초록 ▼

The invention relates to a soldering module (3) for the, in particular selective, soldering of components to a circuit board (14), having a soldering nozzle (32) for creating a solder wave. It is proposed that the soldering module (3) comprises a linear conveyor (8), in particular a belt conveyor or

The invention relates to a soldering module (3) for the, in particular selective, soldering of components to a circuit board (14), having a soldering nozzle (32) for creating a solder wave. It is proposed that the soldering module (3) comprises a linear conveyor (8), in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board (14) by moving the circuit board (14) in a conveying direction over the solder wave, and that the linear conveyor (8) is tiltable, in particular about a first tilting axis (23).

대표청구항 ▼

1. A soldering module for the soldering of components to a circuit board, having a soldering nozzle for creating a solder wave, the soldering module comprising a linear conveyor including one of a belt conveyor and a chain conveyor, for applying solder to the circuit board by moving the circuit boar

1. A soldering module for the soldering of components to a circuit board, having a soldering nozzle for creating a solder wave, the soldering module comprising a linear conveyor including one of a belt conveyor and a chain conveyor, for applying solder to the circuit board by moving the circuit board in a conveying direction over the solder wave, and in that the linear conveyor is tiltable about a first tilting axis,wherein the first tilting axis is oriented substantially perpendicularly to a direction of gravitational force and substantially perpendicularly to a conveying direction or substantially parallel to the conveying direction,wherein the linear conveyor is tiltable about a second tilting axis, wherein the second tilting axis is oriented substantially normal to the direction of gravitational force, andwherein the first tilting axis and/or the second tilting axis extends through the solder wave. 2. The soldering module as claimed in claim 1, wherein the linear conveyor is tiltable about the first tilting axis such that the normal of the circuit board encloses an angle of at least 4°, of at least 8°, or of at least 10°, with the direction of gravitational force. 3. The soldering module as claimed in claim 1, wherein the linear conveyor is tiltable while the circuit board is being moved over the solder wave. 4. The soldering module as claimed in claim 1, wherein a soldering nozzle is movable in a plane oriented substantially normal to the direction of gravitational force. 5. The solder module as claimed in claim 4, wherein a distance between the soldering nozzle and the circuit board is sellable by moving the soldering nozzle. 6. The soldering module as claimed in claim 4, wherein the soldering nozzle is rotatable. 7. The soldering module as claimed in claim 4, wherein the soldering nozzle is wettable with solder, and is manufactured from steel. 8. The soldering module as claimed in claim 4, wherein the soldering nozzle is not wettable with solder, and is manufactured from a stainless, coated, steel. 9. The soldering module as claimed in claim 1, wherein the soldering module has an inert gas device. 10. The soldering module as claimed in claim 1, wherein provision is made of a solder joint processing device, wherein the solder joint processing device comprises a gas nozzle. 11. The soldering module as claimed in claim 4, wherein the soldering module has a second soldering nozzle for creating a second solder wave. 12. A soldering plant having a first soldering module as claimed in claim 1 and a flux module. 13. The soldering plant as claimed in claim 12, wherein the soldering plant has a preheating module. 14. The soldering plant as claimed in claim 12, wherein the soldering plant has a second soldering module. 15. A method for soldering components to a circuit board using a soldering module as claimed in claim 1, wherein a populated circuit board is received on the linear conveyor, wherein the linear conveyor is in a receiving position, in that the linear conveyor is tilted into a first processing position, in that the circuit board is moved over a first solder wave by means of the linear conveyor, wherein a subregion of the circuit board is wetted with solder.