A circuit board includes a metal circuit plate, a metallic heat diffusing plate disposed below the metal circuit plate and having an upper surface and a lower surface, a metallic heat dissipating plate below the heat diffusing plate, an insulating substrate disposed between the metal circuit plate a
A circuit board includes a metal circuit plate, a metallic heat diffusing plate disposed below the metal circuit plate and having an upper surface and a lower surface, a metallic heat dissipating plate below the heat diffusing plate, an insulating substrate disposed between the metal circuit plate and the heat diffusing plate, and an insulating substrate disposed between the heat diffusing plate and the heat dissipating plate. A grain diameter of metal grains contained in the heat diffusing plate decreases from each of the upper surface and the lower surface of the heat diffusing plate toward a center portion of the heat diffusing plate in a thickness direction.
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1. A circuit board comprising: a metal circuit plate;a metallic heat diffusing plate below the metal circuit plate;a metallic heat dissipating plate below the heat diffusing plate;a first insulating substrate disposed between the metal circuit plate and the heat diffusing plate and comprising an upp
1. A circuit board comprising: a metal circuit plate;a metallic heat diffusing plate below the metal circuit plate;a metallic heat dissipating plate below the heat diffusing plate;a first insulating substrate disposed between the metal circuit plate and the heat diffusing plate and comprising an upper surface bonded to a lower surface of the metal circuit plate and a lower surface bonded to an upper surface of the heat diffusing plate; anda second insulating substrate disposed between the heat diffusing plate and the heat dissipating plate and comprising an upper surface bonded to a lower surface of the heat diffusing plate and a lower surface bonded to an upper surface of the heat dissipating plate,wherein a grain diameter of metal grains contained in the heat diffusing plate decreases from each of the upper surface and the lower surface of the heat diffusing plate toward a center portion of the heat diffusing plate in a thickness direction. 2. The circuit board according to claim 1, wherein particle diameters of metal grains contained in the metal circuit plate and the heat dissipating plate are larger than the grain diameter of the metal grains contained in the heat diffusing plate. 3. The circuit board according to claim 1, wherein the lower surface of the metal circuit plate and the upper surface of the first insulating substrate are bonded together with a first brazing material interposed therebetween, and the upper surface of the heat diffusing plate and the lower surface of the first insulating substrate are bonded together with a second brazing material interposed therebetween, andwherein a thermal expansion coefficient of the first brazing material in at least an outer peripheral portion of the first brazing material is higher than a thermal expansion coefficient of the second brazing material. 4. The circuit board according to claim 3, wherein at least a part of the outer peripheral portion of the first brazing material is located outside an outer periphery of the metal circuit plate. 5. The circuit board according to claim 1, wherein the lower surface of the heat diffusing plate and the upper surface of the second insulating substrate are bonded together with a third brazing material interposed therebetween, and the upper surface of the heat dissipating plate and the lower surface of the second insulating substrate are bonded together with a fourth brazing material interposed therebetween, andwherein a thermal expansion coefficient of the fourth brazing material in at least an outer peripheral portion of the fourth brazing material is higher than a thermal expansion coefficient of the third brazing material. 6. The circuit board according to claim 5, wherein at least a part of the outer peripheral portion of the fourth brazing material is located outside an outer periphery of the heat dissipating plate. 7. The circuit board according to claim 5, wherein the lower surface of the metal circuit plate and the upper surface of the first insulating substrate are bonded together with a first brazing material interposed therebetween, and the upper surface of the heat diffusing plate and the lower surface of the first insulating substrate are bonded together with a second brazing material interposed therebetween,wherein a thermal expansion coefficient of the first brazing material in at least an outer peripheral portion of the first brazing material is higher than a thermal expansion coefficient of the second brazing material, andwherein the first brazing material and the fourth brazing material have the same composition, and the outer peripheral portion of the first brazing material and the outer peripheral portion of the fourth brazing material are aligned with each other in a transparent plan view. 8. The circuit board according to claim 1, wherein an alloy layer containing a component of the heat diffusing plate and a component of a brazing material is disposed on a side surface of the heat diffusing plate. 9. The circuit board according to claim 1, wherein the second insulating substrate is larger than the insulating substrate above the second insulating substrate in plain view, andwherein the circuit board further comprises a cylindrical frame surrounding a side surface of the second insulating substrate. 10. The circuit board according to claim 1, wherein the first insulating substrate comprises a through hole penetrating the first insulating substrate in a thickness direction, andwherein the circuit board further comprises a through conductor disposed inside the through hole, electrically connected at one end to the metal circuit plate, and electrically connected at the other end to the heat diffusing plate. 