초록 ▼

A camera module with no PCB that instead has a lens actuator/housing that has circuitry on a bottom surface thereof for direct electrical connection to a mobile electronic device. The housing further has a recess formed in the bottom surface thereof to receive an image sensor. The circuitry is three

A camera module with no PCB that instead has a lens actuator/housing that has circuitry on a bottom surface thereof for direct electrical connection to a mobile electronic device. The housing further has a recess formed in the bottom surface thereof to receive an image sensor. The circuitry is three-dimensional in that it includes a first set of contact pads on one planar surface for connection to the mobile electronic device, a second set of contact pads on a planar surface within the recess for connection to the image sensor, and conductive traces that connect each of the contact pads of the first set with an associated one of the contact pads of the second set by having the trace follow a path from the first planar surface, along a intersecting third planar surface to the second planar surface.

대표청구항 ▼

1. A camera module for attachment to a mobile electronic device, the camera module comprising: an actuator;a housing containing the actuator therein, the housing having a side wall and a bottom formed continuously with the side wall, the bottom including a bottom surface on which electrical circuitr

1. A camera module for attachment to a mobile electronic device, the camera module comprising: an actuator;a housing containing the actuator therein, the housing having a side wall and a bottom formed continuously with the side wall, the bottom including a bottom surface on which electrical circuitry is formed, the electrical circuitry including a first set of contact pads for direct electrical connection to the mobile electronic device and also including a second set of contact pads;a lens received within the housing and coupled to the actuator so that the position of the lens can be adjusted by the actuator; andan image sensor including a third set of contact pads, the image sensor being electrically and mechanically connected to the housing by directly bonding the third set of contact pads to the second set of contact pads;a first recess formed in the bottom surface that receives the image sensor, the first recess being defined by sides extending from the bottom of the module and a first ledge at a base of the first recess perpendicular to the optical axis, the image sensor being mounted on the first ledge;a second recess formed in the bottom surface having a narrower opening than the first recess, the second recess being defined by sides from an inner edge of the first ledge to a second ledge that defines a base of the second recess perpendicular to the optical axis, where the second ledge receives an IR filter between the image sensor and the actuator;a third recess formed in the bottom surface having a narrower opening than the second recess, the third recess being defined by sides extending from an inner edge of the second ledge, the IR filter being below the third recess. 2. A camera module as defined in claim 1, wherein the electrical circuitry on the bottom surface includes three-dimensional circuitry. 3. A camera module as defined in claim 1, wherein the electrical circuitry on the bottom surface includes circuitry located on multiple different planes. 4. A camera module as defined in claim 3, wherein the multiple planes include three different planes. 5. A camera module as defined in claim 4, wherein the three different planes include a pair of planes that are substantially parallel to each other and a third plane that intersects the two substantially parallel planes. 6. A camera module as defined in claim 5, wherein the electrical circuitry further includes a plurality of conductive traces, each of which interconnects one of the first set of contact pads with one of the second set of contact pads, each conductive trace having a portion on each of the three different planes. 7. A camera module as defined in claim 1, wherein the electrical circuitry further includes a plurality of conductive traces, each of which interconnects one of the first set of contact pads with one of the second set of contact pads. 8. A camera module as defined in claim 1, wherein the actuator facilitates movement of the lens within a range of positions to position the lens at selectable distances from the image sensor. 9. A camera module as defined in claim 1, wherein the image sensor is connected to the second set of contact pads via solder bumps. 10. A camera module as defined in claim 1, wherein the camera module does not include a separate circuit board located between the image sensor and the mobile electronic device. 11. A camera module as defined in claim 1, wherein the interface between the camera module and the mobile electronic is via a solder connection between the first set of contact pads and contact pads on the mobile electronic device. 12. A camera module for attachment to a mobile electronic device, the camera module comprising: an actuator; a housing containing the actuator therein, the housing having a side wall and a bottom formed continuously with the side wall, the bottom including a bottom surface on which electrical circuitry is formed, the electrical circuitry including a first set of contact pads for electrical connection to the mobile electronic device and also including a second set of contact pads;a lens received within the housing and coupled to the actuator so that the position of the lens can be adjusted by the actuator; andan image sensor including a third set of contact pads, the image sensor being electrically and mechanically connected to the housing by directly bonding the third set of contact pads to the second set of contact pads; andwherein the electrical circuitry on the bottom surface includes circuitry located on three different planes, including a pair of planes that are substantially parallel to each other and a third plane that intersects the two substantially parallel planes;wherein the electrical circuitry further includes a plurality of conductive traces, each of which interconnects one of the first set of contact pads with one of the second set of contact pads, each conductive trace having a portion on each of the three different planes; andwherein the housing includes a first recess formed in the bottom surface thereof defining a first ledge that receives the image sensor, the first recess being defined by sides extending from the bottom of module and a first ledge at a base of the first recess perpendicular to the optical axis, the image sensor being mounted on the first ledge;wherein the housing includes a second recess formed in the bottom surface having a narrower opening than the first recess, the second recess being defined by sides extending from an inner edge of the first ledge to a second ledge that defines a base of the second recess perpendicular to the optical axis, where second ledge receives an IR filter between the image sensor and the actuator;a third recess formed in the bottom surface having a narrower opening than the second recess, the third recess being defined by sides extending from an inner edge of the second ledge, the IR filter being below the third recess. 13. A camera module as defined in claim 12, wherein the actuator facilitates movement of the lens within a range of positions to position the lens at selectable distances from the image sensor. 14. A camera module as defined in claim 12, wherein the image sensor is connected to the second set of contact pads via solder bumps. 15. A camera module as defined in claim 12, wherein the camera module does not include a separate circuit board located between the image sensor and the mobile electronic device. 16. A camera module as defined in claim 12, wherein the interface between the camera module and the mobile electronic device is via a solder connection between the first set of contact pads and contact pads on the mobile electronic device. 17. A camera module for attachment to a mobile electronic device, the camera module comprising: an actuator;a housing containing the actuator therein the housing having a side wall and a bottom formed continuously with the side wall, the bottom including a bottom surface on which electrical circuitry is formed, the electrical circuitry including a first set of contact pads that directly interface with and provide electrical connection to the mobile electronic device and also including a second set of contact pads;a lens received within the housing and coupled to the actuator so that the position of the lens can be adjusted by the actuator; andan image sensor including a third set of contact pads, the image sensor being electrically and mechanically connected to the housing by directly bonding the third set of contact pads to the second set of contact pads;a first recess formed in the bottom surface defining a first ledge that receives the image sensor, the first recess being defined by sides extending from a bottom of the module and a first ledge at a base of the first recess perpendicular to the optical axis, the image sensor being mounted on the first ledge;a second recess formed in the bottom surface having a narrower opening than the first recess, the second recess being defined by sides extending from an inner edge of the first ledge to a second ledge that defines a base of the second recess perpendicular to the optical axis, where the second ledge receives an IR filter between the image sensor and the actuator;a third recess formed in the bottom surface having a narrower opening than the second recess, the third recess being defined by sides extending from an inner edge of the second ledge, the IR filter being below the third recess. 18. A camera module as defined in claim 17, wherein there is not a separate circuit board at the interface between the camera module and the mobile electronic device. 19. A camera module as defined in claim 17, wherein the interface between the camera module and the mobile electronic device is via a solder connection between the first set of contact pads and contact pads on the mobile electronic device.