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An embodiment of an interconnect structure for an integrated circuit may include a first conductor coupled to circuitry, a second conductor, a dielectric between the first and second conductors, and a conductive underpass under and coupled to the first and second conductors and passing under the die

An embodiment of an interconnect structure for an integrated circuit may include a first conductor coupled to circuitry, a second conductor, a dielectric between the first and second conductors, and a conductive underpass under and coupled to the first and second conductors and passing under the dielectric or a conductive overpass over and coupled to the first and second conductors and passing over the dielectric. The second conductor would be floating but for its coupling to the conductive underpass or the conductive overpass. In other embodiments, another dielectric might be included that would electrically isolate the second conductor but for its coupling to the conductive underpass or the conductive overpass.

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1. A method of forming an interconnect structure for an integrated circuit device, comprising: forming a first conductor in a dielectric;forming a second conductor in the dielectric so that a first portion of the dielectric is between the first and second conductors; andelectrically coupling the fir

1. A method of forming an interconnect structure for an integrated circuit device, comprising: forming a first conductor in a dielectric;forming a second conductor in the dielectric so that a first portion of the dielectric is between the first and second conductors; andelectrically coupling the first conductor to the second conductor by forming a conductive overpass over and coupled to the first and second conductors and that passes over the first portion of the dielectric between the first and second conductors;wherein the second conductor is formed in the dielectric so that a second portion of the dielectric would electrically isolate the second conductor from a connection to circuitry of the integrated circuit device but for its coupling to the conductive overpass; andwherein the second conductor is further configured to be electrically isolated from a connection to circuitry external to the integrated circuit device but for its coupling to the conductive overpass. 2. A method of forming an interconnect structure for an integrated circuit device, comprising: forming a first conductor in a dielectric so that the first conductor is coupled to circuitry;forming a second conductor in the dielectric so that a first portion of the dielectric is between the first and second conductors; andforming a conductive overpass over and coupled to the first and second conductors and that passes over the first portion of the dielectric between the first and second conductors;wherein the second conductor is formed in the dielectric so that a second portion of the dielectric would electrically isolate the second conductor from a connection to circuitry of the integrated circuit device but for its coupling to the conductive overpass;wherein the second conductor is further configured to be electrically isolated from a connection to circuitry external to the integrated circuit device but for its coupling to the conductive overpass;wherein forming the first conductor comprises forming a first opening in the dielectric and forming the first conductor in the first opening; andwherein forming the second conductor comprises forming a second opening in the dielectric so that the first portion of the dielectric is between the first and second openings and so that the second opening is between portions of the second portion of the dielectric, and forming the second conductor in the second opening between the portions of the second portion of the dielectric. 3. A method of forming an interconnect structure for an integrated circuit device, comprising: forming a first conductor in a dielectric so that the first conductor is coupled to circuitry;forming a second conductor in the dielectric so that a first portion of the dielectric is between the first and second conductors; andforming a conductive overpass over and coupled to the first and second conductors and that passes over the first portion of the dielectric between the first and second conductors;wherein the second conductor is formed in the dielectric so that a second portion of the dielectric would electrically isolate the second conductor but for its coupling to the conductive overpass;wherein forming the first conductor comprises forming a first opening in the dielectric and forming the first conductor in the first opening;wherein forming the second conductor comprises forming a second opening in the dielectric so that the first portion of the dielectric is between the first and second of the dielectric, and forming the second conductor in the second opening between the portions of the second portion of the dielectric; andwherein forming the first and second openings comprises protecting the first portion of the dielectric with a spacer and protecting the portions of the second portion of the dielectric with portions of a mask that are self-aligned with the spacer while removing portions of the dielectric corresponding to the first and second openings. 4. The method of claim 3, wherein the spacer is a first spacer of a plurality of pitch-multiplying spacers, wherein a portion of the dielectric that is to be removed to form the first opening is between the first spacer and a second spacer of the plurality of pitch-multiplying spacers, on a side of the first spacer, wherein the portions of the mask that protect the portions of the second portion of the dielectric and that are self-aligned to the first spacer are between the first spacer and a third spacer of the plurality of pitch-multiplying spacers, on an opposite side of the first spacer, and wherein a portion of the dielectric that is to be removed to form the second opening is between the first spacer and the third spacer and between the portions of the mask that protect the portions of the second portion of the dielectric and that are between the first spacer and a third spacer. 