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특허 상세정보

Multilayer riblet applique and methods of producing the same

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B29C-039/14    B29C-039/16    B29C-065/78    B32B-037/10    B29C-039/18    B29C-039/38    B29C-041/30    B29C-041/32    B29C-041/46    B32B-027/28    B32B-003/30    B64C-021/10    B32B-037/20    B29K-101/12    B29L-031/30    B32B-037/24    B29L-007/00    B29L-031/00    B32B-037/00    B29L-009/00    B32B-037/02   
출원번호 US-0205460 (2016-07-08)
등록번호 US-10105877 (2018-10-23)
발명자 / 주소
  • Rawlings, Diane C.
  • Keough, Bruce K.
  • Olli, Larry K.
  • Burg, Alan G.
  • Kestner, James M.
  • Granger, George Michael
  • McGarvey, James Charles
출원인 / 주소
  • The Boeing Company
대리인 / 주소
    Hanley, Flight and Zimmerman, LLC
인용정보 피인용 횟수 : 0  인용 특허 : 80
초록

Multilayer riblet applique and methods of producing the same are described herein. One disclosed example method includes applying a first high elongation polymer material to a web tool, where the web tool is to be provided from a first roll, and heating, via a first heating process, the first high elongation polymer material. The disclosed example method also includes applying a second high elongation polymer material to the first high elongation polymer material, and heating, via a second heating process, the second high elongation polymer material. The...

대표
청구항

1. A method of producing a multilayered riblet structure comprising: applying a first high elongation polymer material to a web tool, the web tool provided from a first roll;heating, via a first heating process associated with a first inline oven, the first high elongation polymer material as the first high elongation polymer material passes through an interior length of the first inline oven to cure the first high elongation polymer material;applying a second high elongation polymer material to the first high elongation polymer material;heating, via a s...

인용문헌 (80)

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  32. Rawlings, Diane C.; Bauman, Scott, Electrical connects for charge distribution applique.
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  39. Rawlings, Diane C., Large area circuitry using appliqués.
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