A semiconductor light emitting device includes a light-transmissive support having a first surface including a first region and a second region surrounding the first region, and a second surface opposing the first surface, and including a wavelength conversion material, a semiconductor stack dispose
A semiconductor light emitting device includes a light-transmissive support having a first surface including a first region and a second region surrounding the first region, and a second surface opposing the first surface, and including a wavelength conversion material, a semiconductor stack disposed above the first region of the first surface of the light-transmissive support, and including first and second conductivity-type semiconductor layers and an active layer disposed therebetween, a light-transmitting bonding layer disposed between the light-transmissive support and the semiconductor stack, a light blocking film disposed above the second region of the light-transmissive support to surround the semiconductor stack, and first and second electrodes respectively disposed on portions of the first and second conductivity-type semiconductor layers.
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1. A semiconductor light emitting device comprising: a light-transmissive support having a first surface including a first region and a second region surrounding the first region, and a second surface opposing the first surface, the light-transmissive support including a wavelength conversion materi
1. A semiconductor light emitting device comprising: a light-transmissive support having a first surface including a first region and a second region surrounding the first region, and a second surface opposing the first surface, the light-transmissive support including a wavelength conversion material;a semiconductor stack on the first region of the first surface of the light-transmissive support, and including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer between the first and second conductivity-type semiconductor layers;a light-transmitting bonding layer between the light-transmissive support and the semiconductor stack;a light blocking film on the second region of the light-transmissive support and surrounding the semiconductor stack;a first electrode and a second electrode respectively on a portion of the first conductivity-type semiconductor layer and a portion of the second conductivity-type semiconductor layer;an insulating layer covering the semiconductor stack to have first and second openings defining the portions of the first and second conductivity-type semiconductor layers, respectively, and extending above the second region of the light-transmissive support; wherein:the insulating layer has a third opening on the second region of the light-transmissive support and surrounding the semiconductor stack;the light blocking film extends from the third opening of the insulating layer along a surface of the insulating layer; andthe light blocking film is in contact with the light-transmitting bonding layer through the third opening. 2. The semiconductor light emitting device of claim 1, wherein the light-transmissive support comprises a glass substrate including the wavelength conversion material. 3. The semiconductor light emitting device of claim 1, wherein the light-transmissive support comprises a ceramic substrate including a phosphor. 4. The semiconductor light emitting device of claim 1, wherein the light blocking film comprises a same material as a material of a portion of the first and second electrodes. 5. The semiconductor light emitting device of claim 1, wherein the wavelength conversion material of the light-transmissive support is a first wavelength conversion material configured to convert a portion of light generated in the active layer into light of a first wavelength, and the light-transmitting bonding layer includes a second wavelength conversion material configured to convert a portion of light generated in the active layer into light of a second wavelength, the second wavelength being different from the first wavelength. 6. The semiconductor light emitting device of claim 1, wherein the light-transmitting bonding layer comprises spin-on-glass. 7. The semiconductor light emitting device of claim 1, wherein the semiconductor stack comprises a concave-convex portion on a surface of the semiconductor stack contacting the light-transmitting bonding layer. 8. A semiconductor light emitting device comprising: a light-transmissive support having a first surface including a first region and a second region surrounding the first region, and a second surface opposing the first surface, the light-transmissive support including a bonding material containing a wavelength conversion material;a semiconductor stack bonded to the first region of the first surface of the light-transmissive support, and including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer between the first and second conductivity-type semiconductor layers;a light blocking film on the second region of the light-transmissive support and surrounding the semiconductor stack; anda first electrode and a second electrode respectively on a portion of the first conductivity-type semiconductor layer and a portion of the second conductivity-type semiconductor layer. 9. The semiconductor light emitting device of claim 8, wherein the bonding material of the light-transmissive support comprises spin-on glass. 10. The semiconductor light emitting device of claim 8, further comprising an insulating layer covering the semiconductor stack and extending on the second region of the light-transmissive support, and having an opening on the second region of the light-transmissive support surrounding the semiconductor stack, wherein the light blocking film extends from an opening of the insulating layer along a surface of the insulating layer. 11. The semiconductor light emitting device of claim 10, wherein the light blocking film is in contact with the light-transmissive support through the opening. 12. The semiconductor light emitting device of claim 8, wherein the first electrode and the second electrode include a plurality of electrode layers, and the light blocking film includes a same material as a material of at least one of the plurality of electrode layers. 13. A semiconductor light emitting device comprising: a light-transmissive substrate including a wavelength conversion material;a semiconductor stack on the light-transmissive substrate and including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer between the first and second conductivity-type semiconductor layers;a light-transmitting bonding layer configured to bond the light-transmissive substrate with the semiconductor stack;a light blocking film on the light-transmissive substrate and encompassing the semiconductor stacks;a first electrode and a second electrode respectively on a portion of the first conductivity-type semiconductor layer and a portion of the second conductivity-type semiconductor layer; andan insulating layer covering the semiconductor stack to have first and second openings defining the portions of the first and second conductivity-type semiconductor layers, respectively, and extending above the light-transmissive substrate;wherein:the insulating layer has a third opening on the light-transmissive substrate and surrounding the semiconductor stack;the light blocking film extends from the third opening of the insulating layer along a surface of the insulating layer; andthe light blocking film includes a same material as a material of a portion of the first and second electrodes. 14. The semiconductor light emitting device of claim 13, wherein the light-transmissive substrate has a first surface including a first region and a second region surrounding the first region, and a second surface opposing the first surface. 15. The semiconductor light emitting device of claim 13, wherein the wavelength conversion material comprises phosphor.
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