5. The method of claim 4, further comprising, before forming the first and second openings: forming the mask over the plurality of pitch-multiplying spacers;removing the mask to expose the first and second spacers and the portion of the dielectric that is to be removed to form the first opening; andself-aligning to the first spacer the portions of the mask that protect the portions of the second portion of the dielectric so that the portions of the mask that protect the portions of the second portion of the dielectric remain over the third spacer and between the first and third spacers;wherein removing the mask further comprises removing the mask to expose the portion of the dielectric that is to be removed to form the second opening and that is between the first spacer and the third spacer and between the portions of the mask that protect the portions of the second portion of the dielectric and that are self-aligned to the first spacer. 6. The method of claim 3, wherein the portions of the mask that are self-aligned to the first spacer are selected from the group consisting positive photoresist that has been exposed to electromagnetic radiation and negative photoresist that has not been exposed to electromagnetic radiation. 7. A method of forming an interconnect structure for an integrated circuit device, comprising: forming a first conductor in a dielectric so that the first conductor is coupled to circuitry of the integrated circuit device;forming a second conductor in the dielectric so that a first portion of the dielectric is between the first and second conductors; andforming a conductive overpass over and coupled to the first and second conductors and that passes over the first portion of the dielectric between the first and second conductors;wherein the second conductor is formed in the dielectric so that a second portion of the dielectric would electrically isolate the second conductor from the circuitry of the integrated circuit device but for its coupling to the conductive overpass;wherein the second conductor is further configured to be electrically isolated from circuitry external to the integrated circuit device but for its coupling to the conductive overpass; andwherein the conductive overpass is a single conductive contact that is in direct physical contact with both of the first and second conductors. 8. A method of forming an interconnect structure for an integrated circuit device, comprising forming a conductive underpass in a first dielectric;forming a second dielectric over the conductive underpass and the first dielectric; andforming first and second conductors in the second dielectric that are over and coupled to the conductive underpass, so that the first conductor is coupled to circuitry, so that a first portion of the second dielectric is between the first and second conductors, and so that the conductive underpass passes under the first portion of the second dielectric;wherein the second conductor would be floating but for its coupling to the conductive underpass; andbefore forming the first and second conductors: forming a spacer over the second dielectric;self-aligning portions of a mask to the spacer; andforming first and second openings in the second dielectric to expose respective portions of the conductive underpass while protecting the first portion of the second dielectric with the spacer so that the first portion of the second dielectric is between the first and second openings and while protecting portions of a second portion of the second dielectric with the portions of the mask that are self-aligned to the spacer so that the second opening is between the portions of the second portion of the second dielectric; andwherein forming first and second conductors in the second dielectric comprises forming the first and second conductors respectively in the first and second openings, so that the first portion of the second dielectric is between the first and second conductors and so that the second conductor is between the portions of the second portion of the second dielectric. 9. A method of forming an interconnect structure for an integrated circuit device, comprising forming a conductive underpass in a first dielectric;forming a second dielectric over the conductive underpass and the first dielectric;forming first and second conductors in the second dielectric that are over and coupled to the conductive underpass, so that the first conductor is coupled to circuitry of the integrated circuit device, so that a first portion of the second dielectric is between the first and second conductors, and so that the conductive underpass passes under the first portion of the second dielectric;forming a third conductor in the second dielectric so that a second portion of the second dielectric is between the second and third conductors;forming a third dielectric over the second dielectric and the first, second, and third conductors; andforming a conductive overpass in the third dielectric coupled to the second and third conductors and passing over the second portion of the second dielectric;wherein the third conductor would be electrically isolated from the circuitry of the integrated circuit device but for its coupling to the conductive overpass; andwherein the third conductor is further configured to be electrically isolated from circuitry external to the integrated circuit device but for its coupling to the conductive overpass. 