A thermal management system for an enclosure containing electrical components includes a thermoelectric cooling unit for controlling temperature inside the enclosure and a controller for the cooling unit, the controller being configured so that it can be installed within and protected by the enclosu
A thermal management system for an enclosure containing electrical components includes a thermoelectric cooling unit for controlling temperature inside the enclosure and a controller for the cooling unit, the controller being configured so that it can be installed within and protected by the enclosure, rather than requiring its own separate secure enclosure. The controller can further be installed within a housing of the thermoelectric cooling unit, which housing does not increase the footprint of the cooling unit.
대표청구항▼
1. A thermal management system for an enclosure containing electrical components, the thermal management system comprising: a thermoelectric cooling unit mounted on the enclosure such that the cooling unit heats and cools, in different operating modes, an interior space of the enclosure, the cooling
1. A thermal management system for an enclosure containing electrical components, the thermal management system comprising: a thermoelectric cooling unit mounted on the enclosure such that the cooling unit heats and cools, in different operating modes, an interior space of the enclosure, the cooling unit comprising: a frame attaching to the enclosure to mount the cooling unit to the enclosure;a first fan mounted on an external side of the frame and pulling air into the cooling unit;an internal heat sink attached to the frame on an internal side of the frame that faces into the interior space when the cooling unit is installed on the enclosure;a housing mounted on the frame and extending into the interior space of the enclosure when the cooling unit is installed on the enclosure, the internal heat sink being disposed between the frame and the housing; anda second fan mounted on the frame for circulating air within the interior space; anda controller in electrical communication with the cooling unit, the controller being located within the housing and comprising: a circuit board;an input quick connector disposed on the circuit board and configured to receive a first cable connector for providing power to the circuit board;an output quick connector disposed on the circuit board in electrical communication with the input quick connector, and configured to receive a second cable connector for supplying a first control signal and a second control signal to the cooling unit, the first control signal controlling a cooling operating mode of the cooling unit, and the second control signal controlling a heating operating mode of the cooling unit;a first device header configured to receive a third cable connector for supplying power from the input quick connector to the first fan; anda second device header configured to receive a fourth cable connector for supplying power from the input quick connector to the second fan. 2. The thermal management system of claim 1, wherein the controller is mounted at an acute angle with respect to vertical within the housing. 3. The thermal management system of claim 1, wherein the housing further contains all or part of the second fan. 4. The thermal management system of claim 1, wherein: the input quick connector provides to the circuit board a positive voltage, a negative voltage, a common ground, a normal open, and a normal close;the output quick connector is a two pin connector in which a first pin supplies a positive H-bridge signal as the first control signal and a second pin supplies a negative H-bridge signal as the second control signal; andthe first device header is a four pin connector that supplies a positive fan voltage, a negative fan voltage, and a pulse-width modulated speed signal to the first fan, and that receives a fan speed signal from the first fan. 5. A thermal management system for an enclosure containing electrical components, the thermal management system comprising: a thermoelectric cooling unit comprising: a frame that mounts the cooling unit to the enclosure such that the cooling unit cools a first interior space of the enclosure;a housing mounted on the frame and being disposed within the enclosure when the cooling unit is installed on the enclosure; anda first fan mounted on the frame for circulating air within the interior space; anda controller in electrical communication with the cooling unit and configured to operate one or more components of the cooling unit, the controller comprising a circuit board mounted within the housing at an acute angle with respect to a vertical plane of reference of the enclosure. 6. The thermal management system of claim 5, wherein the controller comprises a two-pin output quick connector. 7. The thermal management system of claim 6, wherein the controller further comprises a first device header electrically connected to the cooling unit to control the first fan. 8. The thermal management system of claim 7, wherein: the output quick connector supplies from the controller a negative H-bridge signal and a positive H-bridge signal; andthe first device header supplies from the controller a positive first fan voltage, a negative first fan voltage, and a first pulse-width modulated speed signal, and receives from the first fan a first fan speed signal. 9. The thermal management system of claim 8, wherein the negative H-bridge signal controls a cooling operation of the cooling unit, and the positive H-bridge signal controls a heating operation of the cooling unit. 10. The thermal management system of claim 8, wherein: the cooling unit further comprises a second fan mounted on the frame for pulling air into the enclosure; andthe controller further comprises a second device header mounted on the circuit board and electrically connected to the cooling unit to control the second fan, the second device header supplying from the controller a positive second fan voltage, a negative second fan voltage, and a second pulse-width modulated speed signal, and receiving from the second fan a second fan speed signal. 11. The thermal management system of claim 6, wherein the circuit board includes a thermistor connector. 12. The thermal management system of claim 5, further comprising a cover dividing the housing into a first compartment and a second compartment, the first compartment containing all or a part of the first fan, and the second compartment containing the controller, the cover enclosing the second compartment. 13. The thermal management system of claim 12, wherein the cover comprises an aperture for connecting a thermistor to the controller from external the housing. 14. The thermal management system of claim 5, wherein the cooling unit further comprises: an internal heat sink attached to the frame and disposed within the enclosure when the cooling unit is installed on the enclosure; anda sleeve attached to the frame and disposed over the internal heat sink, the housing being mounted on the frame via attachment of the housing to the sleeve. 15. The thermal management system of claim 12, wherein: the housing further comprises a first wall, a second wall attached to or integral with the first wall, a third wall attached to or integral with the second wall, and a fourth wall attached to or integral with the third wall and the first wall, the first wall, second wall, third wall, and fourth wall extending orthogonally away from the frame to define a second interior space of the housing;the cover comprises a first member extending parallel to the frame across a portion of the second interior space, and a second member integral with the first member and extending orthogonally from the first member into the second interior space to create the first compartment and the second compartment; andthe acute angle is selected to allow the controller to be disposed within the first compartment enclosed by the cover. 16. The thermal management system of claim 15, wherein the cooling unit further comprises an external heat sink mounted on the external side of the frame and being disposed outside of the enclosure when the cooling unit is installed on the enclosure. 17. A thermal management system for an enclosure containing electrical components, the thermal management system comprising: a thermoelectric cooling unit mounted on the enclosure such that the cooling unit heats and cools, in different operating modes, an interior space of the enclosure, the cooling unit comprising: a frame attaching to the enclosure to mount the cooling unit to the enclosure;a first fan mounted on an external side of the frame and pulling air into the cooling unit;an internal heat sink attached to the frame on an internal side of the frame that faces into the interior space when the cooling unit is installed on the enclosure; anda second fan mounted on an internal side of the frame for circulating air within the interior space; anda controller in electrical communication with the cooling unit, the controller being located within the enclosure such that the internal heat sink is disposed at least partially between the frame and the controller. 18. The thermal management system of claim 17, wherein the cooling unit further comprises a housing mounted on the internal side of the frame, the internal heat sink being disposed between the frame and the housing, and the controller being disposed within the housing. 19. The thermal management system of claim 18, further comprising a cover enclosing at least a portion of the housing, wherein the controller comprises a circuit board mounted at an acute angle, with respect to vertical when the cooling unit is installed on the enclosure, within the housing, the acute angle selected to allow the controller to be disposed within the portion of the housing enclosed by the cover. 20. The thermal management system of claim 18, wherein the housing further contains all or part of the second fan.
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이 특허에 인용된 특허 (8)
Chaney ; Jr. Robert K. ; Rowlette Mitchell R. ; Miller Mark E., Apparatus and method for control of a heat pump system.
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