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High efficiency thermal management system

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F25D-017/02
  • F25D-023/12
  • F25D-025/00
  • F28C-003/08
  • H01L-023/427
  • H01L-023/473
  • F28D-015/00
출원번호 US-0709096 (2015-05-11)
등록번호 US-10088238 (2018-10-02)
발명자 / 주소
  • Shedd, Timothy A.
출원인 / 주소
  • Wisconsin Alumni Research Foundation
대리인 / 주소
    Boyle Fredrickson, S.C.
인용정보 피인용 횟수 : 0  인용 특허 : 38

초록

Disclosed are methods and apparatuses for cooling a work piece surface using two-phase impingement, such as direct jet impingement. Preferred method include flowing a coolant through a chamber comprising a surface to be cooled by projecting a jet stream of coolant against the surface while maintaini

대표청구항

1. An apparatus for cooling a surface with a coolant, comprising: an enclosed chamber having an interior in communication with the surface, an inlet and an outlet, the inlet and the outlet being configured for flowing the coolant through the interior of the chamber against the surface and exiting th

이 특허에 인용된 특허 (38)

  1. Porter Warren W. (Escondido CA), Apparatus and method for cooling an electronic device.
  2. Daikoku Takahiro (Ushiku JPX) Inouye Hiroshi (Ibaraki JPX), Apparatus for cooling heat generating members.
  3. Mittal Faquir C. (Audubon PA), Apparatus for cooling integrated circuit chips with forced coolant jet.
  4. Jacob William L. (Pittsburgh PA), Apparatus for cooling strip and associated method.
  5. Weber, Richard M., Apparatus for cooling with coolant at subambient pressure.
  6. Kanda Atsushi (Hyogo JPX) Kitani Kazuo (Hyogo JPX) Shirai Kiichirou (Kanagawa JPX), Boiling refrigerant-type cooling system.
  7. Tsoi,Vadim, Cabinet cooling.
  8. Dereje Agonafer ; Richard C. Chu ; Michael J. Ellsworth, Jr. ; Robert E. Simons, Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof.
  9. Cree Roger W. (Stillwater MN), Computer cooling system.
  10. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cooling computer systems.
  11. Ikeda Hironobu (Tokyo JPX), Cooling structure for integrated circuits.
  12. Umezawa Kazuhiko (Tokyo JPX), Cooling structure for integrated circuits.
  13. Yamamoto Haruhiko (Yokohama JPX) Suzuki Masahiro (Inagi JPX) Udagawa Yoshiaki (Tokyo JPX) Nakata Mitsuhiko (Kawasaki JPX) Katsuyama Koji (Yokohama JPX) Ono Izumi (Hachioji JPX) Kikuchi Shunichi (Yoko, Cooling system for an electronic circuit device.
  14. Monfarad, Ali Heydari, Field replaceable packaged refrigeration heat sink module for cooling electronic components.
  15. Ghosh,Debashis; Bhatti,Mohinder Singh; Reyzin,Ilya; Parisi,Mark Joseph, Heat sink for an electronic device.
  16. Kramer, Gary W.; Frankel, Richard S., High flux heat removal system using jet impingement of water at subatmospheric pressure.
  17. Niggemann Richard Everett, High intensity cooler.
  18. Dunn, John; Novotny, Shlomo; Vogel, Marlin, High-power multi-device liquid cooling.
  19. Correia Victor H. (Scotia NY) Brown Theresa A. (Ballston Lake NY) Chiu R. Paul (Scotia NY), Impingement cooling and cooling medium retrieval system for turbine shrouds and methods of operation.
  20. Lee,Hsieh Kun; Lai,Cheng Tien; Zhou,Zhi Yong, Liquid cooling device.
  21. Mizuno Tsukasa (Tokyo JPX) Miyazaki Hirokazu (Tokyo JPX) Umezawa Kazuhiko (Tokyo JPX), Liquid cooling system for LSI packages.
  22. Nakajima Tadakatsu (Ibaraki JPX) Ohashi Shigeo (Tsuchiura JPX) Kuwahara Heikichi (Ibaraki JPX) Ashiwake Noriyuki (Tsuchiura JPX) Sato Motohiro (Ibaraki JPX) Hatsuda Toshio (Ibaraki JPX) Daikoku Takah, Liquid impingement cooling module for semiconductor devices.
  23. Quon William (Alhambra CA) Tanzer Herbert J. (Topanga CA), Liquid jet cold plate for impingement cooling.
  24. Yamamoto Haruhiko (Yokohama JPX) Katsuyama Kouji (Yokohama JPX) Nakata Mitsuhiko (Kawasaki JPX) Kikuchi Shunichi (Yokohama JPX), Liquid-cooling module system for electronic circuit components.
  25. Yoshikawa Minoru (Tokyo JPX), Low boiling point liquid coolant cooling structure for electronic circuit package.
  26. Pautsch, Gregory W.; Pautsch, Adam, Method and apparatus for cooling electronic components.
  27. Ichida Kozaburo (Kitakyushu JPX) Nagira Norichika (Kitakyushu JPX) Murata Mineo (Kitakyushu JPX) Namba Tadashige (Kitakyushu JPX), Method and apparatus for cooling steel strip.
  28. Rini, Daniel P.; Anderson, H. Randolph; Kapat, Jayanta Sankar; Chow, Louis, Method and apparatus for high heat flux heat transfer.
  29. Rini,Daniel P.; Anderson,H. Randolph; Kapat,Jayanta Sankar; Chow,Louis, Method and apparatus for high heat flux heat transfer.
  30. Gregory S. Cole ; Robert P. Scaringe, Method and two-phase spray cooling apparatus.
  31. Frieser Rudolf G. (Poughkeepsie NY) Reeber Morton D. (Shrub Oak NY), Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant.
  32. Wilson Donald W., Process for preserving taste and reducing bacteria in frozen seafood products.
  33. Marsala, Joseph, Pumped liquid cooling system using a phase change refrigerant.
  34. Nakajima Tadakatsu (Ibaraki JPX) Kuwahara Heikichi (Ibaraki JPX) Ohashi Shigeo (Ibaraki JPX) Satoh Motohiro (Ibaraki JPX) Yamada Toshihiro (Ibaraki JPX) Kasai Kenichi (Ushiku JPX) Kobayashi Satomi (N, Semiconductor cooling apparatus.
  35. Kieda Shigekazu (Ishioka JPX) Nakajima Tadakatsu (Ibaraki JPX) Kuwahara Heikichi (Ibaraki JPX) Sato Motohiro (Ibaraki JPX), Semiconductor cooling device.
  36. Hale,Charles A.; Boyack,Chad E.; Lind,Thomas H.; Hopkins,Kevin R., Slot jet cooler and method of cooling.
  37. Hileman Vince P., Spray cooled module with removable spray cooled sub-module.
  38. Tilton,Charles L.; Turner,Chester L.; Beasley,William J.; Miller,Douglas W.; Gustafson,William C., Spray cooling system for extreme environments.
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