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Carbon nanoparticle infused optical mount 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G02B-027/01
  • B29D-012/02
  • F21V-008/00
출원번호 US-0601097 (2015-01-20)
등록번호 US-10108017 (2018-10-23)
발명자 / 주소
  • Nikkhoo, Michael
  • Hurbi, Erin
출원인 / 주소
  • Microsoft Technology Licensing, LLC
대리인 / 주소
    Rainier Patents, P.S.
인용정보 피인용 횟수 : 0  인용 특허 : 35

초록

A passive thermal heat-pipe material comprising an optical mounting structure including heat producing electronic components is provided. Each structural component of the optical mounting structure may be at least partially comprised of a polymer including a plurality of carbon nanoparticles. In a f

대표청구항

1. A wearable device, comprising: a first portion of a frame configured to be worn over eyes of a wearer and having an optical mounting structure, the first portion including a heat producing electronic component within an interior of the first portion;temple arms extending away from the first porti

이 특허에 인용된 특허 (35)

  1. Babcock, Raymond Floyd; Butterbaugh, Matthew Allen; Kang, Sukhvinder Singh, Apparatus and method for cooling a wearable computer.
  2. Montgomery, Stephen W.; Holalkere, Ven R., Carbon nanotube thermal interface structures.
  3. Spitzer Mark Bradley ; Jacobson Joseph, Compact display system.
  4. Benson David K. (Golden CO) Potter Thomas F. (Denver CO), Compact vacuum insulation.
  5. Grapes Thomas F. (Columbia MD) Fertig Timothy M. (Pasadena MD) Schroeder Mark S. (Severna Park MD), Composite heat transfer means.
  6. Ali M. Akbar ; Peterson Carl W. ; McNab Kevin M., Electronic structure having an embedded pyrolytic graphite heat sink material.
  7. Thomas, C. Douglass; Tong, Peter P., Eyeglasses for wireless communications.
  8. Hoover Ronald E. ; Hutchins Robert S. ; Marble Stuart J. ; Saito Clark A. ; Valle Manuel B., Flexible graphite fiber thermal shunt.
  9. Nikkhoo, Michael; Heirich, Doug; Riccomini, Roy; Ye, Maosheng; Beerman, Michael; Taylor, Joseph Daniel, Flexible thermal conduit for an electronic device.
  10. Flaks, Jason; Bar-Zeev, Avi; Margolis, Jeffrey Neil; Miles, Chris; Kipman, Alex Aben-Athar; Fuller, Andrew John; Crocco, Jr., Bob, Fusing virtual content into real content.
  11. Tamaoki, Mitsuru; Kawamura, Norihiro; Kubo, Kazuhiko; Funaba, Masashi, Graphite complex and manufacturing method thereof.
  12. Hasegawa, Tsuyoshi, Heat dissipation plate and semiconductor device.
  13. Getz, Jr., George; Burkett, Thomas W., Heat sink made from longer and shorter graphite sheets.
  14. Michael Z. Eckblad ; Pardeep K. Bhatti, Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader.
  15. Katayama, Masako; Fujiwara, Hidemichi, Heat transfer film, semiconductor device, and electronic apparatus.
  16. Ozaki,Toyokazu; Taomoto,Akira; Hashimoto,Mitsuru; Deguchi,Masahiro; Shibata,Motoshi, High thermal conductive element, method for manufacturing same, and heat radiating system.
  17. Ozaki,Toyokazu; Taomoto,Akira; Hashimoto,Mitsuru; Deguchi,Masahiro; Shibata,Motoshi, High thermal conductivite element, method for manufacturing same, and heat radiating system.
  18. Rappoport, Benjamin; Wright, Derek, Laminated roll of sealed graphite pouches and methods for making the same.
  19. Norley, Julian; Brady, John Joseph; Getz, George; Klug, Jeremy, Laminates prepared from impregnated flexible graphite sheets.
  20. Arai, Keita; Shiba, Daisuke; Suganuma, Masashi; Kato, Atsushi, Method for producing carbon nanocomposite metal material and method for producing metal article molded therefrom.
  21. Leibowitz Joseph D. (Culver City CA), Method of fabricating multilayer printed circuit board structure.
  22. Brookes Ronald R. (303 Cordelia Ave. SW. North Canton OH 44720), Method of laminating graphite sheets to a metal substrate.
  23. Ali, Mir Akbar; Peterson, Carl W., Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly.
  24. Toyosato Kazuyuki,JPX ; Jenkins Michael D. ; Newman Edward G., Mobile computer.
  25. Leibowitz Joseph D. (Culver City CA), Multilayer printed circuit board structure.
  26. Kato, Shigeru; Isagi, Kazuou; Otsuki, Masaki; Chiaki, Kenzo, Output device and wearable display.
  27. Warner, Charles C.; Foster, Scott A.; Evans, Stewart W.; Krivoy, Raul; Burke, Michael W.; Rae, John R., Portable radiometry and imaging apparatus.
  28. Fujiwara, Kikuo; Tozawa, Masaaki; Shives, Gary D.; Norley, Julian; Reynolds, III, Robert Anderson, Sandwiched thermal solution.
  29. Hada, Sayuri; Sueoka, Kuniaki; Taira, Yoichi, Sheet having high thermal conductivity and flexibility.
  30. Ma, Shuwei, Spark plug electrode with nanocarbon enhanced copper core.
  31. Hartmann, Mark; Roda, Greg, Systems structures and materials for electronic device cooling.
  32. Fujiwara Norio,JPX ; Akiba Yasuhiro,JPX ; Watanabe Tetsuyuki,JPX ; Nishiki Naomi,JPX, Thermal conductive unit and thermal connection structure using the same.
  33. Li, Yun; Grabb, Mark Lewis; Hershey, John Erik; Zhang, Jian; Xia, Hua, Thermal management article and method.
  34. Zhang, Jian; Tonapi, Sandeep Shrikant; Mills, Ryan Christopher; Gowda, Arun Virupaksha, Thermal management system and associated method.
  35. Zhang,Jian; Tonapi,Sandeep Shrikant; Mills,Ryan Christopher; Gowda,Arun Virupaksha, Thermal transport structure and associated method.
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