The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surround
The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.
대표청구항▼
1. A high power Light Emitting Diode (LED) package mounted on a board, which includes a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer, the high power LED package comprising: an LED chip;a package
1. A high power Light Emitting Diode (LED) package mounted on a board, which includes a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer, the high power LED package comprising: an LED chip;a package body integrally formed with resin to have a recess for receiving the LED chip;a first sheet metal member electrically connected with the LED chip while supporting the LED chip at its upper partial portion in the recess, the first sheet metal member surrounded by the package body and extending to the side face of the package body, the first sheet metal member having a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board;a second sheet metal member electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, the second sheet metal member extending through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member; anda transparent sealant sealingly filled up into the recess. 2. The high power LED package according to claim 1, wherein the heat transfer section of the first sheet metal member is protruded downward from the bottom face of the package body. 3. The high power LED package according to claim 1, wherein the first and second sheet metal members each have at least one hole, and the package body has a plurality of connecting posts that are integrally formed and connected with the upper and lower portions of the package body through the holes. 4. The high power LED package according to claim 1, wherein the first sheet metal member is contacted with one electrode of the LED chip, and further has an external terminal integrally formed therewith to extend over the outside of the package body thereby contacting one pattern line of the board, and wherein the second sheet metal member is connected at one end of the recess-side with the other electrode of the LED chip and extended at the other end of the recess-side out of the package body, thereby contacting the other pattern line of the board. 5. The high power LED package according to claim 1, wherein the second sheet metal member is divided into a pair of first and second terminals insulated from each other, in which the first terminal is connected at one end with one electrode of the LED chip and extended at the other end out of the package body, thereby contacting one pattern line of the board, and wherein the second terminal is connected at one end with the other electrode of the LED chip and extended at the other end over the outside of the package body, thereby being contacting the other pattern line of the board. 6. The high power LED package according to claim 1, wherein the heat transfer section of the first sheet metal member has a T-shaped cross section and extends downwardly. 7. The high power LED package according to claim 1, wherein the heat transfer section of the first sheet metal member is formed such that its lower end facing the second sheet metal member is cut at a slant away from the second sheet metal member and the cut portion of the heat transfer section is covered with the package body. 8. The high power LED package according to claim 1, wherein the second sheet metal member has a structure symmetrical to the first sheet metal member. 9. The high power LED package according to claim 8, wherein the first and second sheet metal members are connected at their lower portion with pattern lines of the board. 10. The high power LED package according to claim 1, further comprising a high reflectivity reflective layer coated on the inner surface of the recess. 11. The high power LED package according to claim 1, further comprising a lens assembled onto the upper surface of the package body, and wherein the package body has a step at its upper edge so as to be engaged with the lower portion of the lens. 12. A high power Light Emitting Diode (LED) package mounted on a board, which includes a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer, the high power LED package comprising: an LED chip;a package body integrally formed with resin to have a recess for receiving the LED chip;a half T-shaped first sheet metal member electrically connected with the LED chip while supporting the LED chip at its upper partial portion in the recess, the first sheet metal member surrounded by the package body and extending to the side face of the package body, wherein the first sheet metal member has an upper section electrically connected at one end with the LED chip and a lower section overlapped on the lower portion of the upper section, the bottom surface of the lower section being exposed through the bottom face of the package body to contact the board;a second sheet metal member electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, the second sheet metal member extending through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member; anda transparent sealant sealingly filled up into the recess. 13. The high power LED package according to claim 12, wherein the upper and lower sections of the first sheet metal member are bonded together with conductive epoxy with high thermal and electric conductivities. 14. The high power LED package according to claim 12, wherein the first sheet metal member is folded up at the other end that is exposed through the package body side so that the upper and lower sections thereof are overlapped vertically on each other. 15. The high power LED package according to claim 12, wherein the other ends of the first and second sheet metal members are protruded from a sidewall of the package body. 16. The high power LED package according to claim 12, wherein the second sheet metal member has a structure symmetrical to that of the first sheet metal member. 17. The high power LED package according to claim 12, wherein the first and second sheet metal members are protruded at their lower ends downwardly from the bottom face of the package body. 18. The high power LED package according to claim 12, further comprising a high reflectivity reflective layer coated on the inner surface of the recess. 19. The high power LED package according to claim 12, further comprising a lens assembled onto the upper surface of the package body, and wherein the package body has a step at its upper edge so as to be engaged with the lower portion of the lens. 20. A high power Light Emitting Diode (LED) package mounted on a board, which includes a metal plate of a heat sink, an insulating layer on the metal plate and a conductive pattern printed with plural pattern lines on the insulating layer, the high power LED package comprising: an LED chip;a package body integrally formed with resin to have a recess for receiving the LED chip;a first sheet metal member electrically connected with the LED chip while supporting the LED chip at its upper partial portion in the recess, the first sheet metal member surrounded by the package body and extending to the side face of the package body, with a partial bottom surface of the first sheet metal member bent downward to be exposed through the bottom face of the package body and to contact the conductive pattern of the board;a second sheet metal member electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, the second sheet metal member extending through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member; anda transparent sealant sealingly filled up into the recess. 