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Desktop consumer electronic device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/20
  • H05K-007/20
  • G06F-001/18
출원번호 US-0637981 (2017-06-29)
등록번호 US-9946315 (2018-04-17)
발명자 / 주소
  • Degner, Brett W.
  • Kalinowski, Caitlin Elizabeth
  • Kosoglow, Richard D.
  • Banko, Joshua D.
  • Narajowski, David H.
  • Berk, Jonathan L.
  • Leclerc, Michael E.
  • McBroom, Michael D.
  • Iqbal, Asif
  • Michelsen, Paul S.
  • Sin, Mark K.
  • Baker, Paul A.
  • Sontag, Harold L.
  • Yuen, Wai Ching
  • Casebolt, Matthew P.
  • Fetterman, Kevin S.
  • Calkins, Alexander C.
  • McBroom, Daniel L.
출원인 / 주소
  • Apple Inc.
대리인 / 주소
    Downey Brand LLP
인용정보 피인용 횟수 : 0  인용 특허 : 43

초록

An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangul

대표청구항

1. A desktop consumer electronic device, comprising: a housing that defines an interior volume, the housing characterized as being symmetric about a longitudinal axis and having a radius that is perpendicular to the longitudinal axis, the housing having a first opening and a second opening, the seco

이 특허에 인용된 특허 (43)

