IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0061531
(2013-10-23)
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등록번호 |
US-9960124
(2018-05-01)
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발명자
/ 주소 |
- Rose, James Wilson
- Astley, Oliver Richard
- Sherman, Donna Marie
- Short, Jonathan David
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
6 |
초록
▼
In certain embodiments, a mixed signal integrated circuit is provided that includes both a digital portion and an analog portion. A shield is provided that overlays one of the digital portion or the analog portion of the mixed signal integrated circuit. The shield limits propagation of signals betwe
In certain embodiments, a mixed signal integrated circuit is provided that includes both a digital portion and an analog portion. A shield is provided that overlays one of the digital portion or the analog portion of the mixed signal integrated circuit. The shield limits propagation of signals between the digital portion and the analog portion of the mixed signal integrated circuit.
대표청구항
▼
1. A mixed signal integrated circuit assembly, comprising: a substrate comprising a plurality of conductive traces and contact pads, wherein the substrate comprises: a digital portion configured to route and process digital signals; andan analog portion configured to route and process analog signals
1. A mixed signal integrated circuit assembly, comprising: a substrate comprising a plurality of conductive traces and contact pads, wherein the substrate comprises: a digital portion configured to route and process digital signals; andan analog portion configured to route and process analog signals; anda packaging structure, comprising:a first shield formed on a facing surface of the packaging structure disposed about at least a portion of the substrate, the first shield positioned over the digital portion of the substrate so as to limit propagation of signals between the digital portion and the analog portion; anda second shield formed on the facing surface of the packaging structure disposed about at least a second portion of the substrate, the second shield position over the analog portion of the substrate,wherein the packaging structure is configured to geometrically align the first shield with the digital portion of the substrate and the second shield with the analog portion of the substrate. 2. The mixed signal integrated circuit assembly of claim 1, wherein the first shield is conductively connected to a digital ground. 3. The mixed signal integrated circuit assembly of claim 1, wherein the first shield is patterned. 4. The mixed signal integrated circuit assembly of claim 1, wherein the first shield is solid. 5. The mixed signal integrated circuit assembly of claim 1, wherein the second shield is conductively connected to an analog ground. 6. The mixed signal integrated circuit assembly of claim 1, wherein the second shield is patterned. 7. The mixed signal integrated circuit assembly of claim 1, wherein the second shield is solid. 8. A semiconductor package assembly, comprising: a mixed signal integrated circuit comprising: a digital portion configured to route and process digital signals; andan analog portion configured to route and process analog signals;a package structure configured to interface with the mixed signal integrated circuit to form the semiconductor package assembly, the package structure comprising:a first shield and a second shield formed as a facing surface of the packaging structure, wherein the first shield, when interfaced with the mixed signal integrated circuit, is configured to correspond to the shape, size, and position of the digital portion of the mixed signal integrated circuit and the second shield, when interfaced with the conversion circuit, is configured to correspond to the shape, size, and position of the analog portion of the mixed signal integrated circuit when the package structure is assembled with the mixed signal integrated circuit, wherein the first shield and the second shield limits propagation of signals between the digital portion and the analog portion of the mixed signal integrated circuit, wherein the package structure and mixed signal integrated circuit are separate non-integral components with respect to one another. 9. The semiconductor package assembly of claim 8, wherein the first shield overlays the digital portion of the mixed signal integrated circuit and wherein the first shield is connected to a digital ground. 10. The semiconductor package assembly of claim 8, wherein the first shield overlays the analog portion of the mixed signal integrated circuit and wherein the first shield is connected to an analog ground. 11. The semiconductor package assembly of claim 8, wherein the first shield is patterned. 12. The semiconductor package assembly of claim 8, wherein the first shield is solid. 13. A non-invasive imaging system, comprising: a detector assembly configured to generate analog signals in response to detected signals;a conversion circuit configured to convert the analog signals to digital signals, the conversion circuit comprising: an analog portion configured to route and process the analog signals;a digital portion configured to route and process digital signals; anda package structure configured to interface with the conversion circuit to form a semiconductor package assembly, the package structure having a first shield and a second shield formed on a facing surface of the packaging structure, wherein the first shield, when interfaced with the conversion circuit, is configured to correspond to the shape, size, and position of the digital portion and the second shield, when interfaced with the conversion circuit, is configured to correspond to the shape, size, and position of the analog portion of the conversion circuit, wherein the first shield and the second shield limit limit propagation of signals between the digital portion and the analog portion of the conversion circuit, wherein the package structure and conversion circuit are separate non-integral components with respect to one another; anda processing component configured to receive and process the digital signal to generate one or more images and to display the one or more images. 14. The non-invasive imaging system of claim 13, wherein the first shield overlays the digital portion of the conversion circuit and wherein the first shield is connected to a digital ground. 15. The non-invasive imaging system of claim 13, wherein the first shield overlays the analog portion of the conversion circuit and wherein the first shield is connected to an analog ground. 16. The non-invasive imaging system of claim 13, wherein the first shield is patterned. 17. The non-invasive imaging system of claim 13, wherein the first shield is solid.
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