IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0918691
(2015-10-21)
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등록번호 |
US-9978231
(2018-05-22)
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발명자
/ 주소 |
|
출원인 / 주소 |
- INTERNATIONAL BUSINESS MACHINES CORPORATION
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대리인 / 주소 |
McNamara, Esq., Margaret A.
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인용정보 |
피인용 횟수 :
3 인용 특허 :
121 |
초록
▼
Tamper-respondent assemblies and methods of fabrication are provided which include an inner enclosure, a tamper-respondent sensor(s), a protective wrap(s) and an outer enclosure. The inner enclosure is sized to receive one or more electronic components to be protected, and the tamper-respondent sens
Tamper-respondent assemblies and methods of fabrication are provided which include an inner enclosure, a tamper-respondent sensor(s), a protective wrap(s) and an outer enclosure. The inner enclosure is sized to receive one or more electronic components to be protected, and the tamper-respondent sensor(s) wraps around the inner enclosure. The protective wrap(s) overlies and wraps around the tamper-respondent sensor(s) and inner enclosure, and together the inner enclosure, tamper-respondent sensor(s), and protective wrap(s) form a tamper-respondent subassembly. The outer enclosure receives and surrounds, at least in part, the tamper-respondent subassembly, with the tamper-respondent sensor(s) and protective wrap(s) disposed between the inner enclosure and the outer enclosure. When operative, the inner enclosure, tamper-respondent sensor(s), protective wrap(s) and outer enclosure are coupled together and facilitate conduction of heat from the electronic component(s) out to the outer enclosure.
대표청구항
▼
1. A tamper-respondent assembly comprising: an inner enclosure sized to enclose at least one electronic component to be protected;at least one tamper-respondent sensor wrapped around the inner enclosure, the at least one tamper-respondent sensor comprising; at least one flexible layer having opposit
1. A tamper-respondent assembly comprising: an inner enclosure sized to enclose at least one electronic component to be protected;at least one tamper-respondent sensor wrapped around the inner enclosure, the at least one tamper-respondent sensor comprising; at least one flexible layer having opposite first and second sides; andcircuit lines forming at least one tamper-detect network, the circuit lines being disposed on at least one of the first side or the second side of the at least one flexible layer, and the circuit lines having a line width Wl<200 μm, and a line-to-line spacing width Ws<200 μm;at least one protective wrap overlying and wrapped around the at least one tamper-respondent sensor and inner enclosure, wherein the inner enclosure, at least one tamper-respondent sensor and at least one protective wrap form, at least in part, a tamper-respondent subassembly;an outer enclosure receiving, and surrounding, at least in part, the tamper-respondent subassembly, with the at least one tamper-respondent sensor and at least one protective wrap disposed between the inner enclosure and the outer enclosure; andwherein the at least one protective wrap comprises a flexible, thermally conductive material, the inner enclosure is a thermally conductive, inner enclosure, the outer enclosure is a thermally conductive, outer enclosure, and the at least one protective wrap facilitates conduction of heat from the thermally conductive, inner enclosure to the thermally conductive, outer enclosure. 2. The tamper-respondent assembly of claim 1, further comprising an adhesive layer disposed between and securing together the at least one protective wrap and the at least one tamper-respondent sensor. 3. The tamper-respondent assembly of claim 1, wherein the adhesive layer is a thermally conductive adhesive layer. 4. The tamper-respondent assembly of claim 1, wherein the at least one protective wrap comprises at least one layer of thermally conductive gap filler material. 5. The tamper-respondent assembly of claim 4, further comprising a thermally conductive adhesive layer disposed between and securing together the at least one protective wrap and the at least one tamper-respondent sensor. 6. The tamper-respondent assembly of claim 1, further comprising an outer enclosure cap, the outer enclosure and the outer enclosure cap together surrounding and enclosing the tamper-respondent subassembly. 7. The tamper-respondent assembly of claim 6, wherein the outer enclosure is mounted to a circuit board, and the outer enclosure cap is disposed between the tamper-respondent subassembly and the circuit board. 8. The tamper-respondent assembly of claim 7, wherein the outer enclosure cap comprises a thermally conductive plate disposed between the tamper-respondent subassembly and the circuit board. 9. A tamper-proof electronic package comprising: at least one electronic component to be protected;a tamper-respondent assembly comprising: an inner enclosure surrounding and enclosing, at least in part, the at least one electronic component;at least one tamper-respondent sensor wrapped around and covering the inner enclosure, the at least one tamper-respondent sensor comprising; at least one flexible layer having opposite first and second sides; andcircuit lines forming at least one tamper-detect network, the circuit lines being disposed on at least one of the first side or the second side of the at least one flexible layer, and the circuit lines having a line width Wl≤200 μm, and a line-to-line spacing width Ws<200 μm;at least one protective wrap overlying and wrapped around the at least one tamper-respondent sensor and inner enclosure, wherein the inner enclosure, at least one tamper-respondent sensor and at least one protective wrap form, at least in part, a tamper-respondent subassembly;an outer enclosure receiving, and surrounding, at least in part, the tamper-respondent subassembly, with the at least one tamper-respondent sensor and at least one protective wrap disposed between the inner enclosure and the outer enclosure; andwherein the at least one protective wrap comprises a flexible, thermally conductive material, the inner enclosure is a thermally conductive, inner enclosure, the outer enclosure is a thermally conductive, outer enclosure, and the at least one protective wrap facilitates conduction of heat from the thermally conductive, inner enclosure to the thermally conductive, outer enclosure. 