[특허]Sealing assembly, method for preparing sealing assembly, and battery comprising the sealing assembly

Shenzhen BYD Auto R&D Company Limited

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특허 상세정보

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Sealing assembly, method for preparing sealing assembly, and battery comprising the sealing assembly

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01M-002/08 H01M-002/06 H01M-002/30 B23K-001/008 B23K-001/19 C04B-037/02 H01G-009/20 B23K-101/38
출원번호	US-0368929 (2012-12-26)
등록번호	US-10062874 (2018-08-28)
우선권정보	CN-2011 1 0444125 (2011-12-27)
국제출원번호	PCT/CN2012/087585 (2012-12-26)
국제공개번호	WO2013/097727 (2013-07-04)
발명자 / 주소	Gong, Qing Lin, Xinping Zhang, Xu Lin, Yongzhao Xu, Shurong
출원인 / 주소	Shenzhen BYD Auto R&D Company Limited
대리인 / 주소	Brush, David D.
인용정보	피인용 횟수 : 0 인용 특허 : 5

초록
▼

A sealing assembly, a method of preparing the sealing assembly and a battery are provided. The sealing assembly comprises a metal ring having a mounting hole therein; a ceramic ring having a connecting hole therein and disposed in the mounting hole; and a core column disposed in the connecting hole, wherein at least one of an inner circumferential wall surface of the metal ring, an outer circumferential wall surface of the ceramic ring, an inner circumferential wall surface of the ceramic ring and an outer circumferential wall surface of the core column ...

대표
청구항
▼

1. A sealing assembly, comprising: a metal ring having a mounting hole therein;a ceramic ring having a connecting hole therein and disposed in the mounting hole; anda core column disposed in the connecting hole,wherein each of an inner circumferential wall surface of the metal ring, an outer circumferential wall surface of the ceramic ring, an inner circumferential wall surface of the ceramic ring and an outer circumferential wall surface of the core column is configured as an inclined surface so that the metal ring is configured to be soldered to the ceramic ring and the ceramic ring is configured to be soldered to the core column, and an inclination angle of the inclined surface relative to a vertical plane is about 2 degrees to about 30 degrees,wherein a second soldering layer is disposed between the inner circumferential wall surface of the ceramic ring and the outer circumferential wall surface of the core column,wherein when the sealing assembly is configured as a sealing assembly for at least one of a positive electrode and a negative electrode of a battery, the core column is made of Ti and the second soldering layer is formed by a Ti-based solder material,wherein the Ti-based solder material comprises Ti, and at least one of Zr, Ni, and Cu. 2. The sealing assembly of claim 1, wherein the inner circumferential wall surface of the metal ring and the outer circumferential wall surface of the ceramic ring form a first pair of jointing surfaces, the inner circumferential wall surface of the ceramic ring and the outer circumferential wall surface of the core column form a second pair of jointing surfaces, both the first and second pairs of jointing surfaces are configured as the inclined surface. 3. The sealing assembly of claim 1, wherein a first soldering layer is disposed between the inner circumferential wall surface of the metal ring and the outer circumferential wall surface of the ceramic ring. 4. The sealing assembly of claim 3, wherein the first soldering layer is formed by an Al-based solder material comprising Al and at least one of Si and Mg. 5. The sealing assembly of claim 1, wherein the ceramic ring is made of a material that remains solid at a soldering temperature of at least 580° C. 6. A method for preparing a sealing assembly, comprising steps of: preparing a metal ring having a mounting hole therein, a ceramic ring having a connecting hole therein, and a core column;disposing the core column in the connecting hole of the ceramic ring; anddisposing the ceramic ring in the mounting hole of the metal ring, wherein each of an inner circumferential wall surface of the metal ring, an outer circumferential wall surface of the ceramic ring, an inner circumferential wall surface of the ceramic ring and an outer circumferential wall surface of the core column is configured as an inclined surface so that the metal ring is soldered to the ceramic ring and the ceramic ring is soldered to the core column, and an inclination angle of the inclined surface relative to a vertical plane is about 2 degrees to about 30 degrees,wherein a soldering layer is disposed between the inner circumferential wall surface of the ceramic ring and the outer circumferential wall surface of the core column,wherein when the sealing assembly is configured as a sealing assembly for at least one of a positive electrode and a negative electrode of a battery, the core column is made of Ti and the soldering layer is formed by a Ti-based solder material,wherein the Ti-based solder material comprises Ti, and at least one of Zr, Ni, and Cu,wherein the ceramic ring is mounted in the mounting hole of the metal ring via a first soldering process,wherein the first soldering process is performed at a temperature of about 580 to about 630° C. for about 1 minute to about 5 minutes under vacuum or an inert gas and is performed by using a solder material. 7. The method of claim 6, wherein the inner circumferential wall surface of the metal ring and the outer circumferential wall surface of the ceramic ring form a first pair of jointing surfaces, the inner circumferential wall surface of the ceramic ring and the outer circumferential wall surface of the core column form a second pair of jointing surfaces, both the first and second pairs of jointing surfaces are configured as the inclined surface. 8. The method of claim 6, wherein the core column is mounted in the connecting hole of the ceramic ring via a second soldering process. 9. The method of claim 8, wherein the second soldering process is performed at a temperature lower than a melting point of the core column for about 1 minute to about 10 minutes under vacuum or an inert gas. 10. The method of claim 6, wherein a gap width between the core column and the ceramic ring is adjusted by a deadweight of the core column and the ceramic ring during soldering. 11. A battery, comprising: a shell having at least one open end;an electrode core and electrolyte solution received in the shell; andat least one sealing assembly configured to seal the at least one open end of the shell,wherein the sealing assembly comprises: a metal ring having a mounting hole therein,a ceramic ring having a connecting hole therein and disposed in the mounting hole,a core column disposed in the connecting hole,wherein each of an inner circumferential wall surface of the metal ring, an outer circumferential wall surface of the ceramic ring, an inner circumferential wall surface of the ceramic ring and an outer circumferential wall surface of the core column is configured as an inclined surface so that the metal ring is soldered to the ceramic ring and the ceramic ring is soldered to the core column, and an inclination angle of the inclined surface relative to a vertical plane is about 2 degrees to about 30 degrees, wherein a second soldering layer is disposed between the inner circumferential wall surface of the ceramic ring and the outer circumferential wall surface of the core column,wherein when the sealing assembly is configured as a sealing assembly for at least one of a positive electrode and a negative electrode of a battery, the core column is made of Ti and the second soldering layer is formed by a Ti-based solder material,wherein the Ti-based solder material comprises Ti, and at least one of Zr, Ni, and Cu; andwherein the metal ring of the sealing assembly is connected with the shell and the core column is connected with the electrode core.

이 특허에 인용된 특허 (5)

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Sealing assembly, method for preparing sealing assembly, and battery comprising the sealing assembly

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Sealing assembly, method for preparing sealing assembly, and battery comprising the sealing assembly

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이 특허에 인용된 특허 (5)

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