  1. Sasaki Tomiya,JPX ; Iwasaki Hideo,JPX, Circuit board cooling apparatus.
  2. Degner, Brett W.; Kalinowski, Caitlin Elizabeth; Kosoglow, Richard D.; Banko, Joshua D.; Narajowski, David H.; Berk, Jonathan L.; Leclerc, Michael E.; McBroom, Michael D.; Iqbal, Asif; Michelsen, Paul S.; Sin, Mark K.; Baker, Paul A.; Sontag, Harold L.; Yuen, Wai Ching; Casebolt, Matthew P.; Fetterman, Kevin S.; Calkins, Alexander C.; McBroom, Daniel L., Computer Architecture.
  3. Chen,Yun Lung; Xiao,Yu Ming, Computer enclosure.
  4. Yeh, Chin-Wen; Peng, Zhi-Jian; Xiao, Yang, Computer enclosure.
  5. Whang, Eugene A.; Stringer, Christopher J.; Degner, Brett W.; Narajowski, David H.; Kessler, Patrick; Prather, Eric R.; Kalinowski, Caitlin Elizabeth; Stagnaro, Adam T.; McBroom, Daniel L.; Casebolt, Matthew P.; McBroom, Michael D., Computer housing.
  6. Whang, Eugene A.; Stringer, Christopher J.; Degner, Brett W.; Narajowski, David H.; Kessler, Patrick; Prather, Eric R.; Kalinowski, Caitlin Elizabeth; Stagnaro, Adam T.; McBroom, Daniel L; Casebolt, Matthew P.; McBroom, Michael D., Computer housing.
  7. Degner, Brett W.; Kalinowski, Caitlin Elizabeth; Kosoglow, Richard D.; Banko, Joshua D.; Narajowski, David H.; Berk, Jonathan L.; Leclerc, Michael E.; McBroom, Michael D.; Iqbal, Asif; Michelsen, Paul S.; Sin, Mark K.; Baker, Paul A.; Sontag, Harold L.; Yuen, Wai Ching; Casebolt, Matthew P.; Fetterman, Kevin S.; Calkins, Alexander C.; McBroom, Daniel L., Computer input/output interface.
  8. Degner, Brett W.; Kalinowski, Caitlin Elizabeth; Kosoglow, Richard D.; Banko, Joshua D.; Narajowski, David H.; Berk, Jonathan L.; Leclerc, Michael E.; McBroom, Michael D.; Iqbal, Asif; Michelsen, Paul S.; Sin, Mark K.; Baker, Paul A.; Sontag, Harold L.; Yuen, Wai Ching; Casebolt, Matthew P.; Fetterman, Kevin S.; Calkins, Alexander C.; McBroom, Daniel L., Computer internal architecture.
  9. Degner, Brett W.; Kalinowski, Caitlin Elizabeth; Kosoglow, Richard D.; Banko, Joshua D.; Narajowski, David H.; Berk, Jonathan L.; Leclerc, Michael E.; McBroom, Michael D.; Iqbal, Asif; Michelsen, Paul S.; Sin, Mark K.; Baker, Paul A.; Sontag, Harold L.; Yuen, Wai Ching; Casebolt, Matthew P.; Fetterman, Kevin S.; Calkins, Alexander C.; McBroom, Daniel L., Computer internal architecture.
  10. McMahon John Francis, Computer package with a polygonal shaped motherboard.
  11. Degner, Brett W.; Narajowski, David H.; Prather, Eric R.; Sin, Mark K.; Baker, Paul A.; Whang, Eugene A.; Stringer, Christopher J.; Liang, Frank F., Computer system.
  12. Robert J. Lajara ; Milton C. Lee ; Alan Lee Minick ; Kenneth A. Lown ; Wayman Lee ; Barry Marshall ; Anita Patel ; Steve J. Furuta ; Kenneth Kitlas ; Ronald Barnes, Computer system housing and configuration.
  13. Kang Deog-Soo,KRX, Computer system with a control funtion of rotation speed of a cooling fan for a microprocessor chip therein and a metho.
  14. Degner, Brett W.; Prather, Eric R.; Narajowski, David H.; Liang, Frank F.; Nigen, Jay S.; Dybenko, Jesse T.; Duke, Connor R.; Whang, Eugene A.; Stringer, Christopher J.; Banko, Joshua D.; Kalinowski, Caitlin Elizabeth; Berk, Jonathan L.; Casebolt, Matthew P.; Fetterman, Kevin S.; Weirshauser, Eric J., Computer thermal management.
  15. Degner, Brett W.; Prather, Eric R.; Narajowski, David H.; Liang, Frank F.; Nigen, Jay S.; Dybenko, Jesse T.; Duke, Connor R.; Whang, Eugene A.; Stringer, Christopher J.; Banko, Joshua D.; Kalinowski, Caitlin Elizabeth; Berk, Jonathan L.; Casebolt, Matthew P.; Fetterman, Kevin S.; Weirshauser, Eric J., Computer thermal system.
  16. Fries Paul (Erlangen DT), Cooling arrangement for flat semiconductor components.
  17. Katooka Masao (Kawanishi JPX) Kawashima Yoshimasa (Kobe JPX) Sakurada Makoto (Yao JPX) Makitani Atsushi (Toyonaka JPX), Cooling structure for power supply device.
  18. Beveridge Harold N. (505 E. Montecito St. Santa Barbara CA 93103), Cylindrical speaker mechanism.
  19. Hastings Otis H. (130 E. Crescent Ave. Mahwah NJ 07430), Data processing equipment enclosures.
  20. Pucciarello Frank (Newark NJ), Display connection scheme for modular analog/digital instrument.
  21. Nelson Daryl James, Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system.
  22. Peets,Michael T.; Rybak,Andrew, EMC gasket filler and method.
  23. Kato Junichi (1631 Kalispell Ct. Sunnyvale CA 94087) Yenick Jon A. (599 Fenton St. San Jose CA 95127), Electro-magnetically shielded ventilation system.
  24. Shinotou, Kouichi; Fujikawa, Hideyuki, Electronic apparatus.
  25. Matsumoto, Subaru; Komori, Kou; Takahashi, Yasufumi, Electronic device cooling structure.
  26. Muraki, Yosuke, Electronic system with dynamic thermal management.
  27. Rapp, John W.; Nagurny, Nicholas J.; Gouldey, Brent I.; Jones, Mark; Normark, Wendy S., Electronics module, enclosure assembly housing same, and related systems and methods.
  28. Sun, Hong-Zhi; Chen, Chen; Li, Yang, Enclosure of electronic device.
  29. Moore, Christopher Todd, Enclosure with duct mounted electronic components.
  30. Chen,Chia Sheng; Laio,Chih Peng, Heat-dissipating assembly of computer housing.
  31. El-Essawy, Wael R.; Elnozahy, Elmootazbellah N.; Iyengar, Madhusudan K.; Keller, Jr., Thomas W.; Rubio, Juan C., Heatsink allowing in-situ maintenance in a stackable module.
  32. Gonzalez, Carlos A.; Ofman, Leo, I/C package / thermal-solution retention mechanism with spring effect.
  33. Madara,Steven; Sillato,Stephen; Harvey,Thomas; Baer,Daniel, Integrated heat exchangers in a rack for vertical board style computer systems.
  34. Geswender, Chris E., Low cost, high strength electronics module for airborne object.
  35. Gallarelli, Pat; Jensen, David J.; Kamath, Vinod; Kerrigan, Brian M., Low profile computer processor retention device.
  36. Glovatsky,Andrew Z.; Stoica,Vladimir, Microelectronic package within cylindrical housing.
  37. Waddell, Steve; Davi, Leonard, Movable speaker covering.
  38. Kunz, Felix, Passively cooled computer.
  39. Chang, An-Chi, Portable conference speakerphone.
  40. Perry Michael W. (Ocean NJ), Repeater housing and circuit mounting structure.
  41. Chen, Tsan-Jung, Snapping device for CPU cooler.
  42. Steve Holmes ; Wayne Miller ; Girish Upadhya ; Richard Smith, Thermal chimney for a computer.
  43. Brian G. Russell ; Robert R. Kreitzer ; Christopher R. Coleman ; Theodore S. Hetke, Thermal control for a test and measurement instrument.
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