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A potted electronic device comprises an electronic device at least partially encapsulated by an energetic potting material. The energetic potting material comprises a halogenated urethane binder and a metal fuel dispersed within the halogenated urethane binder. Related energetic potting materials an

A potted electronic device comprises an electronic device at least partially encapsulated by an energetic potting material. The energetic potting material comprises a halogenated urethane binder and a metal fuel dispersed within the halogenated urethane binder. Related energetic potting materials and methods of forming electronic devices at least partially encapsulated with the energetic potting materials are also disclosed.

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1. A potted electronic device, comprising: an electronic device at least partially encapsulated by an energetic potting material, the energetic potting material comprising:a halogenated urethane binder; andat least one metal fuel selected from the group consisting of magnesium, titanium, tantalum, z

1. A potted electronic device, comprising: an electronic device at least partially encapsulated by an energetic potting material, the energetic potting material comprising:a halogenated urethane binder; andat least one metal fuel selected from the group consisting of magnesium, titanium, tantalum, zirconium, hafnium, aluminum, nickel, cobalt, iron, zinc, molybdenum, oxides thereof, and hydrides thereof dispersed within the halogenated urethane binder. 2. The potted electronic device of claim 1, wherein the halogenated urethane binder comprises a fluorinated urethane binder. 3. The potted electronic device of claim 1, wherein the halogenated urethane binder comprises a perhalogenated urethane binder. 4. The potted electronic device of claim 1, wherein the halogenated urethane binder comprises a reaction product of a multi-functional terminated isocyanate and a multi-functional hydroxyl-terminated perfluoropolyoxy alkane. 5. The potted electronic device of claim 1, wherein the at least one metal fuel comprises spherical particles having an average particle size between about 1 μm and about 100 μm. 6. The potted electronic device of claim 1, wherein a mass of the energetic potting material is between about 1 time and about 10 times a mass of the electronic device. 7. The potted electronic device of claim 1, further comprising at least one ignition device coupled to the energetic potting material. 8. The potted electronic device of claim 7, wherein the at least one ignition device is configured to initiate the energetic potting material responsive to receiving an indication of unauthorized use of the electronic device. 9. The potted electronic device of claim 1, wherein the electronic device is incorporated in one of a desktop computer, a laptop computer, or a mobile phone and the energetic potting material is disposed within a housing containing the electronic device. 10. An energetic potting material formulated and configured to provide environmental protection to an electronic device, the energetic potting material comprising: a halogenated urethane binder; andat least one metal fuel selected from the group consisting of magnesium, titanium, tantalum, zirconium, hafnium, aluminum, nickel, cobalt, iron, zinc, molybdenum, oxides thereof, and hydrides thereof, dispersed within the halogenated urethane binder. 11. The energetic potting material of claim 10, wherein the halogenated urethane binder comprises a perfluorinated urethane binder. 12. The energetic potting material of claim 10, wherein the halogenated urethane binder comprises chlorine and fluorine. 13. The energetic potting material of claim 10, wherein the at least one metal fuel comprises magnesium, titanium, and aluminum. 14. The energetic potting material of claim 10, wherein the halogenated urethane binder comprises a reaction product of an isocyanate and a perfluorinated diol. 15. A method of forming an at least partially encapsulated electronic device, the method comprising: mixing metal particles selected from the group consisting of magnesium, titanium, tantalum, zirconium, hafnium, aluminum, nickel, cobalt, iron, zinc, molybdenum, oxides thereof, and hydrides thereof with at least one halogenated polyol to form a mixture of the metal particles dispersed within the at least one halogenated polyol;mixing the mixture with a diisocyanate to form a urethane blend comprising a reaction product of the halogenated polyol and the diisocyanate, the metal particles dispersed within the urethane blend; andcontacting a substantial portion of an electronic device with the urethane blend. 16. The method of claim 15, further comprising selecting the at least one halogenated polyol to comprise a perhalogenated polyol. 17. The method of claim 15, further comprising selecting the at least one halogenated polyol to comprise a perfluorinated polyol. 18. The method of claim 15, wherein mixing the mixture with a diisocyanate to form a urethane blend comprises mixing the mixture with methyl diphenyl diisocyanate or a prepolymer thereof. 19. The energetic potting material of claim 10, wherein the halogenated urethane binder comprises a fluorinated urethane binder. 20. The energetic potting material of claim 10, wherein the at least one metal fuel comprises spherical particles having an average particle size between about 1 μm and about 100 μm. 21. The energetic potting material of claim 10, wherein the halogenated urethane binder comprises a reaction product of a multi-functional terminated isocyanate and a multi-functional hydroxyl-terminated perfluoropolyoxy alkane. 22. The energetic potting material of claim 10, wherein a heat of reaction of the energetic potting material is between about 2,000 BTU/lb and about 6,000 BTU/lb. 23. The energetic potting material of claim 10, wherein the halogenated urethane binder comprises chlorine. 24. The energetic potting material of claim 10, wherein the halogenated urethane binder comprises a reaction product of a polyol with methyl diphenyl diisocyanate or a prepolymer thereof. 25. The energetic potting material of claim 10, wherein the energetic potting material has a mass between about one time and about ten times a mass of the electronic device.