10. The tamper-respondent assembly of claim 9, further comprising an adhesive layer, disposed between and securing together the at least one protective wrap and the at least one tamper-respondent sensor, the adhesive layer being a thermally conductive adhesive layer. 11. The tamper-respondent assembly of claim 9, wherein the at least one protective wrap comprises at least one layer of thermally conductive gap filler material, and wherein the tamper-respondent assembly further comprises a thermally conductive adhesive layer disposed between and securing together the at least one protective wrap and the at least one tamper-respondent sensor. 12. The tamper-respondent assembly of claim 9, further comprising an outer enclosure cap, the outer enclosure and the outer enclosure cap together surrounding and enclosing the tamper-respondent assembly. 13. The tamper-respondent assembly of claim 12, wherein the outer enclosure is mounted to a circuit board, and the outer enclosure cap is disposed between the tamper-respondent subassembly and the circuit board. 14. A method of fabricating a tamper-respondent assembly, the method comprising: providing an inner enclosure sized to receive at least one electronic component to be protected;wrapping at least one tamper-respondent sensor around the inner enclosure, the at least one tamper-respondent sensor comprising; at least one flexible layer having opposite first and second sides; andcircuit lines forming at least one tamper-detect network, the circuit lines being disposed on at least one of the first side or the second side of the at least one flexible layer, and the circuit lines having a line width Wl<200 μm, and a line-to-line spacing width Ws<200 μm;providing at least one protective wrap overlying the at least one tamper-respondent sensor and wrapping around the at least one tamper-respondent sensor and inner enclosure, wherein the inner enclosure, at least one tamper-respondent sensor and at least one protective wrap form, at least in part, a tamper-respondent subassembly;providing an outer enclosure sized to receive and surround, at least in part, the tamper-respondent subassembly, with the at least one tamper-respondent sensor and the at least one protective sheet disposed between the inner enclosure and the outer enclosure; andwherein the at least one protective wrap comprises a flexible, thermally conductive material, the inner enclosure is a thermally conductive, inner enclosure, the outer enclosure is a thermally conductive, outer enclosure, and the at least one protective wrap facilitates conduction of heat from the thermally conductive, inner enclosure to the thermally conductive, outer enclosure. 15. The method of claim 14, further comprising securing together the at least one protective wrap and the at least one tamper-respondent sensor using an adhesive layer disposed between the at least one protective wrap and the at least one tamper-respondent sensor. 16. The method of claim 14, wherein the at least one protective wrap comprises at least one layer of thermally conductive gap filler material, and wherein the method further comprises providing a thermally conductive adhesive layer disposed between the at least one protective wrap and the at least one tamper-respondent sensor to secure together the at least one protective wrap and at least one tamper-respondent sensor. 17. The tamper-respondent assembly of claim 1, wherein the at least one tamper-respondent sensor comprises multiple flexible layers disposed in a stack, the at least one flexible layer being at least one flexible layer of the multiple flexible layers, and wherein the multiple flexible layers further comprise another flexible layer, the another flexible layer being a malleable metal film which generates metal debris with an attempted intrusion therethrough. 18. The tamper-respondent assembly of claim 17, wherein the malleable metal film comprises copper or a copper alloy. 19. The tamper-respondent assembly of claim 1, further comprising a heat transfer element coupled to, or integrated with, an inner main surface of the inner enclosure and residing within the inner enclosure between the inner main surface thereof and a respective electronic component of the at least one electronic component, the heat transfer element being thermally conductive and facilitating transfer of heat from the respective electronic component to the inner enclosure. 20. The tamper-respondent assembly of claim 19, wherein the heat transfer element is spaced from the respective electronic component, and a thermal interface filler material is disposed between and couples the heat transfer element and the respective electronic component, and facilitates conductive transfer of heat from the respective electronic component to the inner enclosure through the heat transfer element, the inner enclosure facilitating spreading transferred heat outwards through the at least one tamper-respondent sensor, at least one protective wrap and outer enclosure.
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