Environmental sensitive element package and encapsulation method thereof
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-051/52
B32B-007/12
B32B-015/08
B32B-015/18
B32B-017/06
B32B-027/06
B32B-027/28
B32B-027/30
B32B-027/36
B32B-003/30
출원번호
US-0003805
(2016-01-22)
등록번호
US-9935289
(2018-04-03)
우선권정보
TW-99130696 A (2010-09-10)
발명자
/ 주소
Chen, Kuang-Jung
Yeh, Shu-Tang
Wang, Yung-Sheng
출원인 / 주소
Industrial Technology Research Institute Institute
대리인 / 주소
JCIPRNET
인용정보
피인용 횟수 :
0인용 특허 :
17
초록▼
A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The envi
A package of environmental sensitive element including a first substrate, a second substrate, a barrier structure between the first substrate and the second substrate, an environmental sensitive element and an adhesive is provided. The second substrate is disposed above the first substrate. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The barrier structure is distributed outside the environmental sensitive element. The adhesive is disposed between the first substrate and the second substrate and encapsulates the environmental sensitive element and the barrier structure, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10−7 gram/cm2.
대표청구항▼
1. An environmental sensitive element package, comprising: a first substrate;a second substrate disposed above the first substrate;a barrier structure between the first substrate and the second substrate;an environmental sensitive element disposed on the first substrate and between the first substra
1. An environmental sensitive element package, comprising: a first substrate;a second substrate disposed above the first substrate;a barrier structure between the first substrate and the second substrate;an environmental sensitive element disposed on the first substrate and between the first substrate and the second substrate, wherein the barrier structure is distributed outside the environmental sensitive element;a flexible buffer layer disposed on the environmental sensitive element and made of small molecular compounds, oligomers, or organic-inorganic co-steaming materials; andan adhesive disposed between the first substrate and the second substrate and encapsulating the environmental sensitive element, the barrier structure, and the flexible buffer layer, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10−7 gram/cm2, wherein an outgassing of the flexible buffer layer under 120 degrees Celsius is less than the outgassing of the adhesive under 120 degrees Celsius, and the outgassing of the flexible buffer layer under 120 degrees Celsius is less than 5×10−8 gram/cm2. 2. The environmental sensitive element package as claimed in claim 1, wherein the barrier structure and the second substrate are integrally formed and substantially made of a same material, the barrier structure and the second substrate are made of stainless steel, glass, or plastic. 3. The environmental sensitive element package as claimed in claim 1, wherein the barrier structure is disposed on the second substrate and protrudes from the second substrate toward the first substrate. 4. The environmental sensitive element package as claimed in claim 1, further comprising: a flexible passivation layer covering the flexible buffer layer, wherein the flexible buffer layer is located between the environmental sensitive element and the flexible passivation layer. 5. The environmental sensitive element package as claimed in claim 1, further comprising: a plurality of passivation films covering the flexible buffer layer. 6. The environmental sensitive element package as claimed in claim 1, further comprising: a flexible passivation layer covering the flexible buffer layer; anda plurality of passivation films covering the flexible passivation layer, wherein the flexible passivation layer is between the flexible buffer layer and the plurality of passivation films. 7. The environmental sensitive element package as claimed in claim 1, wherein the outgassing of the adhesive under 120 degrees Celsius ranges from 5×10−8 gram/cm2 to 5×10−7 gram/cm2. 8. An environmental sensitive element package, comprising: a first substrate;a second substrate disposed above the first substrate;a barrier structure between the first substrate and the second substrate;an environmental sensitive element disposed on the first substrate and between the first substrate and the second substrate, wherein the barrier structure is distributed outside the environmental sensitive element;a flexible buffer layer disposed on the environmental sensitive element and made of small molecular compounds, oligomers, or organic-inorganic co-steaming materials; andan adhesive disposed between the first substrate and the second substrate and encapsulating the environmental sensitive element, the barrier structure, and the flexible buffer layer, wherein an outgassing of the adhesive under 120 degrees Celsius is less than or equal to 5×10−7 gram/cm2, wherein an outgassing of the flexible buffer layer under 120 degrees Celsius is less than the outgassing of the adhesive under 120 degrees Celsius, and the outgassing of the flexible buffer layer under 120 degrees Celsius is less than 5×10−8 gram/cm2, wherein the outgassing of the adhesive increases gradually from a first side of the adhesive near the environmental sensitive element to a second side of the adhesive opposite to the first side of the adhesive. 9. The environmental sensitive element package as claimed in claim 8, wherein the barrier structure and the second substrate are integrally formed and substantially made of a same material, the barrier structure and the second substrate are made of stainless steel, glass, or plastic. 10. The environmental sensitive element package as claimed in claim 8, wherein the barrier structure is disposed on the second substrate and protrudes from the second substrate toward the first substrate. 11. The environmental sensitive element package as claimed in claim 8, further comprising: a flexible passivation layer covering the flexible buffer layer, wherein the flexible buffer layer is located between the environmental sensitive element and the flexible passivation layer. 12. The environmental sensitive element package as claimed in claim 8, further comprising: a plurality of passivation films covering the flexible buffer layer. 13. The environmental sensitive element package as claimed in claim 8, further comprising: a flexible passivation layer covering the flexible buffer layer; anda plurality of passivation films covering the flexible passivation layer, wherein the flexible passivation layer is between the flexible buffer layer and the plurality of passivation films. 14. The environmental sensitive element package as claimed in claim 8, wherein the outgassing of the adhesive under 120 degrees Celsius ranges from 5×10−8 gram/cm2 to 5×10−7 gram/cm2.
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