10. A method of forming an interconnect structure for an integrated circuit device, comprising forming a conductive underpass in a first dielectric;forming a second dielectric over the conductive underpass and the first dielectric;forming a plurality of spacers over the second dielectric;forming a mask over the plurality of spacers;removing the mask to expose a first spacer of the plurality of spacers and to self-align portions of the mask to the first spacer so that the portions of the mask self-aligned to the first spacer remain over portions of a second spacer of the plurality of spacers; andforming first, second, and third openings in the second dielectric while protecting the first portion of the second dielectric with the first spacer so that the first portion of the second dielectric is between the first and second openings, while protecting portions of a third portion of the second dielectric with the portions of the mask self-aligned to the first spacer so that the second and third openings and second spacer are between the portions of the third portion of the second dielectric, and while protecting the second portion of the second dielectric with the second spacer so that the second portion of the second dielectric is between the second and third openings and between the portions of the third portion of the second dielectric; andforming first and second conductors in the second dielectric that are over and coupled to the conductive underpass, so that the first conductor is coupled to circuitry, so that a first portion of the second dielectric is between the first and second conductors, and so that the conductive underpass passes under the first portion of the second dielectric;forming a third conductor in the second dielectric so that a second portion of the second dielectric is between the second and third conductors;forming a third dielectric over the second dielectric and the first second and third conductors; andforming a conductive overpass in the third dielectric coupled to the second and third conductors and passing over the second portion of the second dielectric;wherein the second conductor would be floating but for its coupling to the conductive underpass; andwherein forming the first, second, and third conductors comprises forming the first, second, and third conductors respectively in the first, second, and third openings, so that the first portion of the second dielectric is between the first and second conductors so that the second and third conductors are between the portions of the third portion of the second dielectric, and so that the second portion of the second dielectric is between the second and third conductors and between the portions of the third portion of the second dielectric. 11. The method of claim 9, further comprising, forming a fourth conductor coupled to and over the conductive overpass. 12. The method of claim 9, wherein the conductive underpass is a single conductive plug that is in direct physical contact with both of the first and second conductors. 13. A method of forming an interconnect structure for an integrated circuit device, comprising: forming a conductive plug in a first dielectric;forming a second dielectric over the first dielectric and the conductive plug;forming first and second openings in the second dielectric that respectively expose first and second portions of a surface of the conductive plug, wherein a portion of the second dielectric remains over a third portion of the surface of the conductive plug between the first and second portions of the surface of the conductive plug;forming a third opening in the second dielectric that exposes a portion of the first dielectric;forming a first conductive line in the first opening and in contact with the first portion of the surface of the conductive plug;forming a second conductive line in the second opening and in contact with the second portion of the surface of the conductive plug;forming a third conductive line in the third opening over the exposed portion of the first dielectric;forming a third dielectric over the second dielectric, the first conductive line, the second conductive line, and the third conductive line; andforming a conductive contact in the third dielectric, in contact with a surface of the second conductive line and in contact with a surface of the third conductive line, but not in contact with a surface of the first conductive line;wherein the first conductive line is configured to be electrically connected to circuitry external to the integrated circuit device through the conductive plug, the second conductive line and the conductive contact; andwherein the third conductive line is configured to be electrically isolated from any circuit external to the integrated circuit device but for its contact with the conductive contact. 14. The method of claim 13, wherein the portion of the second dielectric that remains over the third portion of the surface of the conductive plug between the first and second portions of the surface of the conductive plug is a first portion of the dielectric, and wherein a second portion of the second dielectric remains over a fourth portion of the surface of the conductive plug and is between the second conductive line and the third conductive line. 15. The method of claim 13, further comprising: forming a fourth dielectric over the third dielectric and the conductive contact;forming a third opening in the fourth dielectric that exposes the conductive contact; andforming a fourth conductive line in the third opening in contact with the conductive contact. 16. The method of claim 13, wherein the first conductive line is to direct current to and from the conductive plug and wherein the second dielectric electrically isolates the second conductive line from the third conductive line and the first conductive line but for the second conductive line's contact with the conductive contact and the conductive plug, respectively.