claim 12, wherein the primary substrate comprises a metal coating over at least a part of the polymer, glass or other ceramic material of the primary substrate. 15. The containment device of claim 14, wherein the metal coating coats the at least one sidewall and/or the closed end wall of the at least one of the one or more containment reservoirs. 16. The containment device of claim 12, wherein the second side of the silicon substrate comprises at least one ring structure formed thereon. 17. The containment device of claim 16, wherein the at least one ring structure comprises gold or another metal. 18. The containment device of claim 16, wherein the primary substrate comprises at least one groove structure, wherein the at least one ring structure and the at least one groove structure are configured to form a hermetic bond. 19. The containment device of claim 16, wherein the surface of the primary substrate in and/or adjacent to the at least one groove structure comprises a metal coating. 20. The containment device of claim 19, wherein the metal coating comprises gold. 21. The containment device of claim 1, wherein the elongated housing comprises titanium. 22. A containment device, comprising: a microchip element comprising one or more containment reservoirs that are configured to be electrically activated to open;an electronic printed circuit board (PCB) comprising a biocompatible and hermetic substrate, wherein the PCB comprises a first side on which one or more electronic components are fixed and an opposed second side on which the microchip element is directly fixed, without an interposed feedthrough, in electrical connection to the one or more electronic components; anda housing fixed to the PCB, wherein the housing and the PCB together are configured to hermetically seal the one or more electronic components of the PCB within the housing,wherein the containment device comprises an elongated tubular structure configured to be injected in a human or animal subject. 23. A method of assembling a containment device, comprising: providing an elongated microchip element comprising one or more containment reservoirs that are configured to be electrically activated to open;fixing the elongated microchip element to a first side of an elongated electronic printed circuit board (PCB) which comprises a biocompatible and hermetic substrate without using a feedthrough to connect the elongated microchip element to the PCB;electrically connecting the elongated microchip element to one or more electronic components which are fixed on a second side of the elongated PCB; andhermetically sealing the one or more electronic components of the elongated PCB within an elongated housing that is fixed to the elongated PCB. 24. The method of claim 23, wherein providing the elongated microchip element further comprises: microfabricating a silicon substrate having a first side, an opposed second side, and at least one aperture extending therethrough, wherein the first side comprises an electrically conductive reservoir cap which closes off the at least one aperture;casting or molding a polymer or a glass or other ceramic material to form a primary substrate having at least one of the one or more reservoirs which is defined by a closed end wall, an open end, and at least one sidewall extending between the closed end wall and the open end;providing reservoir contents within the at least one of the one or more reservoirs; andbonding the silicon substrate to the primary substrate such that the open end of the reservoir is in fluid communication with the at least one aperture. 25. The method of claim 24, wherein the silicon substrate has a thickness that is between 5% and 50% of the thickness of the primary substrate at the bonded interfaces of the substrates. 26. The method of claim 24, wherein the microfabricating step further comprises forming at least one ring structure on the second side of the silicon substrate. 27. The method of claim 24, wherein the primary substrate comprises at least one groove structure and the step of bonding comprises compression cold welding the at least one ring structure together with the at least one groove structure. 28. The method of claim 23, wherein the elongated housing comprises a biocompatible metal and the substrate of the PCB comprises glass, alumina, or another ceramic.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (28)
Prescott,James H.; Kreiger,Timothy; Proos,Elizabeth R., Control of drug release by transient modification of local microenvironments.
Maloney,John M.; Sbiaa,Zouhair; Santini, Jr.,John T.; Sheppard, Jr.,Norman F.; Uhland,Scott A., Fabrication methods and structures for micro-reservoir devices.
Fenner Andreas A. ; Larson Lary R. ; Greeninger Daniel R. ; Thompson David L., Feedthrough assembly for implantable medical devices and methods for providing same.
Santini, Jr., John T.; Cima, Michael J.; Langer, Robert S.; Ausiello, Dennis; Sheppard, Jr., Norman F.; Herman, Stephen J., Flexible microchip devices for ophthalmic and other applications.
Coppeta, Jonathan R.; Shelton, Kurt; Sheppard, Jr., Norman F.; Snell, Douglas; Santini, Catherine M. B., Hermetically sealing using a cold welded tongue and groove structure.
Hassler Beth Anne ; Donders Adriannus P. ; Wiklund Craig L. ; Lyons Daniel A., Implantable ceramic enclosure for pacing, neurological, and other medical applications in the human body.
Ausiello,Dennis; Santini, Jr.,John T.; Herman,Stephen J.; Prescott,James H.; Uhland,Scott A.; Maloney,John M.; Polito,Benjamin F., Method and device for the controlled delivery of parathyroid hormone.
Uhland, Scott A.; Polito, Benjamin F.; Herman, Stephen J.; Santini, Jr., John T.; Maloney, John M., Methods for hermetically sealing microchip reservoir devices.
Richards, Amy C.; Santini, Jr., John T.; Cima, Michael J.; Langer, Robert S., Microchip devices for delivery of molecules and methods of fabrication thereof.
Santini, Jr., John T.; Cima, Michael J.; Sheppard, Jr., Norman F.; Flynn, Nolan T.; Uhland, Scott A.; Sbiaa, Zouhair; Maloney, John M., Microchip devices with improved reservoir opening.
John T. Santini, Jr. ; Charles E. Hutchinson ; Scott A. Uhland ; Michael J. Cima ; Robert S. Langer ; Dennis Ausiello, Microfabricated devices for the delivery of molecules into a carrier fluid.
Santini, Jr., John T.; Sheppard, Jr., Norman F.; Young, Chung Chang; Langer, Robert S., Microfabricated devices for the storage and selective exposure of chemicals and devices.
Santini, Jr., John T.; Sbiaa, Zouhair; Coppeta, Jonathan R.; Uhland, Scott A.; Sheppard, Jr., Norman F., Multi-cap reservoir devices for controlled release or exposure of reservoir contents.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.