To prevent cracks on a sealing glass or a substrate in a LED package in which a light-emitting device is sealed with a sealing glass. The LED package comprises a substrate, a LED mounted on the substrate, and a sealing glass for sealing a LED formed on the substrate. A wiring pattern being connected
To prevent cracks on a sealing glass or a substrate in a LED package in which a light-emitting device is sealed with a sealing glass. The LED package comprises a substrate, a LED mounted on the substrate, and a sealing glass for sealing a LED formed on the substrate. A wiring pattern being connected to an electrode of the LED is formed on the surface of the substrate. A back electrode pattern is formed on the rear surface of the substrate. A columnar via is formed in the substrate. Thus, the wiring pattern on the surface of the substrate and the back electrode pattern on the rear surface of the substrate are electrically connected. A softening point of the substrate is set higher than softening point of the sealing glass.
대표청구항▼
1. A LED package comprising: a substrate having a flat front surface;a light-emitting device comprising a Group III nitride semiconductor and emitting a blue light mounted on the front surface of the substrate;a sealing glass formed on the entire front surface of the substrate for sealing entire sur
1. A LED package comprising: a substrate having a flat front surface;a light-emitting device comprising a Group III nitride semiconductor and emitting a blue light mounted on the front surface of the substrate;a sealing glass formed on the entire front surface of the substrate for sealing entire surfaces of the light-emitting device;a wiring pattern being formed on the front surface of the substrate on which the light-emitting device is mounted and being connected to electrodes of the light-emitting device;a via passing through the substrate and being connected to the wiring pattern; anda back electrode pattern being formed on a rear surface opposite to the front surface of the substrate and being connected to the wiring pattern through the via,wherein the substrate is made of glass, and the linear expansion coefficient of the substrate is 0.9 times to 1.1 times the linear expansion coefficient of the sealing glass,wherein the softening point of the substrate is higher than 600° C. and the softening point of the sealing glass is 200° C. to 500° C.,wherein the yellow fluorescent paints are mixed in the substrate and the sealing glass, a white light is emitted from both the top surface of the light-emitting device and the rear surface of the substrate so that the white light is emitted in all directions, andwherein the sealing glass covers and seals the light-emitting device and has a rectangular parallelepiped shape, and side surfaces thereof are aligned with side surfaces of the substrate so that the substrate and the sealing glass are combined into one shape. 2. The LED package according to claim 1, wherein a part on the back surface of the substrate on which the back electrode pattern is not formed is coated with at least one member selected from a group consisting of a fluorescent paint, white pigment and reflection metal. 3. The LED package according to claim 1, wherein the substrate is made of at least one glass material selected from a group consisting of zinc oxide based glass, phosphoric acid based glass, boric acid based glass, fluorine based glass, Bi2O3 based glass, Nb2O5 based glass, GeO2 based glass, Ga2O3 based glass, Y2O3 based glass, La2O3 based glass, Gd2O3 based glass, and Ta2O5 based glass. 4. The LED package according to claim 1, wherein the sealing glass is made of at least one glass material selected from a group consisting of ZnO based glass, phosphoric acid based glass, fluorine based glass, Bi2O3 based glass, Nb2O5 based glass, GeO2 based glass, Ga2O3 based glass, Y2O3 based glass, La2O3 based glass, Gd2O3 based glass, and Ta2O5 based glass. 5. The LED package according to claim 1, wherein the linear expansion coefficients of the substrate and the sealing glass are 4.5 ppm/° C. to 5.5 ppm/° C., respectively.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (1)
Aitken,Bruce G.; Carberry,Joel P.; DeMartino,Steven E.; Hagy,Henry E.; Lamberson,Lisa A.; Miller, II,Richard J.; Morena,Robert; Schroeder, III,Joseph F.; Streltsov,Alexander; Widjaja,Sujanto, Glass package that is hermetically sealed with a frit and method of fabrication.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.