21. The high power LED package according to claim 20, wherein the bent shape of the first sheet metal member is formed by etching or press working of a source sheet metal. 22. The high power LED package according to claim 20, wherein a lower portion of the first sheet metal member is exposed at a middle portion in length through the bottom face of the package body. 23. The high power LED package according to claim 22, wherein the exposed lower portion of the first sheet metal member is extended out of the bottom face of the package body. 24. The high power LED package according to claim 20, wherein the first sheet metal member is exposed at the lower portion adjacent to one end thereof through the bottom face of the package body to contact the board. 25. The high power LED package according to claim 20, wherein the other end of the first sheet metal member is protruded out of a sidewall of the package body. 26. The high power LED package according to claim 20, wherein the bottom surface of the first sheet metal member adjacent to one side thereof is cut at a slant away from the second sheet metal member, and the cut portion of the heat transfer section is covered with the package body. 27. The high power LED package according to claim 20, wherein the second sheet metal member has a structure symmetrical to that of the first sheet metal member. 28. The high power LED package according to claim 20, further comprising a high reflectivity reflective layer coated on the inner surface of the recess. 29. The high power LED package according to claim 20, further comprising a lens assembled onto the upper surface of the package body, and wherein the package body has a step at its upper edge so as to be engaged with the lower portion of the lens. 30. A Light Emitting Diode (LED) package, comprising: an LED chip;a package body formed of resin and having a recess for receiving the LED chip;a first sheet metal member electrically connected to the LED chip in the recess, the first sheet metal member being surrounded by the package body;a second sheet metal member electrically connected to the LED chip in the recess and spaced apart from the first sheet metal member by a predetermined gap, the second sheet metal member being surrounded by the package body; anda sealant sealingly filling the recess;wherein the first sheet metal member has a first section having a lower surface exposed through a bottom surface of the package body and a second section integrally extending from the first section toward the side of the package body and exposed through a side surface of the package body,wherein the upper surface of the second section is extended while being coplanar with the upper surface of the first section of the first sheet metal member, andwherein the second sheet metal member has a first section exposed through the bottom surface of the package body. 31. The Light Emitting Diode (LED) package of claim 30, wherein the first sheet metal member supports the LED chip. 32. The Light Emitting Diode (LED) package of claim 31, wherein the first section of the first sheet metal member supports the LED chip. 33. The Light Emitting Diode (LED) package of claim 30, wherein the first section of the first sheet metal member has a first thickness, and the second section has a second thickness lower than the first thickness. 34. The Light Emitting Diode (LED) package of claim 30, wherein the first sheet metal member further comprises a step integrally extending from the first section toward the second sheet metal member. 35. The Light Emitting Diode (LED) package of claim 34, wherein the step supports the LED chip. 36. The Light Emitting Diode (LED) package of claim 30, wherein the lower surface of the first section of the first sheet metal member is coplanar with the bottom surface of the package body. 37. The Light Emitting Diode (LED) package of claim 30, wherein the first section of the first sheet metal member is protruded externally from the bottom surface of the package body. 38. The Light Emitting Diode (LED) package of claim 30, wherein the LED chip is connected to the first sheet metal member and second sheet metal member by the flip chip method. 39. The Light Emitting Diode (LED) package of claim 30, wherein the second sheet metal member is connected to an electrode of the LED chip by a wire. 40. A Light Emitting Diode (LED) package, comprising: an LED chip;a package body formed of resin and having a recess for receiving the LED chip;a first sheet metal member electrically connected to the LED chip in the recess, the first sheet metal member being surrounded by the package body;a second sheet metal member electrically connected to the LED chip in the recess and spaced apart from the first sheet metal member by a predetermined gap, the second sheet metal member being surrounded by the package body; anda sealant sealingly filling the recess;wherein the first sheet metal member has a first section having a lower surface exposed through a bottom surface of the package body, a second section integrally extended from the first section toward the side of the package body and exposed through a side surface of the package body, and a step integrally extending from the first section toward the second sheet metal member, andwherein the second sheet metal member has a first section exposed through the bottom surface of the package body. 41. A Light Emitting Diode (LED) package, comprising: an LED chip;a package body formed with resin to have a recess for receiving the LED chip;a first sheet metal member electrically connected to the LED chip in the recess, the first sheet metal member being surrounded by the package body;a second sheet metal member electrically connected to the LED chip in the recess and spaced apart from the first sheet metal member by a predetermined gap, the second sheet metal member being surrounded by the package body; anda sealant sealingly filling the recess;wherein the first sheet metal member has a first section having a lower surface exposed through a bottom surface of the package body, the first section having a first thickness, and a second section integrally extended from the first section toward the side of the package body and exposed through a side surface of the package body, the second section having a second thickness lower than the first thickness, andwherein the second sheet metal member has a first section exposed through the bottom surface of the package body. 42. The Light Emitting Diode (LED) package of claim 41, wherein an upper surface of the second section is extended while being coplanar with an upper surface of the first section of the first sheet metal member.
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