이 특허에 인용된 특허 (57)

1. Uraki,Yasushi, Analysis data generating apparatus, analysis data generating method and computer-readable recording medium containing analysis data generating program.

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2. Prestel Fritz (Hausen A. Tann DEX), Apparatus for controlling or regulating equipment powered by batteries.

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3. Gates Frank Vernon, Apparatus for heating and cooling an electronic device.

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4. Hille, Peter, Arrangement and method for measuring a temperature.

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5. Bosli Hans Ludwig (Schwerzenbach CHX), Attachment device for semiconductor circuit elements.

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6. Conroy Chad M. ; Greenwood Mark W., Burn-in board and heat sink assembly mounting rack.

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7. deRochemont L. Pierre ; Farmer Peter H., Ceramic composite wiring structures for semiconductor devices and method of manufacture.

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8. Michael A. Hajicek ; Jon Thomas Jacobson ; Mark Jones ; Kevin Lee Brekkestran, Circuit board assembly with heat sinking.

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9. Liu Michael,TWX, Device for cooling central processing units.

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10. Soga Tasao,JPX ; Shimokawa Hanae,JPX ; Harada Masahide,JPX ; Suzuki Tatsuya,JPX ; Ochiai Yuji,JPX ; Nakano Asao,JPX ; Matsumura Hiroyoshi,JPX ; Kamei Tsuneaki,JPX, Electric appliance, printed circuit board, remained life estimation method, and system thereof.

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11. Tokunaga, Shigetomi, Electronic circuit device.

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12. Guenther Riehl DE; Bernhard Severin DE, Electronic control unit.

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13. Socci,Christopher; Wavra,Robert; Fukazawa,Luis, Electronic module with built-in temperature display.

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14. Neal James R. (Cameron Park CA) Brown Peter F. (Orangevale CA) Agatstein Louis W. (El Dorado Hills CA) Gutman Michael (Zichron-Ya\cov ILX), Employing on die temperature sensors and fan-heatsink failure signals to control power dissipation.

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15. Sayka Anthony (San Antonio TX), Fusion heat sink for integrated circuit.

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16. Newman Robert A., Ground plane for plastic encapsulated integrated circuit die packages.

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17. Esterberg Dennis R. ; Smith Mark A. ; Rubens Paul A. ; Lang Tracy A., Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink.

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18. Butterbaugh Matthew Allen ; Hamilton Roger Duane ; Kang Sukhvinder Singh, Heat sink assembly for cooling electronic modules.

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19. Okamoto, Tomomi; Yamada, Hiroshi; Ito, Ryuji; Higashi, Osamu, Heat sink for measuring temperature of electronic component.

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20. Schirmer Klaus (Ingoldstadt DEX) Burgdorf Jochen (Offenbach-Rumpenheim DEX) Loreck Heinz (Idstein DEX), Housing for motor vehicle electronic system.

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21. Kellerman Dave (Littleton MA) Hannemann Robert J. (Wellesley MA) Czerepak Stanley J. (Burlington MA) Simcoe Robert J. (Westborough MA), Integral heatsink semiconductor package.

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22. Pasqualini, Ronald, Integrated circuit package with low inductance ground path and improved thermal capability.

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23. Jensen Eric Dean ; Crumly William R. ; Feigenbaum Haim ; Schreiber Chris M., Integrated circuit with a chip on dot and a heat sink.

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24. Malladi Deviprasad ; Forehand Douglas W., Integrated junction temperature sensor/package design and method of implementing same.

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25. Polonio John D. (625 NE. 22nd Ave. Canby OR 97013), Interconnection mechanisms for electronic components.

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26. Hashemi Hassan S., Leadless chip carrier design and structure.

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27. Wang, Carl B.; Kao, Shih-Ming; Lin, Yu-Cheng; Cheng, Jaw-Shin, Low temperature co-fired ceramic (LTCC) tape compositions, light-emitting diode (LED) modules, lighting devices and methods of forming thereof.

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28. Veli-Pekka Ketonen ; Steven J. Laureanti, Method and apparatus for providing a real time estimate of a life time for critical components in a communication system.

