$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Flexible thermal conduit for an electronic device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F28F-021/02
  • F28F-021/08
  • F28F-003/08
  • G02B-027/01
  • G06F-001/16
  • G06F-001/20
  • H05K-001/02
  • H05K-005/02
  • H01L-023/373
출원번호 US-0379425 (2016-12-14)
등록번호 US-9986667 (2018-05-29)
발명자 / 주소
  • Nikkhoo, Michael
  • Heirich, Doug
  • Riccomini, Roy
  • Ye, Maosheng
  • Beerman, Michael
  • Taylor, Joseph Daniel
출원인 / 주소
  • Microsoft Technology Licensing, LLC
대리인 / 주소
    Arent Fox LLP
인용정보 피인용 횟수 : 0  인용 특허 : 42

초록

A flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion of the electronic device, to convey heat generated by an electronic component located in the first housing portion to a heat dissipation structure located in the second housing portion, w

대표청구항

1. A head-mounted display device comprising: a visor assembly including a display assembly to cause an image to be displayed to a user, the visor assembly including an electronic component that generates heat during operation;a head fitting assembly, flexibly coupled to the visor assembly, by which

이 특허에 인용된 특허 (42)

  1. Uttam Shyamalindu Ghoshal, Apparatus for dense chip packaging using heat pipes and thermoelectric coolers.
  2. Nikkhoo, Michael, Bonded multi-layer graphite heat pipe.
  3. Nelson, Michael J.; Wayman, Michael J., Cam shaped hinges.
  4. Maveety, James G.; Chrysler, Gregory M.; Vadakkanmaruveedu, Unnikrishnan, Carbon nanotube micro-chimney and thermo siphon die-level cooling.
  5. Bhattacharya, Anandaroop; MacDonald, Mark; Vijayaraghavan, Sanjay, Chimney-based cooling mechanism for computing devices.
  6. Ingram,Jason W., Conductive heat transfer system and method for integrated circuits.
  7. Chen, Yu; Hung, Wen-Shiang; Chen, Chih-Hsien; Sheu, Young-Kwang, Cool air-supplying device for a computer system.
  8. Werninger, Johannes, Cooling device for an electronic component and cooling system with such cooling devices.
  9. Kroulik, Erwin; Jones, Timothy J., Deflection containing electrical conductor.
  10. Chiang,Lien Jin; Chen,Chun Chen, Electronic apparatus with natural convection structure.
  11. Tomioka, Kentaro, Electronic device and heat conduction member.
  12. Miller, Arlyn Earl; Law, Gary; Burr, Kent A.; Noble-Campbell, Paul; Lam, Vincent; Avery, Laura; Lewis, Garrett; Sloan, Kevin; Foohey, Mark William, Electronic device enclosures having improved ventilation to dissipate heat.
  13. Collins Hugh M. (Nepean CAX) Hayes Hasler R. (Munster Hamlet CAX) Moss John S. (Ottawa CAX) Read Clifford D. (Stittsville CAX) Nicoletta Tristano F. (Nepean CAX) Drayton John B. (Nepean CAX) Pell Dav, Electronic module.
  14. Collins Hugh M. (Nepean CAX) Hayes Hasler R. (Munster Hamlet CAX) Moss John S. (Ottawa CAX) Read Clifford D. (Stittsville CAX) Nicoletta Tristano F. (Nepean CAX) Drayton John B. (Nepean CAX) Pell Dav, Electronic unit.
  15. Kasper James J. (Sheffield Village OH), Flexible jumper and method of making.
  16. Nikkhoo, Michael; Heirich, Doug; Riccomini, Roy; Ye, Maosheng; Beerman, Michael; Taylor, Joseph Daniel, Flexible thermal conduit for an electronic device.
  17. Kilroy, Kevin Donald; Miller, Darren L.; Wavering, Jeffrey T., Flexible thermal transfer strips.
  18. Hara Nobuyuki (Kanagawa JPX) Kawamura Akira (Kanagawa JPX) Matsui Takeshi (Tokyo JPX), Glasses type display apparatus.
  19. Quint Jessica L. (Seattle WA) Robinson Joel W. (Bothell WA), Head mounted display system with light blocking structure.
  20. Maeda Yoshihiro,JPX ; Atsumi Motohiro,JPX ; Kobayashi Hiroyoshi,JPX ; Yamanaka Kazuya,JPX, Head-mount image display apparatus.
  21. Kim,Ye Yong, Heat dissipating structure for mobile device.
  22. Nikkhoo, Michael; Heirich, Doug; Riccomini, Roy; Ye, Maosheng; Beerman, Michael; Hodge, Andrew, Heat dissipation structure for an electronic device.
  23. Foley John M. (Grafton MA) Piuze Ronald L. (Shrewsbury MA) Larson ; Jr. Ralph I. (Bolton MA) Doumani George (North Andover MA), Heat exchange element and enclosure incorporating same.
  24. Masseth, Robert E.; Wilson, Daniel E.; Quan, Michael, Heat exchanger having silicon nitride substrate for mounting high power electronic components.
  25. Voorhes David W. (Winchester MA) Goldman Richard D. (Stoughton MA) Lopez Robert R. (Boxford MA), Heat sink.
  26. Miyahara,Masaharu; Inoue,Yasushi; Suga,Kenji, Heat sink and electronic device employing the same.
  27. Feenstra Sean D., Heat sink utilizing the chimney effect.
  28. Hashizume,Kenichi, Hinge assembly.
  29. Hobein, Thorsten; Gebert, Bernd; Bethke, Lars, Inverter with electrical and electronic components arranged in a sealed housing.
  30. Barna, Kyle Steven, Mechanical heat pump for an electrical housing.
  31. Osterhout, Ralph F.; Lohse, Robert Michael, Method and apparatus for biometric data capture.
  32. Searls, Damion T.; Dishongh, Terrance J.; Jackson, James D.; Morgan, Thomas O.; Weston, Roth O., Method and apparatus for thermally controlling multiple electronic components.
  33. Wavering, Jeffrey T., Micro-die natural convection cooling system.
  34. Kawabe Shin,JPX, Mobile information processing apparatus and covers for the mobile information processing apparatus and the desktop information processing apparatus.
  35. Progl Curtis L. ; Zhang Allen P., Portable computer with flexible heat spreader plate structure therein.
  36. Kung Shao-Tsu,TWX ; Sun Ming-Shen,TWX, Portable computer with heat dissipating device.
  37. Lilke, Harvey D., Refrigerated cabinet and cooling module for same.
  38. White, Ryan R.; Kunert, Steven R., Ruggedized hand held computer.
  39. Hada, Sayuri; Sueoka, Kuniaki; Taira, Yoichi, Sheet having high thermal conductivity and flexibility.
  40. Martorana Richard T. (Andover MA) Heimann Thomas D. (Methuen MA) Bimshas John (Winchester MA), Solid state directional thermal cable.
  41. Teo, Tat Ming; Chiang, Troy Wy Piew; Zhao, JianBing, Thermally conductive flexible member for heat transfer.
  42. Larsson Stefan (Sjomansgatan 17 D Goteborg SEX S-413 15 ) Tennstedt Christer (Smedjegatan 14 Gavle SEX S-802 50 ), Thermoelectric refrigeration system with flexible heatconducting element.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로