초록

A device for the exact manipulation of material, especially of organic material, includes a pulsed laser system with a radiation source, said radiation source being a cavity-dumped fs oscillator.

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1. A device for precise machining of a material, comprising: a pulsed laser system including: a beam source having a cavity-dumped fs oscillator configured to emit a pulsed laser beam;a beam focusing apparatus configured to focus the pulsed laser beam to a laser focus spot within the material; anda

1. A device for precise machining of a material, comprising: a pulsed laser system including: a beam source having a cavity-dumped fs oscillator configured to emit a pulsed laser beam;a beam focusing apparatus configured to focus the pulsed laser beam to a laser focus spot within the material; anda beam deflection apparatus configured to deflect the pulsed laser beam so as to move the laser focus spot to different points within the material;wherein the pulsed laser beam emitted by the cavity-dumped fs oscillator includes a plurality of laser pulses,wherein the plurality of laser pulses of the pulsed laser beam emitted by the cavity-dumped fs oscillator are configured to destroy the cohesion of the material at the laser focus spot, andwherein the beam deflection apparatus and the beam focusing apparatus are configured to move, according to a scan algorithm, the laser focus spot relatively more quickly in a first of three scan dimensions than in the other two of the three scan dimensions by rotating optical elements in the deflection apparatus. 2. The device as recited in claim 1, wherein the material is an organic material. 3. The device as recited in claim 1, wherein one or more of the beam focusing apparatus and the beam deflection apparatus is programmable. 4. The device as recited in claim 1, further comprising a holding device configured to one of position and fix the material. 5. The device as recited in claim 1, wherein the plurality of laser pulses of the pulsed laser beam emitted by the cavity-dumped fs oscillator have a pulse energy of 100 nJ to 100 μJ. 6. The device as recited in claim 5, wherein the pulse energy is in the range of 500 nJ to 5 μJ. 7. The device as recited in claim 1, wherein the plurality of laser pulses of the pulsed laser beam emitted by the cavity-dumped fs oscillator have repetition rates from 10 kHz to 10 MHz. 8. The device as recited in claim 1, wherein the pulsed laser system is configured to apply the pulsed laser beam emitted by the cavity-dumped fs oscillator of the beam source to the material in a geometrically predeterminable form and in a chronologically predeterminable course. 9. The device as recited in claim 8, wherein a repetition rate of the plurality of laser pulses of the pulsed laser beam emitted by the cavity-dumped fs oscillator is changeable during application of the pulsed laser beam emitted by the cavity-dumped fs oscillator to the material. 10. The device as recited in claim 1, wherein the material includes the eye of a human patient. 11. The device as recited in claim 1, wherein the cavity-dumped fs oscillator is a directly diode pumped fs oscillator. 12. The device as recited in claim 11, wherein the directly diode pumped fs oscillator includes a semiconductor saturable absorber mirror (SESAM). 13. The device as recited in claim 1, wherein the plurality of laser pulses of the pulsed laser beam emitted by the cavity-dumped fs oscillator are decoupled from the cavity-dumped fs oscillator by an electrooptical deflector or an acoustooptical deflector. 14. The device as recited in claim 1, wherein the plurality of laser pulses of the pulsed laser beam emitted by the cavity dumped fs oscillator are emitted at a preselected repetition rate preset according to a path speed of the laser focus spot such that individual laser pulses are triggered as soon as the laser focus spot reaches a point within the material. 15. The device as recited in claim 1, wherein the beam source is configured to initiate individual ones of the plurality of laser pulses of the pulsed laser beam when the beam deflection apparatus reaches one of a plurality of predetermined positions. 16. The device as recited in claim 1, wherein the laser focus spot has a diameter in the micrometer range. 17. The device as recited in claim 1, wherein the first of the three scan dimensions is an arc length and the other two of the three scan dimensions are a radius and a focus depth. 18. A method for applying a laser beam to a material, the method comprising: emitting, by a cavity-dumped fs oscillator beam source, a pulsed laser beam including a plurality of fs laser pulses;focusing the pulsed laser beam to a laser focus spot within the material;deflecting the pulsed laser beam so as to move the laser focus spot to different points within the material; anddestroying, by the plurality of laser pulses of the pulsed laser beam emitted by the cavity-dumped fs oscillator, the cohesion of the material at the laser focus spot,wherein the laser focus spot is moved, according to a scan algorithm, relatively more quickly in a first of three scan dimensions than in the other two of the three scan dimensions by rotating optical elements in the deflection apparatus. 19. The method as recited in claim 18, wherein the material is an organic material. 20. The method as recited in claim 19, further comprising performing refractive surgery using the laser beam. 21. The method as recited in claim 18, further comprising modifying a repetition rate of the fs pulses in relation to a spot pattern produced on the material. 22. The method as recited in claim 18, wherein the destroying, by the plurality of laser pulses of the pulsed laser beam emitted by the cavity-dumped fs oscillator, the cohesion of the material at the laser focus spot is accompanied by a local evaporation of the material at the laser focus spot. 23. A device for precise machining of a material, comprising: a pulsed laser system including: a beam source having an fs oscillator configured to emit a pulsed laser beam;a beam focusing apparatus configured to focus the pulsed laser beam to a laser focus spot within the material; anda beam deflection apparatus configured to deflect the pulsed laser beam so as to move the laser focus spot to different points within the material;wherein the pulsed laser beam emitted by the fs oscillator includes a plurality of laser pulses,wherein the plurality of laser pulses of the pulsed laser beam emitted by the fs oscillator are configured to destroy the cohesion of the material at the laser focus spot, andwherein the beam deflection apparatus and the beam focusing apparatus are configured to move, according to a scan algorithm, the laser focus spot relatively more quickly in a first of three scan dimensions than in the other two of the three scan dimensions by rotating optical elements in the deflection apparatus.