Antimicrobial copper sheet overlays and related methods for making and using
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-001/09
A01N-025/34
A01N-059/20
H05K-003/22
출원번호
US-0887375
(2015-10-20)
등록번호
US-10064273
(2018-08-28)
발명자
/ 주소
Meehan, Jr., Patrick H.
출원인 / 주소
MR Label Company
대리인 / 주소
Calfee, Halter & Griswold LLP
인용정보
피인용 횟수 :
0인용 특허 :
133
초록▼
Control panels with antimicrobial copper sheet overlays are disclosed. In some embodiments, the antimicrobial copper used in the copper sheet overlays can be selected from copper or copper alloys containing from about 60 to about 100 wt % copper. In other embodiments, the copper sheet overlays have
Control panels with antimicrobial copper sheet overlays are disclosed. In some embodiments, the antimicrobial copper used in the copper sheet overlays can be selected from copper or copper alloys containing from about 60 to about 100 wt % copper. In other embodiments, the copper sheet overlays have one or more deflection spots to permit an operator to use the control panel to operate an electronic device. Some embodiments include methods to manufacture the control panels comprising antimicrobial copper sheet overlays. Further embodiments include methods for operating an electronic device using the control panels comprising antimicrobial copper sheet overlays.
대표청구항▼
1. A control panel surface comprising an antimicrobial copper sheet overlay comprising metallic copper or a metallic copper alloy of unitary design, said copper sheet overlay having at least one deflection spot with a vertical travel length of from 0.1 mm to 5 mm, wherein there are no gaps or crevic
1. A control panel surface comprising an antimicrobial copper sheet overlay comprising metallic copper or a metallic copper alloy of unitary design, said copper sheet overlay having at least one deflection spot with a vertical travel length of from 0.1 mm to 5 mm, wherein there are no gaps or crevices in the copper sheet overlay around the at least one deflection spot, andwherein the antimicrobial copper sheet overlay is printed with at least one ink to form at least one graphic on an area other than the at least one deflection spot. 2. The control panel surface of claim 1, wherein the antimicrobial copper sheet overlay has a thickness t from 0.002 inches to 0.008 inches. 3. The control panel surface of claim 1, wherein the antimicrobial copper sheet overlay comprises copper or a copper alloy comprising from 60 wt % to 100 wt % copper. 4. The control panel surface of claim 3, wherein the copper or copper alloy is tempered to a temper selected from the group consisting of ¼ hard, ½ hard, ¾ hard, hard, extra hard, and spring. 5. The control panel surface of claim 3, wherein the copper or copper alloy has a tensile strength from 350 N/mm2 to 600 N/mm2. 6. The control panel surface of claim 1, wherein the antimicrobial copper sheet overlay comprises more than one deflection spot. 7. The control panel surface of claim 1, wherein one or more of the at least one deflection spot is embossed. 8. The control panel surface of claim 1, wherein the antimicrobial copper sheet overlay is part of a control panel. 9. A control panel comprising: a. a control panel surface comprising an antimicrobial copper sheet overlay comprising metallic copper or a metallic copper alloy of unitary design, said copper sheet overlay having at least one deflection spot with a vertical travel length of from 0.1 mm to 5 mm, andb. a circuit board comprising at least one switch, wherein there are no gaps or crevices in the copper sheet overlay around the at least one deflection spot, wherein the at least one deflection spot is located over the at least one switch on the circuit board, and wherein the antimicrobial copper sheet overlay is printed with at least one ink to form at least one graphic on an area other than the at least one deflection spot. 10. The control panel of claim 9, wherein the control panel surface comprises more than one antimicrobial copper sheet overlays. 11. The control panel of claim 9, wherein the control panel comprises more than one circuit board. 12. The control panel of claim 9, wherein the antimicrobial copper sheet overlay has a thickness t from 0.002 inches to 0.008 inches. 13. The control panel of claim 9, wherein the antimicrobial copper sheet overlay comprises copper or a copper alloy comprising from 60 wt % to 100 wt % copper. 14. The control panel of claim 13, wherein the copper or copper alloy is tempered to a temper selected from the group consisting of ¼ hard, ½ hard, ¾ hard, hard, extra hard, and spring. 15. The control panel of claim 13, wherein the copper or copper alloy has a tensile strength from 350 N/mm2 to 600 N/mm2. 16. The control panel of claim 9, wherein the antimicrobial copper sheet overlay comprises more than one deflection spots. 17. The control panel of claim 9, wherein one or more of the at least one deflection spot is embossed. 18. The control panel of claim 9, wherein the at least one deflection spot can withstand a finger press at a force of 4.5 N for at least 100,000 cycles without the antimicrobial copper sheet overlay being damaged. 19. A method of operating an electronic device, comprising: a. providing an electronic device;b. providing a control panel intended to operate the electronic device, wherein the control panel comprises: i. a control panel surface, wherein the control panel surface comprises an antimicrobial copper sheet overlay comprising metallic copper or a metallic copper alloy of unitary design, said copper sheet overlay having at least one deflection spot with a vertical travel length of from 0.1 mm to 5 mm, wherein there are no gaps or crevices in the copper sheet overlay around the at least one deflection spot, and wherein the antimicrobial copper sheet overlay is printed with at least one ink to form at least one graphic on an area other than the at least one deflection spot; andii. a circuit board located under the control panel surface, wherein the circuit board comprising at least one switch located under the at least one deflection spot;c. pressing the at least one deflection spot on the antimicrobial copper sheet overlay to operate the electronic device. 20. The method of claim 19, wherein one or more of the at least one deflection spot is embossed. 21. The method of claim 19, wherein the antimicrobial copper sheet overlay has a thickness t from 0.002 inches to 0.008 inches. 22. The method of claim 19, wherein the antimicrobial copper sheet overlay comprises copper or a copper alloy comprising from 60 to 100 wt % copper. 23. The method of claim 19, wherein the antimicrobial copper sheet overlay comprises more than one deflection spot and the circuit board comprises more than one switch.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (133)
Batista, William Romao; Coutinho, Ricardo; Neves, Maria Campos Beta; Lopes, Claudio Cerqueira; Lopes, Rosangela Sabbatini; Martins, Vanessa de Almeida; Pereira, Renato Crespo, 1-hydroxy-2-O-acyl-sn-glycero-3-phosphocholine compounds, preparation process, antifouling composition, process for its preparation, method to prevent fouling, method to turn a surface into an antifouling surface, and, covered surface.
