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High speed bypass cable for use with backplanes 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-012/00
  • H01R-012/70
  • H01R-013/6471
  • H01R-013/6587
  • H01R-013/6592
  • H01R-013/514
  • H01R-013/6474
출원번호 US-0674656 (2017-08-11)
등록번호 US-9985367 (2018-05-29)
발명자 / 주소
  • Wanha, Christopher D.
  • Lloyd, Brian Keith
  • Abunasrah, Ebrahim
  • Khan, Rehan
  • Resendez, Javier
  • Rost, Michael
출원인 / 주소
  • Molex, LLC
대리인 / 주소
    Sheldon, Stephen L.
인용정보 피인용 횟수 : 3  인용 특허 : 143

초록

A cable bypass assembly is disclosed for use in providing a high frequency transmission line that connect a chip package on a circuit board to connector spaced apart from the chip package. The bypass cable assembly has a structure that allows for low loss between the chip package and the connector.

대표청구항

1. A bypass cable assembly, comprising: a first connector with a plurality of wafers and a plurality of terminals positioned in each of the wafers, the plurality of terminals positioned in a row and including signal terminals and ground terminals, the signal terminals being arranged in pairs and at

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이 특허를 인용한 특허 (3)

  1. Lloyd, Brian Keith; Walz, Gregory B.; Reed, Bruce; Fitzgerald, Gregory; Isaac, Ayman; Regnier, Kent E.; Janowiak, Brandon; Schulz, Darian R.; Ahmad, Munawar; Jones, Eran J.; Resendez, Javier; Rost, Michael, Circuit board bypass assemblies and components therefor.
  2. Regnier, Kent E., Connector system with cable by-pass.
  3. Lloyd, Brian Keith; Hirschy, Christopher David; Ahmad, Munawar; Jones, Eran J.; Hamblin, Stephen W.; Schulz, Darian Ross; Ward, Todd David; Walz, Gregory B.; Abunasrah, Ebrahim; Khan, Rehan, High speed bypass cable assembly.
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