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29. Sri Jayantha,Sri M.; Dang,Hien P.; Sharma,Arun, Method and system for real-time estimation and prediction of the thermal state of a microprocessor unit.

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30. Gaasch, Thomas Francis; Trieu, Thanh, Method for controlling the temperature of an electronic component under test.

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31. Acar, Emrah; Devgan, Anirudh; Liu, Ying; Nassif, Sani R.; Su, Haihua, Method for determining the leakage power for an integrated circuit.

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32. Chien, Heng Chieh; Tseng, Ming Hsi; Ke, Wen Wang; Wang, Chih Yao; Chen, Yi Shiau, Method for determining the thermal performance of a heat sink.

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33. Nada, Mitsuhiro, Method of estimating temperature and device for the effecting same.

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34. Doane ; Jr. Howard (Amesbury MA) Covino Alfred F. (Hudson NH) Waite John M. (Derry NH), Method of manufacturing a rigid flex printed circuit board.

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35. Rumer, Christopher L.; Houle, Sabina J., Method to compensate for stress between heat spreader and thermal interface material.

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36. Gunther, Stephen H.; Binns, Frank; Pippin, Jack D.; Rankin, Linda J.; Burton, Edward A.; Carmean, Douglas M.; Bauer, John M., Methods and apparatus for thermal management of an integrated circuit die.

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37. Seyama Kiyotaka (Kawasaki JPX) Kikuchi Shunichi (Kawasaki JPX) Sumiyoshi Makoto (Kawasaki JPX) Yasuda Naoki (Kawasaki JPX) Hirano Minoru (Kawasaki JPX) Nori Hitoshi (Kawasaki JPX), Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together.

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38. Ohki Ken'ichi,JPX ; Muratake Kiyoshi,JPX ; Inoue Hidetoshi,JPX ; Tsujimura Takehisa,JPX, Multi-chip semiconductor device and method of producing the same.

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39. Kondo, Koji, Multilayer circuit board.

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40. Park, Jun Seok, Package for light emitting device having a lens spaced from a light emitting device module.

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41. Tantoush Mohammad A., Post mounted heat sink method and apparatus.

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42. Vijay Mangtani, Power module with closely spaced printed circuit board and substrate.

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43. Turek Joe ; Gosselin Dan ; Vahora Nanu, Printed circuit board process using plasma spraying of conductive metal.

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44. Juskey, Frank J.; McMillan, John R.; Huemoeller, Ronald P., Printed circuit board with integral heat sink for semiconductor package.

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45. Allen, David W.; Yoon, Howard, Radiance output and temperature controlled LED radiance source.

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46. Cassinelli Edgar (Marlboro MA), Semiconductor chip carrier package.

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47. Araki Kouji (Yokohama JPX) Kojima Shinjiro (Chigasaki JPX) Takahashi Wataru (Tokyo JPX), Semiconductor device.

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48. Petty-Weeks, Sandra L., Semiconductor die package with increased thermal conduction.

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49. Patel Chandrakant (Fremont CA) Obermaier Hannsjrg (Los Gotos CA), Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate.

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50. Fiorina Jean-Nol (Grenoble FRX) Denis Herv (Echirolles FRX), Static converter comprising a protective filter against high-frequency disturbanes.

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51. Umezawa Kazuhiko (Tokyo JPX), Structure for temperature detection in a package.

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52. Matsunaga Minobu (Kyoto JPX) Tsuji Masao (Kyoto JPX), Substrate cooling apparatus.

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53. Hornung,Craig Warren; Spayd, Jr.,Ralph Edward; Del Prete,Stephen; Wang,Chong Sheng, Thermal managed interconnect system for a circuit board.

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54. Evoy David Ross, Thermal management device and method for a computer processor.

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55. Still Stephen Eugene ; Garcia Ray ; Honeycutt Kendall Anthony ; Tout ; Jr. James J., Thermal monitoring system for semiconductor devices.

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56. Nagaraj Ravi, Thermal sensing of multiple integrated circuits.

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57. Chazan David J. (Palo Alto CA) Weihe Gary R. (Fremont CA) Otte Richard F. (Los Altos Hills CA), Thermal transfer posts for high density multichip substrates and formation method.

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