11. The circuit board according to claim 1, wherein the metal circuit plate, the heat diffusing plate, and the heat dissipating plate are made of pure copper having a copper content more than or equal to 99.99 mass %. 12. The circuit board according to claim 1, wherein the insulating substrates are made of a silicon nitride based ceramic material. 13. An electronic device comprising: the circuit board according to claim 1; andan electronic component mounted on the metal circuit plate in the circuit board. 14. A circuit board comprising: a metal circuit plate;a plurality of metallic heat diffusing plates disposed below the metal circuit plate and arranged in an up-down direction;a metallic heat dissipating plate below the plurality of heat diffusing plates;a first insulating substrate disposed between the metal circuit plate and an uppermost heat diffusing plate of the plurality of heat diffusing plates and comprising an upper surface bonded to a lower surface of the metal circuit plate and a lower surface bonded to an upper surface of the uppermost heat diffusing plate;a second insulating substrate disposed between a lowermost heat diffusing plate of the plurality of heat diffusing plates and the heat dissipating plate and comprising an upper surface bonded to a lower surface of the lowermost heat diffusing plate and a lower surface bonded to an upper surface of the heat dissipating plate; anda third insulating substrate disposed between a pair of heat diffusing plates adjacent to each other in the up-down direction and comprising an upper surface bonded to a lower surface of an upper heat diffusing plate of the pair of heat diffusing plates and a lower surface bonded to an upper surface of a lower heat diffusing plate of the pair of heat diffusing plates,wherein a grain diameter of metal grains contained in each of the heat diffusing plates decreases from each of the upper surface and the lower surface of the heat diffusing plate toward a center portion of the heat diffusing plate in a thickness direction. 15. The circuit board according to claim 14, wherein the lower surface of the metal circuit plate and the upper surface of the first insulating substrate are bonded together with a first brazing material interposed therebetween, and the upper surface of the heat diffusing plate and the lower surface of the first insulating substrate are bonded together with a second brazing material interposed therebetween, andwherein a thermal expansion coefficient of the first brazing material in at least an outer peripheral portion of the first brazing material is higher than a thermal expansion coefficient of the second brazing material. 16. The circuit board according to claim 14, wherein the lower surface of the heat diffusing plate and the upper surface of the second insulating substrate are bonded together with a third brazing material interposed therebetween, and the upper surface of the heat dissipating plate and the lower surface of the second insulating substrate are bonded together with a fourth brazing material interposed therebetween, andwherein a thermal expansion coefficient of the fourth brazing material in at least an outer peripheral portion of the fourth brazing material is higher than a thermal expansion coefficient of the third brazing material. 17. The circuit board according to claim 16, wherein the lower surface of the metal circuit plate and the upper surface of the first insulating substrate are bonded together with a first brazing material interposed therebetween, and the upper surface of the heat diffusing plate and the lower surface of the first insulating substrate are bonded together with a second brazing material interposed therebetween,wherein a thermal expansion coefficient of the first brazing material in at least an outer peripheral portion of the first brazing material is higher than a thermal expansion coefficient of the second brazing material, andwherein the first brazing material and the fourth brazing material have the same composition, and the outer peripheral portion of the first brazing material and the outer peripheral portion of the fourth brazing material are aligned with each other in a transparent plan view. 18. The circuit board according to claim 14, wherein an alloy layer containing a component of the heat diffusing plate and a component of a brazing material is disposed on a side surface of the heat diffusing plate. 19. The circuit board according to claim 14, wherein the first insulating substrate comprises a through hole penetrating the first insulating substrate in a thickness direction, andwherein the circuit board further comprises a through conductor disposed inside the through hole, electrically connected at one end to the metal circuit plate, and electrically connected at the other end to the heat diffusing plate. 20. An electronic device comprising: the circuit board according to claim 14; andan electronic component mounted on the metal circuit plate in the circuit board.
Palumbo, Gino; McCrea, Jonathan; Tomantschger, Klaus; Brooks, Iain; Jeong, Daehyun; Limoges, Dave; Panagiotopoulos, Konstantinos; Erb, Uwe, Fine-grained metallic coatings having the coeficient of thermal expansion matched to one of the substrate.
Kogure, Ryuichiro; Yokozawa, Tadahiro; Yamaguchi, Hiroaki; Nakayama, Osamu, Production of via hole in a flexible printed circuit board by applying a laser or punch.
Kaga, Youichirou; Kikuchi, Hiromi; Imamura, Hisayuki; Watanabe, Junichi, Silicon nitride substrate, a manufacturing method of the silicon nitride substrate, a silicon nitride wiring board using the silicon nitride substrate, and semiconductor module.
Kaga, Youichirou; Watanabe, Junichi, Silicon nitride substrate, method of manufacturing the same, and silicon nitride circuit board and semiconductor module using the same.
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