Chemical vapor deposition articles and processes include a chemical vapor deposition functionalization on a material, the material including an sp3 arrangement of carbon. The chemical vapor deposition functionalization is positioned to be contacted by a process fluid, a hydrocarbon, an analyte, exha
Chemical vapor deposition articles and processes include a chemical vapor deposition functionalization on a material, the material including an sp3 arrangement of carbon. The chemical vapor deposition functionalization is positioned to be contacted by a process fluid, a hydrocarbon, an analyte, exhaust, or a combination thereof. Additionally or alternatively, the chemical vapor deposition functionalization is not of a refrigerator shelf or a windshield.
대표청구항▼
1. A chemical vapor functionalized article, comprising: a chemical vapor functionalization on a material, the material including an sp3 arrangement of carbon;wherein the chemical vapor functionalization is positioned to be contacted by a process fluid, a hydrocarbon, an analyte, exhaust, or a combin
1. A chemical vapor functionalized article, comprising: a chemical vapor functionalization on a material, the material including an sp3 arrangement of carbon;wherein the chemical vapor functionalization is positioned to be contacted by a process fluid, a hydrocarbon, an analyte, exhaust, or a combination thereof;wherein the chemical vapor functionalization is from a single functionalizing step or wherein the chemical vapor functionalization is from a first functionalizing step, followed by a nitrogen fill at partial pressure, followed by a purge, followed by a second functionalizing step. 2. The chemical vapor functionalized article of claim 1, wherein the chemical vapor functionalized article is not a refrigerator shelf or a windshield. 3. The chemical vapor functionalized article of claim 1, wherein the chemical vapor functionalization has a contact angle for deionized water on a mirror diamond-like carbon surface that is greater than polytetrafluoroethylene by at least about 10°. 4. The chemical vapor functionalized article of claim 1, wherein the chemical vapor functionalization has a water contact angle of greater than 110°. 5. The chemical vapor functionalized article of claim 1, wherein the chemical vapor functionalization has a hexadecane contact angle of greater than 70°. 6. The chemical vapor functionalized article of claim 1, wherein the chemical vapor functionalization has a property of being capable of maintaining a water contact angle of greater than above 123° over 23.5 hours. 7. The chemical vapor functionalized article of claim 1, wherein the chemical vapor functionalization has a property of being capable of maintaining a hexadecane contact angle of greater than above 60° over 23.5 hours. 8. The chemical vapor functionalized article of claim 1, wherein the chemical vapor functionalization has an increased contact angle in comparison to the material. 9. The chemical vapor functionalized article of claim 1, wherein the chemical vapor functionalization is formed by (heptadecafluoro-1,1,2,2-tetrahydrodecycl)trimethoxysilane. 10. The chemical vapor functionalized article of claim 1, wherein the chemical vapor functionalization is formed by (tridecafluoro-1,1,2,2-tetrahydrooctyl)triethoxysilane. 11. The chemical vapor functionalized article of claim 1, wherein the chemical vapor functionalization is from the single functionalizing step. 12. The chemical vapor functionalized article of claim 1, wherein the chemical vapor functionalization is from the first functionalizing step, followed by the nitrogen fill at the partial pressure, followed by the purge, followed by the second functionalizing step. 13. The chemical vapor functionalized article of claim 12, wherein the first functionalization step and the second functionalization step are from temperature conditions within a chemical vapor of between 250° C. and 350° C. 14. The chemical vapor functionalized article of claim 1, wherein the chemical vapor functionalization is from functionalizing within a chemical vapor for over 1 hour. 15. The chemical vapor functionalized article of claim 1, wherein the chemical vapor functionalized article has a structure selected from the group consisting of a tube, a pipe, a fixture, a needle, a wafer, a column, a container, a fitting, a piston, a ring, a cylinder, a bearing, a ball, a roller bearing, a tool, a stent, or a combination thereof. 16. The chemical vapor functionalized article of claim 1, wherein the material is an intermediate layer or a coating. 17. The chemical vapor functionalized article of claim 1, wherein the material is a substrate. 18. A chemical vapor fluoro-functionalized article, comprising: a chemical vapor fluoro-functionalization on a material,wherein the material is a substrate selected from the group consisting of a metal substrate, a metallic substrate, a stainless steel substrate, a ceramic matrix composite substrate, a ceramic substrate, a composite metal substrate, a fiber substrate, a foil substrate, and combinations thereof; andwherein the chemical vapor fluoro-functionalized article has a structure selected from the group consisting of a tube, a pipe, a fixture, a needle, a wafer, a column, a container, a fitting, a piston, a ring, a cylinder, a bearing, a ball, a roller bearing, a tool, a stent, or a combination thereof;wherein the chemical vapor fluoro-functionalization is from a single functionalizing step or wherein the functionalization is from a first functionalizing step, followed by a nitrogen fill at partial pressure, followed by a purge, followed by a second functionalizing step. 19. A chemical vapor process, comprising: chemical vapor functionalizing on a material;wherein the chemical vapor functionalizing is on a surface positioned to be contacted by a process fluid, a hydrocarbon, an analyte, exhaust, or a combination thereof;wherein the chemical vapor functionalization is from a single functionalizing step or wherein the chemical vapor functionalization is from a first functionalizing step, followed by a nitrogen fill at partial pressure, followed by a purge, followed by a second functionalizing step.
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