A light-emitting device package includes a supporting substrate, a light-emitting device on the supporting substrate, an adhesive layer on at least a portion of a side surface or lower surface of the light-emitting device, the adhesive layer connecting the light-emitting device to the supporting sub
A light-emitting device package includes a supporting substrate, a light-emitting device on the supporting substrate, an adhesive layer on at least a portion of a side surface or lower surface of the light-emitting device, the adhesive layer connecting the light-emitting device to the supporting substrate, and an air layer in a space defined by the supporting substrate, the light-emitting device, and the adhesive layer.
대표청구항▼
1. A light-emitting device package comprising: a supporting substrate;a light-emitting device including a transparent substrate on the supporting substrate and a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, sequentially stacked on the transparen
1. A light-emitting device package comprising: a supporting substrate;a light-emitting device including a transparent substrate on the supporting substrate and a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, sequentially stacked on the transparent substrate;an adhesive layer connecting the light-emitting device to the supporting substrate; andan air layer between the supporting substrate and the light-emitting device;wherein an upper surface of the supporting substrate includes a groove, and the light-emitting device is partially inserted in the groove and is spaced apart from a lower surface of the groove. 2. The light-emitting device package of claim 1, wherein the adhesive layer is formed on at least a portion of a side surface or lower surface of the light-emitting device and connects the light-emitting device to the supporting substrate, and the air layer is formed in a space defined by the supporting substrate, the light-emitting device, and the adhesive layer. 3. The light-emitting device package of claim 1, wherein the light-emitting device is divided into a first region inserted into the groove and a second region not inserted into the groove, andthe adhesive layer has a loop shape surrounding the first region between a side surface of the first region and an inner side surface of the groove. 4. The light-emitting device package of claim 3, wherein the air layer contacts an entire lower surface of the light-emitting device. 5. The light-emitting device package of claim 3, wherein the inner side surface of the groove has a step-like configuration, andthe groove includes,a first groove region having a first lower surface; anda second groove region having a second lower surface at an edge of the first lower surface, the second lower surface being higher than the first lower surface. 6. The light-emitting device package of claim 5, wherein a width of the second groove region is substantially equal to a width of the light-emitting device, and the adhesive layer is formed on the second lower surface, and the light-emitting device is on the adhesive layer in the second groove region. 7. The light-emitting device package of claim 1, wherein the adhesive layer has a loop shape comprising an opening between an upper surface of the supporting substrate and a lower surface of the light-emitting device, and the light-emitting device is on the adhesive layer and covers the opening. 8. The light-emitting device package of claim 7, wherein in a planar view, an area of a flat surface of the air layer is less than an area of the light-emitting device. 9. The light-emitting device package of claim 7, wherein a contact area between the light-emitting device and the air layer is greater than a contact area between the light-emitting device and the adhesive layer. 10. The light-emitting device package of claim 7, wherein the supporting substrate comprises a groove that communicates with the opening. 11. The light-emitting device package of claim 1, wherein an upper surface of the supporting substrate, which contacts the air layer, comprises irregularities. 12. The light-emitting device package of claim 1, further comprising: an encapsulation member that seals the supporting substrate, the adhesive layer, the light-emitting device, and a wire for connecting the light-emitting device to the supporting substrate,wherein the encapsulation member is not formed in the air layer. 13. A light-emitting device package comprising: a supporting substrate;a light-emitting device including a transparent substrate on the supporting substrate and a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, sequentially stacked on the transparent substrate;an adhesive layer connecting the light-emitting device to the supporting substrate;an air layer between the supporting substrate and the light-emitting device; anda reflective structure under the transparent substrate and contacting the air layer,wherein the reflective structure includes a distributed Bragg reflector (DBR) structure. 14. A light-emitting package comprising: a substrate having a groove at an upper surface thereof; anda light-emitting device on the substrate,the light-emitting device being partially in the groove to define an air layer separating the substrate from the light-emitting device in a direction perpendicular to a surface of the substrate. 15. The light-emitting package of claim 14, wherein the light-emitting device comprises a light emitting structure, a transparent layer and a reflective layer. 16. The light-emitting package of claim 15, wherein the light emitting structure comprises a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. 17. The light-emitting package of claim 14, further comprising: an adhesive layer connecting the light-emitting device to the substrate in a direction parallel to the surface of the substrate. 18. The light-emitting package of claim 17, further comprising: an encapsulation member configured to enclose the substrate, the adhesive layer, and the light-emitting device.
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