Ziegler, Gunter; Gollwitzer, Hans; Heidenau, Frank; Mittelmeier, Wolfram; Stenzel, Frauke, Anti-infectious, biocompatible titanium coating for implants, and method for the production thereof.
Borrelli, Nicholas Francis; Petzold, Odessa Natalie; Schroeder, III, Joseph Francis; Senaratne, Wageesha; Verrier, Florence; Wei, Ying, Antimicrobial action of Cu, CuO and Cu2O nanoparticles on glass surfaces and durable coatings.
Dehnad, Houdin; Chirico, Paul E.; Chopko, Bohdan Wolodymyr; Barr, John; McCormick, Robert Vincent; Lucero, Julie; Jegge, Jason A., Bioabsorbable substrates and systems that controllably release antimicrobial metal ions.
Chang, Hsin-Pei; Chen, Wen-Rong; Chiang, Huann-Wu; Chen, Cheng-Shi; Li, Cong, Coated article having antibacterial effect and method for making the same.
Chang, Hsin-Pei; Chen, Wen-Rong; Chiang, Huann-Wu; Chen, Cheng-Shi; Li, Cong, Coated article having antibacterial effect and method for making the same.
Chang, Hsin-Pei; Chen, Wen-Rong; Chiang, Huann-Wu; Chen, Cheng-Shi; Li, Cong, Coated article having antibacterial effect and method for making the same.
Doye, Christian; Krüger, Ursus; Schneider, Manuela, Component with a coating for reducing the wettability of the surface and method for production thereof.
Yeager Charles C. (Auburn CA) Eachus Leo A. (Coeur d\Alene ID) Gullixson Bruce B. (Spokane WA), Composition and process of combining a grout or mortar mix with copper-8-quinolinolate to form an antimicrobial composit.
Tomalia, Donald A.; Swanson, Douglas R.; Huang, Baohua; Pulgam, Veera Reddy; Heinzelmann, Joseph R.; Svenson, Sonke; Reyna, Lori A.; Zhuravel, Michael A.; Chauhan, Abhay Singh; DeMattei, Cordell R., Dendritic polymers with enhanced amplification and interior functionality.
Bignozzi, Carlo Alberto; Dissette, Valeria; Corallini, Alfredo; Carra′, Giacomo; Della Valle, Renato, Functional nanomaterials with antibacterial and antiviral activity.
Hidetoshi Saitoh JP; Shigeo Ohshio JP; Norio Tanaka JP; Hideki Sunayama JP, Material having titanium dioxide crystalline orientation film and method for producing the same.
Saitoh Hidetoshi,JPX ; Ohshio Shigeo,JPX ; Tanaka Norio,JPX ; Sunayama Hideki,JPX, Material having titanium dioxide crystalline orientation film and method for producing the same.
Prosl, Frank R.; Polaschegg, Hans-Dietrich; Estabrook, Brian K.; Sodemann, Klaus, Method and apparatus for overcoming infection in a tissue pocket surrounding an implanted device.
Agg, Philip James; Shawcross, James Timothy; Pickford, Martin Edward Lee; Turner, Andrew Derek; Lewis, David Richard, Method of manufacturing metal with biocidal properties.
Shigeru Keijiro,JPX ; Inoue Yoshitomo,JPX ; Yokota Takeshi,JPX ; Tochihara Misako,JPX ; Satoh Susumu,JPX, Method of producing antimicrobial metal articles and antimicrobial metal articles produced by the method.
Sinsel, John A.; Loen, Mark V.; Speckhals, Kenneth H., Methods and apparatus for production of composite-coated rigid flat-rolled sheet metal substrate.
Pratt, Richard; Johnson, Thomas D.; Suh, Timothy, Methods of maintaining and using a high concentration of dissolved copper on the surface of a useful article.
Kiik, Matti; Bryson, Michael L.; Weaver, Casimir Paul; Pine, Robert Eugene, Surface covering building materials resistant to microbial growth staining.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.