In one aspect, a cooling system is provided for use in computing devices, such as laptops, cell phones, and tablet computers. The cooling system includes a heat spreader coupled to a radiator via a heat pipe having a midline. The heat pipe includes a first end portion longitudinally extending along
In one aspect, a cooling system is provided for use in computing devices, such as laptops, cell phones, and tablet computers. The cooling system includes a heat spreader coupled to a radiator via a heat pipe having a midline. The heat pipe includes a first end portion longitudinally extending along the midline, a second end portion longitudinally extending along the midline, and a mid-portion longitudinally extending along the midline. The mid-portion is located between the first end portion and the second end portion and it has a thickness that is greater than the thicknesses of both the first portion and the second portion thereby reducing the overall thermal resistance of the heat pipe.
대표청구항▼
1. A cooling assembly, comprising: a discrete heat spreader;a radiator;and a heat pipe coupling the heat spreader and the radiator, the heat pipe including:a first end portion connected to the heat spreader, the first end portion having a first substantially uniform thickness,a second end portion co
1. A cooling assembly, comprising: a discrete heat spreader;a radiator;and a heat pipe coupling the heat spreader and the radiator, the heat pipe including:a first end portion connected to the heat spreader, the first end portion having a first substantially uniform thickness,a second end portion connected to the radiator, the second end portion having a second substantially uniform thickness, anda mid-portion located between the first end portion and the second-end portion, the mid-portion having a third substantially uniform thickness that is greater than the first thickness and the second thickness,wherein the first end portion, the second end portion, and the mid-portion have a substantially uniform width. 2. The cooling assembly of claim 1, wherein the first end portion, the second end portion, and the mid-portion are arranged co-linearly. 3. The cooling assembly of claim 1, wherein the first thickness is equal to 1 L mm, the second thickness is equal to 1.3 L mm, and the third thickness is equal to 1.5 L mm, wherein L is an integer greater than or equal to 1. 4. The cooling assembly of claim 1, wherein the heat pipe further includes a casing having a uniform wall thickness and a wick enclosed in the casing. 5. The cooling assembly of claim 1, wherein the heat pipe further includes a casing having a variable wall thickness and a wick enclosed in the casing, wherein the casing has a greater wall thickness in the mid-portion of the heat pipe than in the either one of the first end portion and the second end portion. 6. The cooling assembly of claim 1, wherein: the first end portion is disposed on a surface of the heat spreader;the first end portion extends substantially up to an edge of the heat spreader where the surface ends; andthe mid-portion juts below the edge of the heat spreader starting at a location on the heat pipe where the first end portion ends and the mid-portion begins. 7. The cooling assembly of claim 1, wherein the second thickness of the second end portion is greater than the first thickness of the first end portion. 8. An apparatus comprising: an enclosure having a first face and a second face opposite the first face;a heat-generating component disposed inside the enclosure between the first face and the second face;a radiator disposed inside the enclosure between the first face and the second face;a discrete heat spreader that is in thermal contact with the heat generating component, the heat spreader being disposed between the heat generating component and the top face; anda heat pipe including:a first end portion connected to the heat spreader, the first-end portion being disposed on the heat spreader and between the heat spreader and the first face, the first end portion having a first substantially uniform thickness,a second end portion extending connected to the radiator, and the second end portion having a second substantially uniform thickness, anda mid-portion connecting the first end portion and the second-end portion, the mid-portion having a third substantially uniform thickness that is greater than either one of the first thickness and the second thickness,wherein the first end portion, the second end portion, and the mid-portion have a substantially uniform width. 9. The apparatus of claim 8, wherein the first end portion, the second end portion, and the mid-portion are co-linear. 10. The apparatus of claim 8, wherein the first thickness is equal to 1 L mm, the second thickness is equal to 1.3 L mm, and the third thickness is equal to 1.5 L mm, wherein L is an integer greater than or equal to 1. 11. The apparatus of claim 8, wherein the heat pipe further includes a casing having a uniform wall thickness and a wick enclosed in the casing. 12. The apparatus of claim 8, wherein the heat pipe further includes a casing having a greater wall thickness in the mid-portion of the heat pipe than in the either one of the first end portion and the second end portion. 13. The apparatus of claim 8, wherein: the first end portion is disposed on a surface of the heat spreader;the first end portion extends substantially up to an edge of the heat spreader where the surface ends; andthe mid-portion juts below the edge of the heat spreader starting at a location on the heat pipe where the first end portion ends and the mid-portion begins. 14. The apparatus of claim 8, wherein the second thickness of the second end portion is greater than the first thickness of the first end portion. 15. An apparatus comprising: an enclosure having a first face and a second face opposite the first face;a circuit board disposed between the first face and the second face;a first stack, the first stack comprising: one or more integrated circuits mounted on the circuit board; anda discrete heat spreader disposed on at least some of the one or more integrated circuits;a second stack, comprising a radiator disposed inside the enclosure between the first face and the second face; anda heat pipe disposed between the first face and the second face, the heat pipe including:a first end portion connected to the radiator on top of the second stack;a second end portion connected to the heat spreader on top of the first stack; anda mid-portion connecting the first end portion and the second portion, the mid-portion having a substantially uniform thickness that is greater than a first thickness of the first end portion and a second thickness of the second end portion, between the first stack and the second stack towards a surface of the circuit board. 16. The apparatus of claim 15, wherein the mid-portion extends a same distance away from the surface of the circuit board as the first end portion and the second end portion. 17. The apparatus of claim 15, wherein the mid-portion extends a same distance in a direction parallel to the surface of the circuit board as the first end portion and the second end portion. 18. The apparatus of claim 15, wherein the heat pipe further includes: a casing that defines the first end portion, the second end portion, and the mid-portion, the casing having a uniform wall thickness, anda wick enclosed in the casing.
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이 특허에 인용된 특허 (12)
Kang, Joon, Cooling apparatus and display device having the same.
Furuya, Keizo, Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module.
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