초록 ▼

A method of forming a semiconductor device includes forming a sacrificial layer in a first contact hole of a first dielectric layer, forming a second dielectric layer on the first dielectric layer, and forming a second contact hole in the second dielectric layer, the second contact hole being aligne

A method of forming a semiconductor device includes forming a sacrificial layer in a first contact hole of a first dielectric layer, forming a second dielectric layer on the first dielectric layer, and forming a second contact hole in the second dielectric layer, the second contact hole being aligned with the first contact hole, removing the sacrificial layer from the first contact hole, forming a liner layer on the second dielectric layer and in the first and second contact holes, and forming a copper contact in the first and second contact holes.

대표청구항 ▼

1. A method of forming a semiconductor device, the method comprising: forming a sacrificial layer in a first contact hole of a first dielectric layer;forming a second dielectric layer on the first dielectric layer, and forming a second contact hole in the second dielectric layer, the second contact

1. A method of forming a semiconductor device, the method comprising: forming a sacrificial layer in a first contact hole of a first dielectric layer;forming a second dielectric layer on the first dielectric layer, and forming a second contact hole in the second dielectric layer, the second contact hole being aligned with the first contact hole;removing the sacrificial layer from the first contact hole;forming a liner layer comprising a wetting liner layer on the second dielectric layer and in the first and second contact holes, wherein the forming of the liner layer comprises: forming a TaN liner layer on the second dielectric layer and in the first and second contact holes; and forming the a wetting liner layer on the TaN liner layer, wherein the wetting liner layer comprises one of Ru, Co and Rh; anddepositing a copper layer on the wetting liner layer, and reflowing the copper layer into the first and second contact holes to form a copper contact in the first and second contact holes. 2. The method of claim 1, wherein the forming of the TaN liner layer and the forming of the wetting liner layer are performed using atomic layer deposition (ALD). 3. The method of claim 1, wherein the reflowing of the copper layer is performed at a temperature in a range from 200° C. to 450° C., and for a duration in a range of 30 minutes to 3 hours, and in an atmosphere including one of nitrogen and a mixture of nitrogen and hydrogen. 4. The method of claim 1, further comprising: forming the first dielectric layer;planarizing a surface of the first dielectric layer by chemical mechanical polishing (CMP);forming a nitride cap on the surface of the first dielectric layer;patterning and etching the first dielectric layer to form the first contact hole; anddepositing a TaN liner and performing etch back to remove the TaN liner from a side wall of the first contact hole. 5. The method of claim 1, wherein the first dielectric layer comprises a contact-to-active area (CA) dielectric layer, and the second dielectric layer comprises one of a V0 dielectric layer and an M1 dielectric layer. 6. The method of claim 1, wherein the first dielectric layer comprises other contact holes, and the forming of the sacrificial layer comprises forming the sacrificial layer in the other contact holes, and wherein the second dielectric layer is formed on the other contact holes such that the sacrificial layer remains in the other contact holes. 7. A method of forming a semiconductor device, the method comprising: forming a first liner layer in a first contact hole of a first dielectric layer;forming a sacrificial layer on the first liner layer to fill the first contact hole;forming a second dielectric layer on the first dielectric layer, and forming a second contact hole in the second dielectric layer, the second contact hole being aligned with the first contact hole;forming a second liner layer comprising a wetting liner layer on the second dielectric layer and in the second contact hole, wherein the forming of the second liner layer comprises: forming a TaN liner layer on the second dielectric layer and in the first and second contact holes; and forming the a wetting liner layer on the TaN liner layer, wherein the wetting liner layer comprises one of Ru, Co and Rh;removing the sacrificial layer from the first contact hole; anddepositing a copper layer on the wetting liner layer, and reflowing the copper layer into the first and second contact holes to form a copper contact in the first and second contact holes. 8. The method of claim 7, wherein the forming of the TaN liner layer and the forming of the wetting liner layer are performed using atomic layer deposition (ALD). 9. The method of claim 7, wherein the reflowing of the copper layer is performed at a temperature in a range from 200° C. to 450° C., and for a duration in a range of 30 minutes to 3 hours, and in an atmosphere including one of nitrogen and a mixture of nitrogen and hydrogen. 10. The method of claim 7, further comprising: forming the first dielectric layer;planarizing a surface of the first dielectric layer by chemical mechanical polishing (CMP);forming a nitride cap on the surface of the first dielectric layer;patterning and etching the first dielectric layer to form the first contact hole; anddepositing a TaN liner and performing etch back to remove the TaN liner from a side wall of the first contact hole. 11. The method of claim 7, wherein the first dielectric layer comprises a contact-to-active area (CA) dielectric layer, and the second dielectric layer comprises one of a V0 dielectric layer and an M1 dielectric layer. 12. The method of claim 1, wherein the first dielectric layer comprises other contact holes, and the forming of the sacrificial layer comprises forming the sacrificial layer in the other contact holes, and wherein the second dielectric layer is formed on the other contact holes such that the sacrificial layer remains in the other contact holes.