IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0596224
(2015-01-14)
|
등록번호 |
US-9939858
(2018-04-10)
|
발명자
/ 주소 |
- Lin, Hung-Wen
- Liu, Hsin-Chih
- Liao, Yu-Jing
- Hsiao, Ya-Lin
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
4 |
초록
▼
An electronic device including a case having a space, a circuit board disposed in the space, a heat source disposed on the circuit board and a vapor chamber disposed at a side of the circuit board and adjacent to the heat source is provided. The vapor chamber includes an upper sheet, a bottom sheet
An electronic device including a case having a space, a circuit board disposed in the space, a heat source disposed on the circuit board and a vapor chamber disposed at a side of the circuit board and adjacent to the heat source is provided. The vapor chamber includes an upper sheet, a bottom sheet assembled with the upper sheet to form a chamber, and a working fluid disposed in the chamber.
대표청구항
▼
1. An electronic device, comprising: a case, having a space;a circuit board, disposed in the space;at least one heat source, disposed on the circuit board;a vapor chamber, disposed at a side of the circuit board, and adjacent to the at least one heat source, the vapor chamber comprising:an upper she
1. An electronic device, comprising: a case, having a space;a circuit board, disposed in the space;at least one heat source, disposed on the circuit board;a vapor chamber, disposed at a side of the circuit board, and adjacent to the at least one heat source, the vapor chamber comprising:an upper sheet;a bottom sheet, assembled with the upper sheet to form a chamber; anda working fluid, disposed in the chamber, wherein the vapor chamber further comprises a plurality of support components, disposed in the chamber and perpendicularly contacting the upper sheet and the bottom sheet, to maintain a gap between the upper sheet and the bottom sheet; anda framework and the vapor chamber assembled to the framework, wherein the framework hag an opening and the vapor chamber is located in the opening, wherein the support components have a plurality of apertures configured to allow the working fluid to flow through. 2. The electronic device as claimed in claim 1, wherein an orthographic projection of the heat source on the vapor chamber s located completely in the vapor chamber. 3. The electronic device as claimed in claim 1, wherein the vapor chamber contacts the heat source. 4. The electronic device as claimed in claim 1, wherein the vapor chamber further has a fixing part, and the circuit board is fixed to the fixing part. 5. The electronic device as claimed in claim 1, wherein a material of the framework is plastic, and is formed at the periphery of the vapor chamber using a dual injection method. 6. The electronic device as claimed in claim 1, wherein a material of the framework is metal. 7. The electronic device as claimed in claim 1, wherein the vapor chamber has a stiffness coefficient between 200 HB and 500 HB and a heat transfer coefficient between 15 W/(m·K) and 120 W/(m·K). 8. The electronic device as claimed in claim 1, wherein a capillary structure is disposed on an inner surface of at least one of the upper sheet or the bottom sheet. 9. The electronic device as claimed in claim 8, wherein the capillary structure is formed by sintering powder or an etching process. 10. The electronic device as claimed in claim 1, wherein the working fluid comprises pure water and an additive. 11. The electronic device as claimed in claim 10, wherein a ratio of pure water to additive is 1:1 to 2:1. 12. The electronic device as claimed in claim 10, wherein the additive is Ethylene Glycol, Diethylene Glycol, Propylene Glycol, nitrate, sulphate, tolytriazole, polytriazole or mercapten benzenthiazole. 13. The electronic device as claimed in claim 1, further comprising a display module, assembled to the case and covering the space.
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