초록 ▼

Disclosed are methods of building Z-graded radiation shielding and covers. In one aspect. the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. I

Disclosed are methods of building Z-graded radiation shielding and covers. In one aspect. the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the invention provides methods of improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade than the enclosure.

대표청구항 ▼

1. A method, comprising: (a) providing an existing electronics enclosure having a Z-grade;(b) applying a temperature controller to at least part of the existing electronics enclosure; and(c) forming a Z-graded radiation shield by affixing at least one layer of a first metal to the existing electroni

1. A method, comprising: (a) providing an existing electronics enclosure having a Z-grade;(b) applying a temperature controller to at least part of the existing electronics enclosure; and(c) forming a Z-graded radiation shield by affixing at least one layer of a first metal to the existing electronics enclosure, wherein the first metal has a higher Z-grade than the Z-grade of the existing electronics enclosure, and wherein the temperature controller removes excess heat during the affixing to avoid excessive melting or damaging of the enclosure, wherein the affixing forms a layered enclosure material, and the method further comprising forming a laminate by infusing at least one part of the layered enclosure material with a polymer layer. 2. The method of claim 1, further comprising the step of coating at least one part of the enclosure with a polymer, wherein the polymer comprises a compound selected from the group consisting of epoxy, polyimide, cyanate ester, and mixtures thereof. 3. The method of claim 2, wherein the polymer comprises a. conductive filler to provide increased electro-magnetic-interference resistance. 4. The method of claim 2, further comprising the step of: forming at least one layer of a second metal having a higher Z-grade than the Z-grade of the enclosure. 5. The method of claim 1, wherein the first metal is selected from the group consisting of tantalum, copper, tungsten, titanium, aluminum, and rhenium. 6. The method of claim 1, wherein the temperature controller is a cold finger tool. 7. The method of claim 1, wherein the enclosure comprises an enclosure metal material, glass fibers, graphite fibers, or a fabric material. 8. The method of claim 1, wherein the first metal has a higher melting point than the melting point of the existing electronic enclosure. 9. An apparatus, comprising: a layered material including: an electronics enclosure having a Z-grade;a temperature controller applied to at least part of the electronics enclosure; andat least one layer of a first metal affixed to the electronics enclosure, wherein the first metal has a higher Z-grade than the Z-grade of the electronics enclosure, and wherein the temperature controller is configured to remove excess heat to avoid excessive melting or damaging of the enclosure; anda polymer layer infused with the layered material to form a laminate. 10. The apparatus of claim 9, wherein at least one part of the enclosure is coated with a polymer, wherein the polymer comprises a compound selected from the group consisting of epoxy, polyimide, cyanate ester, and mixtures thereof. 11. The apparatus of claim 10, wherein the polymer comprises a conductive filler. 12. The apparatus of claim 9, wherein the first metal selected from the group consisting of tantalum, copper, tungsten, titanium, aluminum, and rhenium. 13. The apparatus of claim 9, wherein the temperature controller includes a cold finger tool. 14. The apparatus of claim 9, wherein the apparatus further includes at least one layer of a second metal having a higher Z-grade than the Z-grade of the enclosure. 15. The apparatus of claim 9, wherein the enclosure includes an enclosure metal material, glass fibers, graphite fibers, or a fabric material. 16. A method, comprising: (a) providing an electronics enclosure having a Z-grade;(b) applying a temperature controller to at least part of the electronics enclosure; and(c) forming a Z-graded radiation shield by plasma spraying or electro/electroless plating at least one layer of a first metal to the electronics enclosure, wherein the first metal has a higher Z-grade than the Z-grade of the electronics enclosure, wherein the plasma spraying or electro/electroless plating forms a layered enclosure material, and wherein the temperature controller removes excess heat during the forming to avoid excessive melting or damaging of the enclosure; and(d) forming a laminate by performing the step of infusing at least one part of the layered enclosure material with a polymer layer. 17. The method of claim 16, further comprising coating at least one part of the enclosure with a polymer, wherein the polymer comprises a compound selected from the group consisting of epoxy, polyimide, cyanate ester, and mixtures thereof. 18. The method of claim 17, further comprising the step of: forming at least one layer of a second metal having a higher Z-grade than the Z-grade of the enclosure. 19. The method of claim 16, wherein the enclosure comprises an enclosure metal material, glass fibers, graphite fibers, or a fabric material.