Glass sealing with transparent materials having transient absorption properties
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C03C-027/06
B29C-065/16
H01L-021/02
H01S-005/02
C03C-004/08
C08K-003/02
출원번호
US-0584559
(2017-05-02)
등록번호
US-10011525
(2018-07-03)
발명자
/ 주소
Logunov, Stephan Lvovich
Quesada, Mark Alejandro
출원인 / 주소
Corning Incorporated
대리인 / 주소
Hardee, Ryan T.
인용정보
피인용 횟수 :
0인용 특허 :
37
초록▼
Transparent glass-to-glass hermetic seals are formed by providing a low melting temperature sealing glass along a sealing interface between two glass substrates and irradiating the interface with laser radiation. Absorption by the sealing glass and induced transient absorption by the glass substrate
Transparent glass-to-glass hermetic seals are formed by providing a low melting temperature sealing glass along a sealing interface between two glass substrates and irradiating the interface with laser radiation. Absorption by the sealing glass and induced transient absorption by the glass substrates along the sealing interface causes localized heating and melting of both the sealing glass layer and the substrate materials, which results in the formation of a glass-to-glass weld. Due to the transient absorption by the substrate material, the sealed region is transparent upon cooling.
대표청구항▼
1. A sealed device comprising: a non-frit, low Tg glass sealing layer formed over a surface of a first substrate; anda device protected between the first substrate and a second substrate,wherein the glass sealing layer is in contact with the second substrate, andwherein the device is hermetically se
1. A sealed device comprising: a non-frit, low Tg glass sealing layer formed over a surface of a first substrate; anda device protected between the first substrate and a second substrate,wherein the glass sealing layer is in contact with the second substrate, andwherein the device is hermetically sealed between the first and second substrates as a function of a composition of impurities in the first or second substrates and as a function of a composition of the glass sealing layer through a local heating of the glass sealing layer with laser radiation having a predetermined wavelength. 2. The device of claim 1, wherein the glass sealing layer comprises: 20-100 mol % SnO;0-50 mol % SnF2; and0-30 mol % P2O5 or B2O3. 3. The device of claim 1, wherein the impurities in the first or second substrates are selected from the group consisting of As, Fe, Ga, K, Mn, Na, P, Sb, Ti, Zn, Sn and combinations thereof. 4. The device of claim 1, wherein the first and second substrates have different lateral dimensions, different CTEs, different thicknesses, or combinations thereof. 5. The device of claim 1, wherein one of the first and second substrates is a glass substrate. 6. The device of claim 5, wherein the other of the first and second substrates is a ceramic substrate or a metal substrate. 7. The device of claim 1, wherein at least one of the first and second substrates is a glass substrate having (a) an absorption of laser radiation having a predetermined wavelength that is less than 15% at room temperature and (b) an induced transient absorption of the laser radiation that is greater than 15% at a sealing temperature greater than 400° C. 8. The device of claim 7, wherein the predetermined wavelength is chosen from UV wavelengths. 9. The device of claim 1, wherein a thickness of the glass sealing layer ranges from about 100 nm to 10 microns. 10. The device of claim 1, wherein the glass sealing layer is optically transparent. 11. The device of claim 1, wherein the glass sealing layer is free of fillers. 12. The device of claim 1, wherein the device is selected from the group consisting of a light emitting diode, an organic light emitting diode, a quantum dot, and combinations thereof. 13. A sealed device comprising: a glass film formed over a surface of a first substrate; anda device protected between the first substrate and a second substrate,wherein the glass film is in contact with the second substrate,wherein the device is hermetically sealed between the first and second substrates, andwherein at least one of the first and second substrates is a glass substrate having (a) an absorption of laser radiation having a predetermined wavelength that is less than 15% at room temperature and (b) an induced transient absorption of the laser radiation that is greater than 15% at a sealing temperature greater than 400° C. 14. The device of claim 13, wherein the glass film comprises a non-frit, low Tg glass. 15. The device of claim 13, wherein the glass film comprises: 20-100 mol % SnO;0-50 mol % SnF2; and0-30 mol % P2O5 or B2O3. 16. The device of claim 13, wherein the glass film is optically transparent. 17. The device of claim 13, wherein the glass film is free of fillers. 18. The device of claim 13, wherein a thickness of the glass film ranges from about 100 nm to 10 microns. 19. The device of claim 13, wherein one of the first and second substrates is a ceramic substrate or a metal substrate. 20. The device of claim 13, wherein the device is selected from the group consisting of a light emitting diode, an organic light emitting diode, a quantum dot, and combinations thereof.
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