Peel ply, method of surface preparation and bonding composite structures using the same
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B32B-027/12
B32B-005/02
C08J-005/24
B32B-027/38
B32B-037/12
B32B-037/00
C09J-007/04
C08J-005/12
C09J-163/04
출원번호
US-0263700
(2016-09-13)
등록번호
US-10093081
(2018-10-09)
발명자
/ 주소
Zhao, Yiqiang
Kohli, Dalip Kumar
Shah, Kunal Gaurang
출원인 / 주소
Cytec Technology Corp.
대리인 / 주소
Dang, Thi
인용정보
피인용 횟수 :
1인용 특허 :
2
초록▼
A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel
A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.
대표청구항▼
1. A resin-rich peel ply for surface preparation of various composite substrates, comprising a woven fabric impregnated with a curable resin matrix, which is formed from a resin composition comprising: (a) at least one epoxidized novolac resin having epoxy functionality of at least 2;(b) di-function
1. A resin-rich peel ply for surface preparation of various composite substrates, comprising a woven fabric impregnated with a curable resin matrix, which is formed from a resin composition comprising: (a) at least one epoxidized novolac resin having epoxy functionality of at least 2;(b) di-functional epoxy resin selected from diglycidyl ethers of polyhydric phenols;(c) tri-functional epoxy resin selected from triglycidyl ethers of aminophenols;(d) a curing agent; and(e) inorganic filler particles;wherein said peel ply has a resin content of at least 20% by weight based on the total weight of the peel ply, andwherein said woven fabric comprises a plurality of yarns woven in a weaving pattern, said yarns having warp tensile strength of ≥70 lbf/in, fill tensile strength of ≥40 lbf/in, warp linear mass density within the range of 50-250 deniers, and fill linear mass density within the range of 50-250 deniers. 2. The resin-rich peel ply of claim 1, wherein said yarns have warp tensile strength of ≥80 lbf/in, fill tensile strength of ≥50 lbf/in, warp linear mass density within the range of 70-230 deniers, and fill linear mass density within the range of 70-230 deniers. 3. The resin-rich peel ply of claim 1, wherein the remaining thin film of the second resin matrix has a thickness of about 2%-15% of the original thickness of the peel ply prior to removal. 4. The resin-rich peel ply of claim 1, wherein the resin composition comprises at least one epoxidized novolac resin represented by the following structure: wherein n is an integer from 0 to 8, R=H or CH3. 5. The resin-rich peel ply of claim 4, wherein the resin composition further comprises a dicyclopentadiene-containing novolac epoxy resin represented by the following structure: wherein n=an integer from 0 to 7. 6. The resin-rich peel ply of claim 1, wherein said woven fabric has a fabric weight within the range of 50-250 gsm. 7. The resin-rich peel ply of claim 1, wherein said woven fabric has a fabric thickness in the range of 50-250 μm. 8. The resin-rich peel ply of claim 1, wherein the yarns of the woven fabric are made of materials selected from the group consisting of: polyesters, polyethylene, polypropylene, nylon, elastomeric materials, polyaramids, polyimides, polyethyleneimine (PEI), polyoxazole, polybenzimidazole (PBI), polyether ether ketone (PEEK), and glass. 9. The resin-rich peel ply of claim 1, wherein said peel ply has a resin content within the range of 20%-50% by weight based on the total weight of the peel ply. 10. The resin-rich peel ply of claim 1, wherein the curing agent is selected from the group consisting of BF3, BCl3, and complexes thereof. 11. The resin-rich peel ply of claim 1, wherein said resin matrix is formed from a resin composition comprising: epoxy phenol novolac resin having epoxy functionality of at least 2;dicyclopentadiene-containing epoxy novolac resin having epoxy functionality of at least 2;diglycidyl ether of bisphenol A;triglycidyl ether of aminophenol;a curing agent selected from the group consisting of BF3, BCl3, and complexes thereof; andfumed silica. 12. The resin-rich peel ply of claim 11, wherein the novolac resins are making up at least 20% by weight based on the total weight of the composition. 13. A method for surface preparation of various composite substrates comprising: (a) providing a composite substrate comprising reinforcing fibers impregnated with a first resin matrix;(b) placing the resin-rich peel ply of claim 1 into contact with a surface of said composite substrate;(c) co-curing the peel ply and the composite substrate; and(d) removing the peel ply from the surface of the composite substrate such that a thin film of resin from the peel ply remains on the composite substrate's surface to provide a bondable surface capable of co-bonding and secondary bonding with another composite substrate. 14. The method of claim 13, wherein said co-curing is carried out within the temperature range of 250° F. 375° F. (or 121° C.-190° C.). 15. A method of forming a bonded composite structure comprising: (a) providing a first composite substrate comprising reinforcing fibers impregnated with a first resin matrix;(b) providing a second composite substrate comprising reinforcing fibers impregnated with a second resin matrix;(c) placing the resin-rich peel ply of claim 1 into contact with a surface of the first composite substrate;(d) co-curing the peel ply and the first composite substrate at a temperature greater than 230° F. (110° C.);(e) removing the peel ply from the surface of the composite substrate such that a thin film of resin from the peel ply remains on the composite substrate's surface to provide a bondable surface, but no fibrous material from the woven fabric remains on the same surface;(f) applying an adhesive film on either the bondable surface of the first substrate or a surface of the second substrate;(g) placing the bondable surface of the first composite substrate into contact with a surface of the second composite substrate with the adhesive film there between; and(h) curing to bond the first and second substrates.
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이 특허에 인용된 특허 (2)
Thornton Peter B. (Bronxville NY) Cone Stanley H. (Hornell NY) Booz George W. (Hornell NY), Peel ply material.
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